Journal ArticleDOI
Mechanisms of electroless metal plating. III. Mixed potential theory and the interdependence of partial reactions
TLDR
The theory of a technique based on the observation of the mixed potential as a function of agitation, concentration of the reducing agent and concentration of metal ions is presented in this article, where it is shown that in electroless copper plating the copper deposition reaction is diffusion-controlled while the formaldehyde decomposition reaction is activation-controlled.Abstract:
Electroless plating reactions are classified according to four overall reaction schemes in which each partial reaction is either under diffusion control or electrochemical control. The theory of a technique based on the observation of the mixed potential as a function of agitation, concentration of the reducing agent and concentration of metal ions is presented. Using this technique it is shown that in electroless copper plating the copper deposition reaction is diffusion-controlled while the formaldehyde decomposition reaction is activation-controlled. Values of the kinetic and mechanistic parameters for the partial reactions obtained by this method and by other electrochemical methods indicate that the two partial reactions are not independent of each other.read more
Citations
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Journal ArticleDOI
Electroless nickel, alloy, composite and nano coatings – A critical review
J. Sudagar,Jianshe Lian,Wei Sha +2 more
TL;DR: The development of metal deposition processes based on electroless nickel, alloy and composite coatings on various surfaces has witnessed a surge in interest among researchers, with many recent applications made possible from many excellent properties as mentioned in this paper.
Book ChapterDOI
Electroless Deposition of Metals and Alloys
TL;DR: In this article, the reaction mechanisms of electroless deposition, the influence of processing parameters on properties of deposited coatings, etc. This knowledge is needed to ensure the successful operation of the process.
Journal ArticleDOI
Effects of additives and chelating agents on electroless copper plating
Yi-Mao Lin,Shi-Chern Yen +1 more
TL;DR: In this paper, the effect of chelating agents and additives on electroless copper plating and deposits was investigated using linear sweep voltammetry, atomic force microscopy (AFM), and XRD.
Journal ArticleDOI
Single-Crystal Electrochemistry Reveals Why Metal Nanowires Grow.
TL;DR: Single-crystal electrochemistry can test hypotheses for why nanostructures form and predict conditions for anisotropic growth by quantifying the degree to which different species cause facet-selective metal deposition.
Journal ArticleDOI
Optimization of electroless Ni–Zn–P deposition process: experimental study and mathematical modeling
TL;DR: In this paper, a mathematical model based on mixed potential theory was developed which was used to optimize a non-anomalous Ni-Zn-P electroless deposition process developed by us at USC.
References
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Journal ArticleDOI
Advances in Electrochemistry and Electrochemical Engineering
P. Delahay,Ashok K. Vijh +1 more
Journal ArticleDOI
The Active Iron Electrode I . Iron Dissolution and Hydrogen Evolution Reactions in Acidic Sulfate Solutions
Journal ArticleDOI
A Generalized Expression for the Tafel Slope and the Kinetics of Oxygen Reduction on Noble Metals and Alloys
TL;DR: In this article, the Tafel slope was modified to take into account the potential which is effective in charge transfer within the double layer, and possible paths and rate-determining steps were suggested for the cathodic reduction of oxygen.
Journal ArticleDOI
Mechanisms of electroless metal plating. II: Formaldehyde oxidation
TL;DR: In this paper, a quantitative study of the mecanisme d'oxydation of formaldehyde on a metal de chaque groupe (Pt and Cu) is presented.