Journal ArticleDOI
Broadly manipulating the interfacial thermal energy transport across the Si/4H-SiC interfaces via nanopatterns
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In this paper , the thermal conductance of Si/4H-SiC interfaces can be modulated by confining nanopatterns with a thickness on the order of nanometers, i.e., smaller than 30 nm.About:
This article is published in International Journal of Heat and Mass Transfer.The article was published on 2022-05-01. It has received 12 citations till now. The article focuses on the topics: Phonon & Thermal conductivity.read more
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Phonon thermal transport and its tunability in GaN for near-junction thermal management of electronics: A review
Dao-Sheng Tang,Bing-Yang Cao +1 more
TL;DR: In this article , a comprehensive review of phonon thermal transport in GaN and GaN HEMTs is presented, including non-equilibrium transport of electrons and phonons in the heat generation process and thermal conductivity, heat spreading, and interfacial thermal transport.
Journal ArticleDOI
Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures
Guanghua Wang,Yanguang Zhou +1 more
TL;DR: In this paper , the authors investigated the thermal dissipation performance of high-power semiconductor devices with high thermal conductivity and applied power density to improve the heat dissipation ability.
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Temperature adjustable thermal conductivity and thermal contact resistance for liquid metal/paraffin/olefin block copolymer interface material
TL;DR: In this paper , a low melting-point alloy/paraffin/olefin block copolymer thermal interface material with adjustable thermal conductivity was designed and prepared, and the heat dissipation effect of composites was evaluated by infrared thermal imager.
Journal ArticleDOI
The interfacial thermal conductance spectrum in nonequilibrium molecular dynamics simulations considering anharmonicity, asymmetry and quantum effects.
Yixin Xu,Lina Yang,Yanguang Zhou +2 more
TL;DR: In this paper , the authors investigated the ITC spectrum across an ideal interface, i.e., the argon/heavy argon interface, and found that ITC increases gradually with temperature as more phonons and anharmonic scattering channels are activated.
Journal ArticleDOI
The interfacial thermal conductance spectrum in nonequilibrium molecular dynamics simulations considering anharmonicity, asymmetry and quantum effects
Yanguang Zhou,Celal Hakan Kan +1 more
TL;DR: In this paper , the authors investigated the ITC spectrum across an ideal interface, i.e., the argon/heavy argon interface, and found that ITC increases gradually with temperature as more phonons and anharmonic scattering channels are activated.
References
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Journal ArticleDOI
Fast parallel algorithms for short-range molecular dynamics
TL;DR: In this article, three parallel algorithms for classical molecular dynamics are presented, which can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors.
Fast parallel algorithms for short-range molecular dynamics
TL;DR: Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems.
Journal ArticleDOI
Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool
TL;DR: The Open Visualization Tool (OVITO) as discussed by the authors is a 3D visualization software designed for post-processing atomistic data obtained from molecular dynamics or Monte Carlo simulations, which is written in object-oriented C++, controllable via Python scripts and easily extendable through a plug-in interface.
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First principles phonon calculations in materials science
Atsushi Togo,Isao Tanaka +1 more
TL;DR: In this paper, the authors demonstrate phonon properties with fundamental equations and show examples how the phonon calculations are applied in materials science, and demonstrate the importance of first principles phonon calculation in dynamical behaviors and thermal properties.
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Emerging challenges and materials for thermal management of electronics
Arden L. Moore,Li Shi +1 more
TL;DR: In this paper, a number of cubic crystals, two-dimensional layered materials, nanostructure networks and composites, molecular layers and surface functionalization, and aligned polymer structures are examined for potential applications as heat spreading layers and substrates, thermal interface materials, and underfill materials in future-generation electronics.