scispace - formally typeset
Patent

Epitaxial reactor having a wall which is protected from deposits

Reads0
Chats0
TLDR
In this article, an epitaxial growth reactor for processing wafers of a semiconductor material by exposing it to a reactive gas flow is described, where the mixture used is a hydrogen/argon mixture, the proportion of each of these gasses in the mixture being adjustable.
Abstract
An epitaxial growth reactor for processing wafers (1) of a semiconductor material by exposing it to a reactive gas flow. A wall (8) positioned at a slight distance from the wafer or group of wafers which is exposed to the reactive gas in a double wall, with a very narrow space (34) between the two walls, and this space is filled with a mixture whose composition can be varied and, consequently, the thermal conductivity can be adjusted. The mixture used is a hydrogen/argon mixture, the proportion of each of these gasses in the mixture being adjustable. The interior wall (8) of the double wall is a quartz plate and the exterior wall (9) is made of metal. Relevant FIG.: 1.

read more

Citations
More filters
Patent

Semiconductor device, and manufacturing method thereof

TL;DR: In this article, the oxide semiconductor film has at least a crystallized region in a channel region, which is defined as a region of interest (ROI) for a semiconductor device.
Patent

Substrate Processing Apparatus

TL;DR: In this article, a bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the booster pump to prevent the exhaust gas from diffusing back to the inside of a process chamber.
Patent

Wafer support system

TL;DR: In this paper, a wafer support system consisting of a segmented susceptor having top and bottom sections and gas flow passages therethrough is described, where the sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer.
Patent

Gas delivery apparatus for atomic layer deposition

TL;DR: In this paper, an apparatus and method for performing a cyclical layer deposition process, such as atomic layer deposition, is provided. But this method is not suitable for high-dimensional data.
Patent

Apparatus and process for plasma-enhanced atomic layer deposition

TL;DR: In this article, a lid assembly for conducting a vapor deposition process within a process chamber is provided which includes an insulation cap and a plasma screen, and the insulation cap may be positioned on top of the plasma screen to form a centralized gas region with the expanded channel and a circular gas regions with the groove.
References
More filters
Patent

Induction heated reactor system for chemical vapor deposition

TL;DR: In this article, a chemical vapor deposition system which includes a generally closed reaction chamber having walls formed from a dielectric material is presented, where a susceptor for carrying a plurality of semiconductor wafers is positioned within the chamber.
Patent

CVD reaction chamber

TL;DR: In this paper, an improved reaction chamber for CVD is proposed, which combines the advantageous features of the known horizontal and vertical reaction chambers while minimizing their respective short comings, and it is shown that the susceptor is rotatably and replaceably supported by a hollow rod, axially accommodating therein a thermocouple.
Patent

Epitaxial growing apparatus

TL;DR: In this paper, an epitaxial growing apparatus consisting of a base plate, a quartz bell jar mounted on the base plate and a reaction chamber defined by the baseplate and the quartz bucket is described.
Patent

Vapor growth apparatus

TL;DR: In this paper, an epitaxial film is formed on the substrate by using the low output of a lamp to prevent the deposition of reaction products on a plate through which the radiant ray permeates without using air cooling by heating a substrate by radiation of ray.
Patent

Cooling type vapor phase reactor

TL;DR: In this paper, the authors proposed a method to effectively apply an unwelded part which is not conventionally utilized and to enhance cooling effect by providing a cooling means on an outer wall surface and covering the cooling means by a high-thermal conductive material.