Journal ArticleDOI
Review: Loop heat pipes with flat evaporators
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In this paper, an analytical review of development, results of tests and simulation of loop heat pipes with disk-shaped, rectangular and flat-oval evaporators is presented, which may be arbitrarily separated into evaporators with opposite replenishment (EORs) and evaporators of longitudinal replenishment.About:
This article is published in Applied Thermal Engineering.The article was published on 2014-06-01. It has received 150 citations till now. The article focuses on the topics: Loop heat pipe & Heat pipe.read more
Citations
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Journal ArticleDOI
A Review on efficient thermal management of air- and liquid-cooled data centers: From chip to the cooling system
TL;DR: In this article, the state-of-the-art of multi-level thermal management techniques for both air- and liquid-cooled data centers is reviewed. But the main focus is on the sources of inefficiencies and the improvement methods with their configuration features and performances at each level.
Journal ArticleDOI
Cooling of server electronics: A design review of existing technology
Ali C. Kheirabadi,Dominic Groulx +1 more
TL;DR: In this paper, the authors compared the heat transfer characteristics of several cooling technologies with potential application in the server electronics industry and concluded that some form of liquid cooling is necessary in high performance computing applications.
Journal ArticleDOI
An ultra-thin miniature loop heat pipe cooler for mobile electronics
Guohui Zhou,Ji Li,Lucang Lv +2 more
TL;DR: In this paper, a miniature loop heat pipe (mLHP) employing a 1.2 mm thick flat evaporator and a vapor line, liquid line and condenser with 1.0 mm thickness is presented.
Journal ArticleDOI
Literature review: Steady-state modelling of loop heat pipes
TL;DR: In this paper, an exhaustive literature review is carried out in order to investigate the existing steady-state models of loop heat pipes (LHPs) and compare the parameters and physical mechanisms taken into account in different approaches.
Journal ArticleDOI
A survey on data center cooling systems: Technology, power consumption modeling and control strategy optimization
Qingxia Zhang,Zihao Meng,Xianwen Hong,Yuhao Zhan,Jia Liu,Jiabao Dong,Tian Bai,Junyu Niu,M. Jamal Deen +8 more
TL;DR: An overview of the data center’s cooling system, which mainly includes the mainstream cooling solutions, the power consumption modeling methods and the optimization control strategies are described.
References
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Journal ArticleDOI
Loop heat pipes
TL;DR: Loop heat pipes (LHPs) as mentioned in this paper are two-phase heat-transfer devices with capillary pumping of a working fluid, which can transfer heat efficiency for distances up to several meters at any orientation in the gravity field, or to several tens of meters in a horizontal position.
Book
Heat Pipes: Theory, Design and Applications
David Reay,R.J. McGlen,P.A. Kew +2 more
TL;DR: The Heat Pipes 6th Edition as discussed by the authors is an essential guide for practicing engineers and an ideal text for postgraduate students, taking a highly practical approach to the design and selection of heat pipes.
Journal ArticleDOI
Miniature loop heat pipes for electronics cooling
TL;DR: In this paper, the development of miniature loop heat pipes (mLHPs) with a nominal capacity of 25-30 W and a heat transfer distance up to 250 mm was investigated for cooling electronics components and CPU of mobile PC.
Journal ArticleDOI
Experimental studies on a high performance compact loop heat pipe with a square flat evaporator
Ji Li,Daming Wang,G. P. Peterson +2 more
TL;DR: In this article, a copper-water compact loop heat pipe (LHP) with a unique flat, square evaporator with dimension of 30mm (L )×30mm (W )×15mm (H ) and a connecting tube having an inner diameter of 5mm.
Journal ArticleDOI
Operational characteristics of a miniature loop heat pipe with flat evaporator
TL;DR: In this article, the authors studied the thermal characteristics of the miniature Loop Heat Pipe (mLHP) with the flat disk shaped evaporator, 10 mm thick and 30 mm in diameter, for thermal control of the compact electronic equipments.