Journal ArticleDOI
Convective heat transfer of Cu–water nanofluid in a cylindrical microchannel heat sink
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TLDR
In this article, the thermal performance of a cylindrical microchannel heat sink was experimentally investigated for potential cooling of electronic devices, which comprised of 86 rectangular microchannels with hydraulic diameter of 560μm assembled into a cylinrical geometry and a number of thermocouples were embedded along the microchannel to provide local temperature measurements.About:
This article is published in Energy Conversion and Management.The article was published on 2015-09-01. It has received 121 citations till now. The article focuses on the topics: Micro heat exchanger & Microchannel.read more
Citations
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Journal ArticleDOI
Electronics cooling with nanofluids: A critical review
Mehdi Bahiraei,Saeed Heshmatian +1 more
TL;DR: In this article, the authors reviewed the use of nanofluids in electronics cooling considering several aspects such as liquid block type, numerical approach, nanoparticle material, energy consumption, and second law of thermodynamics.
Journal ArticleDOI
On the nanofluids applications in microchannels: A comprehensive review
TL;DR: A comprehensive assessment of nanofluids' applications in various microchannel geometries and shows ever-increasing importance of nan ofluids applications in microchannels.
Journal ArticleDOI
Review on nanofluids characterization, heat transfer characteristics and applications
TL;DR: A review of the most recent studies on nanofluid in the literatures is presented in this article, where the authors take into account the contributions of different researchers available in open literature on different aspects of Nanofluids such as thermal conductivity, viscosity, experimental, numerical studies on heat transfer performances and applications.
Journal ArticleDOI
A modified two-phase mixture model of nanofluid flow and heat transfer in a 3-D curved microtube
Omid Ali Akbari,Mohammad Reza Safaei,Marjan Goodarzi,Noreen Sher Akbar,Majid Zarringhalam,Gholamreza Ahmadi Sheikh Shabani,Mahidzal Dahari +6 more
TL;DR: In this paper, the authors numerically investigated the laminar mixed-convection heat transfer of different water-copper nanofluids inside a microtube with curvature angle of 90°, using a finite volume method.
Journal ArticleDOI
Cooling of electronic devices: Nanofluids contribution
TL;DR: In this article, the application of a new generation of heat transfer fluids, nanofluids, to electronic devices is analyzed, which could be one of the key elements that could give an important impulse to further miniaturization of electronic devices and at the same time increase their energy efficiency.
References
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Journal ArticleDOI
Describing the Uncertainties in Experimental Results
TL;DR: The material presented in this paper covers the method of describing the uncertainties in an engineering experiment and the necessary background material, as well as a technique for numerically executing uncertainty analyses when computerized data interpretation is involved.
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Heat transfer enhancement of nanofluids
Yimin Xuan,Qiang Li +1 more
TL;DR: In this article, the authors present a procedure for preparing a nanofluid which is a suspension consisting of nanophase powders and a base liquid, and their TEM photographs are given to illustrate the stability and evenness of suspension.
Journal ArticleDOI
The Role of Interfacial Layers in the Enhanced Thermal Conductivity of Nanofluids: A Renovated Maxwell Model
Wenhua Yu,S.U.S. Choi +1 more
TL;DR: In this paper, the authors modified the Maxwell equation for the effective thermal conductivity of solid/liquid suspensions to include the effect of this ordered nanolayer, which has been shown to have a major impact on nanofluid thermal conductivities when the particle diameter is less than 10 nm.
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