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High-speed circuit board signal integrity

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TLDR
In this paper, the authors present a practical reference for high-speed serial signaling on printed wiring boards, including detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs.
Abstract
As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that you can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

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Citations
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Journal ArticleDOI

Microfabricated ion traps

TL;DR: In this paper, the authors provide an overview of material and electrical considerations for the design of micro-fabricated ion trap structures, and provide guidance in how to choose the appropriate fabrication design, consider dierent methods for the fabrication of micro fabricated ion traps and discuss previously realized structures.
Journal ArticleDOI

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance

TL;DR: In this article, the authors demonstrate the value of RF impedance measurements as an early indicator of physical degradation of solder joints as compared to dc-resistance measurements, and compare their respective sensitivities in detecting interconnect degradation.
Patent

CDMA-based crosstalk cancellation for on-chip global high-speed links

TL;DR: In this paper, the authors proposed a synchronous CDMA/spread spectrum method to suppress crosstalk in clock-forwarded on-chip interconnects, which can overcome the effects of capacitive cross-talk between adjacent data bus lines.
Journal ArticleDOI

A Comprehensive Investigation of a Common-Mode Filter for Gigahertz Differential Signals Using Quarter-Wavelength Resonators

TL;DR: In this paper, the authors presented a comprehensive investigation on an inexpensive and wideband common-mode noise suppression filter that uses a quarter-wavelength resonator and an equivalent transmission line model was also used to evaluate the effectiveness of the proposed structure in a commonmode filter (CMF).
Journal ArticleDOI

Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression

TL;DR: In this paper, a Gaussian Process (GP) regression was applied to the RF impedance obtained from the fatigue tests in order to estimate the remaining life of the solder joint in real time.
References
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Book

Transmission Line Design Handbook

TL;DR: In this paper, the authors present a comprehensive overview of transmission line components and discontinuities, including coupled lines, capacitors, and resistors, as well as a glossary of special functions.
Journal ArticleDOI

Power distribution system design methodology and capacitor selection for modern CMOS technology

TL;DR: In this paper, the impedance versus frequency profiles of the power distribution system components including the voltage regulator module, bulk decoupling capacitors and high frequency ceramic capacitors are defined and reduced to simulation program with integrated circuit emphasis (SPICE) models.
Book

Analog filter design

TL;DR: In this paper, Bilinear Transfer Functions and Frequency Response are discussed in the context of Op-Amp Oscillators, and a ladder design with simulated elements is presented.
Journal ArticleDOI

Modeling via hole grounds in microstrip

TL;DR: In this article, a simple model for a cylindrical via hole in a microstrip is presented, based on a modification of the inductance of a cylinder conductor as derived from Maxwell's equations.