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Fluid injector for and method of prolonged delivery and distribution of reagents into plasma

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TLDR
In this paper, a method and apparatus for injecting a fluid into a plasma stream with a uniform distribution and with reduced likelihood of clogging over prolonged use is provided, which can be integrated into or interchangeable within an injector system that can be designed for operation within a plasma deposition apparatus.
Abstract
A method and apparatus for injecting a fluid into a plasma stream with a uniform distribution and with reduced likelihood of clogging over prolonged use is provided. An injector includes a first channel portion for restricting a flow of the fluid and having a shape such that inner walls of the first channel portion are parallel to a first axis. The injector also includes a second channel portion in fluid communication with the first channel portion. The second channel portion includes a recessed portion such that inner walls of the second channel portion diverge from the first axis at a predetermined angle. The second channel portion reduces a buildup of a clogging layer on the inner walls of the second channel portion over a period of use. In addition, the injector can further include a tip portion that protrudes into the plasma. The injector can be integrated into or interchangeable within an injector system that can be designed for operation within a plasma deposition apparatus.

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Citations
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References
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Patent

Reactant gas ejector head and thin-film vapor deposition apparatus

TL;DR: In this article, a reactant gas ejector head in a thin-film vapor deposition apparatus includes at least two reaction inlet passages for introducing reactant gases, a gas mixing chamber for mixing reactive gases introduced from the reactant inlet passage, and a nozzle disposed downstream of the mixing chamber to rectify the mixed gases from the gas mixing chambers into a uniform flow and applying the uniform flow to a substrate.
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Reactant gas ejector head

TL;DR: A reactant gas ejector head enables a process gas mixture of a uniform concentration and composition to be delivered to the surface of a substrate in a stable and uniform thermodynamic state by preventing premature reactions to occur along the gas delivery route as mentioned in this paper.
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Gas injection system for semiconductor processing

TL;DR: In this paper, a system for injecting a gaseous substance into a semiconductor processing chamber is described, which includes at least one plenum formed in a plenum body and a plurality of nozzles associated with each plenum.
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TL;DR: In this paper, a gas processing apparatus is described that consists of a processing chamber that is airtightly structured, a gas supply source for supplying gas to the processing chamber through the gas delivery pipe, a holding table for holding a workpiece loaded to the process chamber, a spray plate structured as a partition wall of the shower member that faces the holding plate, the spray plate having a plurality of spray holes, and a baffle member disposed between spray plate in the spray member and the gas outlet.