Journal ArticleDOI
Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials
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TLDR
In this article, a phase sensitive transient thermo-reflectance technique was used to measure the thermal conductance of the two interfaces on each side of a vertically aligned carbon nanotube array as well as the CNT array itself.Abstract:
Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance ~105W/m2K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to ~106W/m2K making it attractive as a TIMread more
Citations
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Journal ArticleDOI
Thermal resistance measurement of 3D graphene foam/polymer composite by laser flash analysis
TL;DR: In this article, three-dimensional graphene foam (GF)/polydimethylsiloxane (PDMS) composite was prepared and its thermal resistance in practical application was measured by laser flash analysis (LFA).
Journal ArticleDOI
Corrugated carbon nanotube microstructures with geometrically tunable compliance.
Michael De Volder,Michael De Volder,Michael De Volder,Sameh Tawfick,Sei Jin Park,A. John Hart +5 more
TL;DR: This work demonstrates scalable fabrication of 3D corrugated carbon nanotube (CNT) microstructures, via an iterative sequence of vertically aligned CNT growth and capillary self-assembly, and shows these structures can be used as out-of-plane microsprings with compliance determined by the wall thickness and number of folds.
Journal ArticleDOI
Materials made of carbon nanotubes. The carbon nanotube forest
TL;DR: In this paper, the morphology, volume and surface density of CNT forest, methods of its synthesis and modification, as well as the properties and potential fields of application are considered.
Journal ArticleDOI
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Ronald J. Warzoha,Adam A. Wilson,Brian F. Donovan,Nazli Donmezer,Ashutosh Giri,Patrick E. Hopkins,Sukwon Choi,Darshan G. Pahinkar,Jingjing Shi,Samuel Graham,Zhiting Tian,Laura B. Ruppalt +11 more
TL;DR: In this paper, the authors highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices, including those mechanisms that impact thermal transport through: substrates, interfaces and two-dimensional materials, and heat spreading materials.
Journal ArticleDOI
Coating-boosted interfacial thermal transport for carbon nanotube array nano-thermal interface materials
Lin Qiu,Pu Guo,Qinyu Kong,Chong Wei Tan,Kun Liang,Jun Wei,Ju Nie Tey,Yanhui Feng,Xinxin Zhang,Beng Kang Tay,Beng Kang Tay +10 more
TL;DR: In this article, a DLC/TiN-coated carbon nanotube (VACNT) array was used to achieve up to 50 times reduction in Rc from 15mm2k/K/W to 0.3k/k/W.
References
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Journal ArticleDOI
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TL;DR: A review of the literature on thermal transport in nanoscale devices can be found in this article, where the authors highlight the recent developments in experiment, theory and computation that have occurred in the past ten years and summarizes the present status of the field.
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