Proceedings ArticleDOI
Electrostatic digital micromirror using interdigitated cantilevers
Jin-Wan Jeon,Byeong-Il Kim,Ji-hyuk Kim,Hyung-Kew Lee,Jun-Bo Yoon,Euisik Yoon,Koeng Su Lim +6 more
- pp 528-531
TLDR
In this paper, an electrostatic digital micromirror utilizing interdigitated cantilevers was proposed, which has an operational mechanism of a seesaw allowing accurate, reliable control of the final rotating angle.Abstract:
We have proposed an electrostatic digital micromirror utilizing interdigitated cantilevers. The electrostatically-actuated microstructure has been fabricated by the electroplated-nickel surface micromachining. Thanks to the unique design of the interdigitated cantilevers, the micromirror has an operational mechanism of a seesaw allowing accurate, reliable control of the final rotating angle. The fabricated digital micromirror has shown the rotating angle of /spl plusmn/9 degrees with an actuation voltage of 60 V.read more
Citations
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Patent
Micro-Electro-Mechanical Transducers
TL;DR: In this article, a micro-electro-mechanical transducer (such as a cMUT) has a movable mechanical part to transform energy, and a resilient structure has multiple connectors distributed over the device element area to vertically transport the top player with distributed support not limited to edges.
Patent
Methods for fabricating micro-electro-mechanical devices
TL;DR: In this paper, a method for fabricating a microelectro-mechanical device (such as a cMUT) was disclosed, which combines a subst (201), a middle spring layer (220), and a top plate (240) using wafer bonding technology or sacrificial technology.
Patent
Through-wafer interconnection
TL;DR: In this paper, a through-wafer interconnect and a method for fabricating the same are described, and a dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the throughwafer conductor.
Patent
Micro-Electro-Mechanical Transducer Having an Insulation Extension
TL;DR: In this paper, a micro-electro-mechanical transducer with two electrodes 810, 840 separated by an insulator 830 with an insulation extension 840 is described.
Patent
Middle spring supported micro-electro-mechanical transducers
TL;DR: In this article, a microelectro-mechanical transducer, such as a cMUT, is described, which has a substrate, a top plate, and a middle spring layer there between.
References
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Journal ArticleDOI
A MEMS-based projection display
TL;DR: The digital display engine (DDE) as discussed by the authors is based on a single DMD device having array dimensions of 800/spl times/600 elements, illuminated by a metal halide arc lamp through a compact optics train.
Journal ArticleDOI
Line-Addressable Torsional Micromirrors for Light Modulator Arrays
TL;DR: In this paper, the authors present the SAMLAB-ARTICLE-1994-010 Record created on 2009-05-12, modified on 2016-08-08, and used for this purpose.
Proceedings ArticleDOI
Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)
TL;DR: In this article, a new monolithic integration method for 3D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM).
Journal ArticleDOI
Electrostatic aluminum micromirrors using double-pass metallization
TL;DR: In this article, a low-cost process approach is presented, suitable for the manufacture of electrostatic micromirror arrays, made from the second metallization of complementary metal oxide semiconductor (CMOS) or bipolar processes deposited in two passes.
Proceedings ArticleDOI
Deformable mirror display with continuous reflecting surface micromachined in silicon
G. Vdovin,S. Middelhoek,L. Sarro +2 more
TL;DR: In this article, a micromachined deformable display device (DMD) is proposed and character- ized, which consists of a freely suspended silicon nitride/Al reflective flexible mem- brane, optical figure of which is controlled electro- statically by the array of integrated electrodes.