Journal ArticleDOI
Effect of voids on the reliability of BGA/CSP solder joints
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TLDR
The results indicate that voids reduce the life of the solder joint and this effect may depend not only on the size, but also on frequency and location.About:
This article is published in Microelectronics Reliability.The article was published on 2003-12-01. It has received 161 citations till now. The article focuses on the topics: Void (astronomy).read more
Citations
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Journal ArticleDOI
A review of lead-free solders for electronics applications
TL;DR: New lead-free solder alternatives and the trends in the industry are reviewed, including SnCu-based solders, SnAgCu solders with Ag content, and Sn3.0Ag0.5Cu (SAC305) solders.
Journal ArticleDOI
Quantifying the effect of porosity on the evolution of deformation and damage in Sn-based solder joints by X-ray microtomography and microstructure-based finite element modeling
TL;DR: In this article, the authors used X-ray microtomography to visualize the porosity in a Pb-free solder joint and to reconstruct a three-dimensional model based on the exact geometry of the pores.
Journal ArticleDOI
An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection.
TL;DR: The article provides a review of the state-of-art non-destructive testing methods used for evaluation of integrated circuit (IC) packaging identifying various types of the defects and the capabilities of most common NDT methods employed for defect detection.
Journal ArticleDOI
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
TL;DR: Investigating the void effect on the solder material layers used in power modules subjected to thermal passive cycles suggests that the fatigue reliability of solder joints depends not only on the size, location and ratio of the voids but also on their statistical distribution.
Journal ArticleDOI
Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints
TL;DR: In this article, a technique utilizing high-resolution computed tomography (CT) was described to detect porosity in solder joints and the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation.
References
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Proceedings Article
Microelectronics reliability
TL;DR: In this article, the importance of the involvement of the design and manufacturing team in achieving reliability of microelectronic devices is highlighted. And a method of verifying reliability goals through calculation of failure rates based on life test parameters is described.
Book
Ball Grid Array Technology
TL;DR: In this article, the authors introduce BGA technology ceramic substrates for BGA packages BT substrates and plastic BGA assembly inspection of BGA tests and sockets infrastructure to support BGA manufacturing.
Related Papers (5)
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Leila Ladani,Abhijit Dasgupta +1 more