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Patent

Growth-orientation of crystals by raster scanning electron beam

TLDR
In this paper, a method of grain-orienting the crystal structure of a layer of semiconductor material by application of a raster scanning electron beam to a layer which has been previously formed on a substrate, such as by sputter-plasma film deposition, is described.
Abstract
A method of grain-orienting the crystal structure of a layer of semiconductor material by application of a raster scanning electron beam to a layer of polycrystalline semiconductor material which has been previously formed on a substrate, such as by sputter-plasma film deposition. The method comprises electron beam lithography computer-applied to the crystal growth and orientation of a polycrystalline thin sheet of silicon or other semiconductor material.

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Citations
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Patent

Method of crystallizing amorphous material with a moving energy beam

TL;DR: In this paper, an improved method for crystallizing amorphous material with a moving beam of energy is disclosed, in which the energy beam is scanned in a manner to provide controlled, continuous motion of the crystallization front.
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Semiconductor device having transistors with different orientations of crystal channel growth with respect to current carrier direction

TL;DR: In this article, a silicon film is crystallized in a predetermined direction by selectively adding a metal element having a catalytic action for crystallizing an amorphous silicon and annealing.
Patent

Method for production of semiconductor devices

TL;DR: In this article, a method for the conversion of a non-single crystalline semiconductor to a single-layer single-crystal semiconductor using an energy ray irradiation process was proposed.
Patent

Process for doping semiconductors

TL;DR: In this article, a process for doping semiconductors, comprising the successive steps of: effecting implantation by recoil consisting in depositing on the surface of the substrate a layer of material containing dopant particles and in bombarding said layer by means of a beam of bombarding particles, which are in particular non-dopant, so as to cause the doping particles to penetrate in the substrate.
Patent

Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material

TL;DR: In this article, a method for depositing and heating the semiconductor material on the substrate, where the substrate is composed of a layer of organic polymer, a metal or metal alloy, and a dielectric material, is described.
References
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Patent

Method for improving the crystallinity of semiconductor films by laser beam scanning and the products thereof

TL;DR: In this paper, a method for improving the crystallinity of semiconductor films by scanning the surface of such films with a shaped, focused laser beam is described, where the laser is matched to the film so that the beam delivers sufficient energy to heat the film above a temperature at which crystallization occurs along the scan track.
Patent

Plasma spraying process for preparing polycrystalline solar cells

TL;DR: In this article, a doped silicon powder is injected into a high temperature ionized gas (plasma) to become molten and to be sprayed onto a low-cost substrate.
Patent

Solar cell comprising semiconductive whiskers

TL;DR: In this paper, a solar cell with semiconductor body consisting of single crystal semiconductor whiskers which are grown on a substrate surface permitting relatively inexpensive manufacture and high efficiency of the solar cell is disclosed.
Patent

Process for fabricating polycrystalline inp-cds solar cells

TL;DR: In this paper, the authors describe a compound semiconductor solar cell and fabrication process therefor wherein both the P and N-type layers of the cell are polycrystalline semiconducting material and have large crystallites with grain boundaries of similar dimensions and spacings.
Patent

Controlled temperature polycrystalline silicon nucleation

TL;DR: In this paper, the diffusivity of an impurity in a layer of polycrystalline silicon is controlled by forming the poly-stalline polysilicon on a thin nucleating layer.