Proceedings ArticleDOI
Comprehensive Model for Humidity Testing Correlation
D. Stewart Peck
- pp 44-50
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TLDR
In this paper, an acceleration formula is described which provides direct extrapolation from test results in autoclave tests at up to at least 140C to low-humidity down to below 30XRH.Abstract:
This paper reviews all published life in humidity conditions vs life at 85C/85% RH for epoxy packages; 61 data points are used. An acceleration formula is described which provides direct extrapolation from test results in autoclave tests at up to at least 140C to low-humidity down to below 30XRH. This formula compares favorably with previously-published formulae. The possible effect of the Tg of the epoxy is recognized, and other high-temperature and low-humidity effects are disclosed. Recommendat ions are made for future tests, replacing 1000 hours at 85C/85%RH with a 20-hour test at 140C/100%RH, to reduce test time and increase test usefulness.read more
Citations
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Journal ArticleDOI
A Review of Accelerated Test Models
TL;DR: This paper provides a review of many of the AT models that have been use successfully in this area and makes important contributions in the development of appropriate stochastic models for AT data.
Proceedings ArticleDOI
Reliability of various size oxide aperture VCSELs
TL;DR: In this article, the reliability of 850 nm oxide aperture vertical cavity surface emitting laser (VCSEL) reliability is investigated and the reliability effect of aperture diameter is discussed, showing that larger apertures generally exhibit greater reliability.
Journal ArticleDOI
Planning accelerated life tests with two or more experimental factors
TL;DR: Methods and guidelines for planning two-factor accelerated life test experiments for models in which there is no interaction between the factors are described.
Journal ArticleDOI
Recent humidity accelerations, a base for testing standards
Örjan Hallberg,D. Stewart Peck +1 more
TL;DR: In this paper, a procedure for formal qualification of moisture life for modem components is proposed, and the observed ratio, R o, of 1m (T/RH) to 1m(85/85) was then comparcd with the calculated ratio, Re, according to the for mula being investigated.
References
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Proceedings ArticleDOI
Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis
TL;DR: In this article, the surface conductivity of thermal SiO2 was measured as a function of relative humidity and temperature, and the authors investigated the factors which determine the rate of electrolytic corrosion of the Al metallization in plastic-encapsulated ICs.
Proceedings ArticleDOI
Temperature-Humidity Acceleration of Metal-Electrolysis Failure in Semiconductor Devices
D. S. Peck,C. H. Zierdt +1 more
Proceedings ArticleDOI
The Influence of Plastic Encapsulants and Passivation Layers on the Corrosion of Thin Aluminium Films Subjected to Humidity Stress
S P Sim,R W Lawson +1 more
TL;DR: In this paper, the authors have shown that the corrosion rate is determined by the surface conductivity of the water layer that forms on the die surface and the impurities that enter the water film from the plastic or passivation layer and the applied bias.
Proceedings ArticleDOI
The Accelerated Testing of Plastic Encapsulated Semiconductor Components
TL;DR: In this article, the authors used the conductivity of an aqueous extract of epoxy resins and silicone resins to predict the reliability of plastic encapsulated bipolar semiconductor components.
Proceedings ArticleDOI
Rapid Assessment of the Humidity Dependence of IC Failure Modes by Use of HAST
TL;DR: In this paper, a three-phase study was conducted to assess first order moisture effects; e.g., the role of relative humidity (R.H.) and vapor pressure in the HAST environment.
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