Journal ArticleDOI
Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials
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TLDR
In this article, a phase sensitive transient thermo-reflectance technique was used to measure the thermal conductance of the two interfaces on each side of a vertically aligned carbon nanotube array as well as the CNT array itself.Abstract:
Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance ~105W/m2K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to ~106W/m2K making it attractive as a TIMread more
Citations
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Proceedings ArticleDOI
Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films
Amy Marconnet,Munekazu Motoyama,Michael T. Barako,Yuan Gao,Scott Pozder,Burt Fowler,K. Ramakrishna,Glenn Mortland,Mehdi Asheghi,Kenneth E. Goodson +9 more
TL;DR: In this paper, the authors proposed to electroplate 1 to 20 µm-thick continuous copper films directly on the carbon nanotube array and measured the thermal conductivity of CNT arrays after electroplating using cross-sectional infrared microscopy.
Dissertation
Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device
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Thermal Transport in Tin-Capped Vertically Aligned Carbon Nanotube Composites for Thermal Energy Management
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References
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Journal ArticleDOI
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Journal ArticleDOI
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