Patent
Floating subcarriers for wafer polishing apparatus
TLDR
In this article, the benefits of single wafer polishing are achieved with the economies of multiple wafer plasming by adding the plurality of floating subcarriers to the conventional carrier.Abstract:
A polishing apparatus has a conventional carrier with a plurality of floating subcarriers. The benefits of single wafer polishing are achieved with the economies of multiple wafer polishing by adding the plurality of floating subcarriers to the conventional carrier. Each subcarrier has a single wafer adhered to its underside. Axial freedom is provided to duplicate the dynamics of single wafer polishing. The required axial freedom is obtained by axially loading each subcarrier via a mechanical spring or via pneumatic/hydraulic devices. In two variations, each subcarrier is also allowed auto-rotational freedom. In another two variations, the subcarriers are rotationally driven. In all variations, the wafers adhered to the floating subcarriers are substantially uniformly polished and the total indicated reading of the maximum deviation on the wafer surface is improved.read more
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Patent
Lithographic apparatus, and device manufacturing method
Maarten Marinus Johannes Wilhelmus Van Herpen,Vadim Yevgenyevich Banine,Johannes Peterus Henricus De Kuster,Johannes Hubertus Josephina Moors,Lucas Henricus Johannes Stevens,Bastiaan Theodoor Wolschrijn,Yurii Victorovitch Sidelnikov,Marc Hubertus Lorenz Van Der Velden,Wouter Anthon Soer,Thomas Stein,K Kurt Gielissen +10 more
TL;DR: In this article, a lithographic apparatus configured to project a patterned beam of radiation onto a target portion of a substrate is described, which includes a first radiation dose detector and a second radiation dose detectors, each detector comprising a secondary electron emission surface configured to receive a radiation flux and to emit secondary electrons due to the receipt of the radiation flux.
Patent
Wafer polishing method and apparatus
TL;DR: A wafer polishing assembly is a wafer assembly having a plurality of wafer carriers for substantially simultaneously polishing the wafers against a rotating polishing surface.
Patent
Wafer polisher head having floating retainer ring
TL;DR: In this article, a polishing head for semiconductor wafer was described, which enables a wafer retainer to float during polishing and yet extend beyond a Wafer carrier to define a pocket for the wafer and thereby facilitate wafer changing.
Patent
Fluid pressure regulated wafer polishing head
TL;DR: A wafer polishing head utilizes a wafer backing member with a pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the Wafer inside an edge seal feature at the perimeter of the wafers to urge (or press) the Wafers toward a polishing pad as mentioned in this paper.
Patent
Chemical mechanical polishing apparatus with improved polishing control
TL;DR: In this article, a chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom, including a carrier, which positions the substrate against the rotating polishing pad.
References
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Patent
Apparatus and process for polishing semiconductor or similar materials
P Cronkhite,J Poletti,R Voege +2 more
TL;DR: In this paper, a rotatably supported turntable is used for polishing semiconductor material, such as that in wafer form, and a height adjusting means supports a force exerting means against the plate member holding the spindles, so that a precise quantity of controlled force is directed upon said hubs during a polishing operation.
Patent
Method of polishing semiconductor wafer
TL;DR: In this article, the authors used a pressure-reduction holder to secure a primarily polshed wafer with a pressure reduction holder and a one-side polisher to finish a slick surface.
Patent
Polishing machine for silicon discs - has rotating plate and moving vertical spindles with conical screws engaging holes in workpiece holders
TL;DR: In this article, the arrangement incorporates a workpiece holder (22) which can be mounted on the polishing disc (13), and a plate (17) which rotates with the spindle in which conical screws with press rods (26) are mounted.