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Proceedings ArticleDOI

Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache

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The article was published on 1999-10-01. It has received 8 citations till now. The article focuses on the topics: Cache & Microprocessor.

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Proceedings ArticleDOI

Non-invasive timing analysis of IBM G6 microprocessor L1 cache using backside time-resolved hot electron luminescence

TL;DR: In this paper, the authors describe application of PICA to analysis of individual MOSFET switching times in the L1 cache write control circuits of the S/390 G6 microprocessor chip.
Patent

Method for global die thinning and polishing of flip-chip packaged integrated circuits

TL;DR: In this paper, the flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed, and the thickness of the die is measured at at least five locations on the die.
Proceedings ArticleDOI

Practical, non-invasive optical probing for flip-chip devices

TL;DR: A new tool for performing picosecond imaging circuit analysis (PICA) is described, which has /spl plusmn/15 ps timing accuracy and can be used with a wide variety of testers.
Journal ArticleDOI

PICA: Backside failure analysis of CMOS circuits using Picosecond Imaging Circuit Analysis

TL;DR: The Picosecond Imaging Circuit Analysis (PICA) as discussed by the authors is a new optical imaging technique combining imaging with timing, spatially resolving individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale.

Microprocessor L1 Cache using Backside Time-Resolved Hot Electron Luminescence

TL;DR: Application of PICA to analysis of individual MOSFET switching times in the L1 cache write control circuits of the S/390 G6 microprocessor chip is described.
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