Journal ArticleDOI
Hillock growth in thin films
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A model for hillock growth in thin films such as those of lead and tin is developed in this article, where the authors take into account Nabarro Herring diffusion creep as a parallel stress relaxation mechanism and the effects of film thickness on hillock density.Abstract:
A model for hillock growth in thin films such as those of lead and tin is developed. It is proposed that hillock growth is a form of stress relaxation in which atomic species diffuse along the film‐substrate interface to the base of the hillock. The latter extrudes out along the grain boundaries connecting it to the rest of the film. The stability and kinetics of this process are considered. Taking into account Nabarro‐Herring diffusion creep as a parallel stress relaxation mechanism observations such as an incubation period for hillock growth and the effects of film thickness on hillock density are accounted for. In addition, observations on lateral growth of hillocks and unusually tall hillocks (whiskers) are interpreted within the framework of the present model.read more
Citations
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Journal ArticleDOI
Stress-related effects in thin films
John A. Thornton,D.W. Hoffman +1 more
TL;DR: In this paper, the fundamental nature of the internal stresses that are found in both evaporated and sputtered coatings is reviewed from the point of view of decorative coating applications, which indicate that apparatus geometry is particularly important in determining the state of stress that forms in deposits.
Journal ArticleDOI
Solid-State Dewetting of Thin Films
TL;DR: In this article, the authors use dewetting to make arrays of nanoscale particles for electronic and photonic devices and for catalyzing growth of nanotubes and nanowires.
Journal ArticleDOI
Stresses and deformation processes in thin films on substrates
Mary F. Doerner,William D. Nix +1 more
TL;DR: In this paper, the stresses that develop in thin films on substrates can be detrimental to the reliability of thin film electronic devices, in order to design these devices for improved mechanical reliability, an...
Journal ArticleDOI
Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques
TL;DR: In this article, the authors used curvature and submicron indentation measurements to study the strength of thin aluminum and tungsten thin films on silicon substrates and found that the film strength increased with decreasing thickness.
Journal ArticleDOI
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
William J. Boettinger,C E. Johnson,Leonid A. Bendersky,Kil-Won Moon,Maureen E. Williams,Gery R. Stafford +5 more
TL;DR: In this paper, high purity bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 lm thick, were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus.
References
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Book
Conduction of Heat in Solids
H. S. Carslaw,John Conrad Jaeger +1 more
TL;DR: In this paper, a classic account describes the known exact solutions of problems of heat flow, with detailed discussion of all the most important boundary value problems, including boundary value maximization.
Journal ArticleDOI
Diffusional Viscosity of a Polycrystalline Solid
TL;DR: In this article, it is suggested that mosaic boundaries and boundaries between grains of nearly the same orientation may not serve as sources or sinks of the diffusion currents, in which case the creep rate will depend only on the configuration of grain boundaries having a sizable orientation differen...
Book
Advanced Calculus for Applications
TL;DR: In this paper, the Laplace Transform is used to solve the problem of linear differential equations with constant coefficients, which is a special case of the problem we are dealing with here, and the results are shown to be valid for large values of x.
Journal ArticleDOI
Grain Growth and Stress Relief in Thin Films
TL;DR: The effect of grain growth on stresses in films is discussed in this paper, where grain growth generally leads to stress relaxation when the film is under a compressive stress and further grain growth can occur if plastic flow relieves some of the strain energy.