Analysis and design methodology for Planar Transformer with low self-capacitance used in high voltage flyback charging circuit

TLDR: The Planar Transformer (PT) as discussed by the authors can be implemented with windings as tracks in Printed Circuit Boards (PCB) each layer is insulated by the FR4 material which aids better insulation.

Abstract: In high voltage (HV) flyback charging circuits, the importance of transformer parasitics holds a significant part in the overall system parasitics. The HV transformers have a larger number of turns on the secondary side that leads to higher self-capacitance which is inevitable. The conventional wire-wound transformer (CWT) has limitation over the design with larger self-capacitance including increased size and volume. For capacitive load in flyback charging circuit these self-capacitances on the secondary side gets added with device capacitances and dominates the load. For such applications the requirement is to have a transformer with minimum self-capacitances and low profile. In order to achieve the above requirements Planar Transformer (PT) design can be implemented with windings as tracks in Printed Circuit Boards (PCB) each layer is insulated by the FR4 material which aids better insulation. Finite Element Model (FEM) has been developed to obtain the self-capacitance in between the layers for larger turns on the secondary side. The modelled hardware prototype of the Planar Transformer has been characterised for open circuit and short circuit test using Frequency Response Analyser (FRA). The results obtained from FEM and FRA are compared and presented.