Journal ArticleDOI
Thermal conductance and thermopower of an individual single-wall carbon nanotube.
TLDR
It is observed that the thermal conductance of a 2.76-microm-long individual suspended single-wall carbon nanotube (SWCNT) was very close to the calculated ballistic thermal conductances of a 1-nm-diameter SWCNT without showing signatures of phonon-phonon Umklapp scattering for temperatures between 110 and 300 K.Abstract:
We have observed experimentally that the thermal conductance of a 2.76-μm-long individual suspended single-wall carbon nanotube (SWCNT) was very close to the calculated ballistic thermal conductance of a 1-nm-diameter SWCNT without showing signatures of phonon−phonon Umklapp scattering for temperatures between 110 and 300 K. Although the observed thermopower of the SWCNT can be attributed to a linear diffusion contribution and a constant phonon drag effect, there could be an additional contact effect.read more
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Proceedings ArticleDOI
Development of Photothermal-Resistance Technique and Its Application to Thermal Diffusivity Measurement of Single-Wall Carbon Nanotube Bundles
TL;DR: In this article, a photothermal-resistance technique is developed to characterize the thermophysical properties of one-dimensional micro/nanostructures, and the measured thermal diffusivities for three different single-wall carbon nanotube bundles are 2.98x10(-5), 4.41x10-5, and 6.64x10−5 m(2)/s, respectively.
OtherDOI
Graphene‐Based Materials: Structure and Properties
TL;DR: In this paper , the classification of carbon materials, history and properties of graphene, structure defects of graphene and different dimensional graphene, as well as its applications are discussed, including its applications in energy storage and conversion systems.
Proceedings ArticleDOI
Thermal resistance of eutectic Ga-In-Sn/particles binary thermal interface materials
TL;DR: In this paper, diamond and tungsten were added into the eutectic Ga-In-Sn low melting temperature alloy to fabricate composite thermal interface materials (TIMs) to improve the interface thermal resistance.
Book ChapterDOI
Electrothermal Modeling of Carbon Nanotube-Based TSVs
TL;DR: The most common filling materials currently being used are copper (Cu), tungsten (W), and even doped poly-silicon (Polysilicon) materials as discussed by the authors.
References
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Book
Electronic transport in mesoscopic systems
TL;DR: In this article, preliminary concepts of conductance from transmission, S-matrix and Green's function formalism are discussed. And double-barrier tunnelling is considered.
Electronic Transport in Mesoscopic Systems
TL;DR: In this article, preliminary concepts of conductance from transmission, S-matrix and Green's function formalism are discussed. And double-barrier tunnelling is considered.
Journal ArticleDOI
Thermal transport measurements of individual multiwalled nanotubes.
TL;DR: The thermal conductivity and thermoelectric power of a single carbon nanotube were measured using a microfabricated suspended device and shows linear temperature dependence with a value of 80 microV/K at room temperature.
Journal ArticleDOI
Unusually High Thermal Conductivity of Carbon Nanotubes
TL;DR: An unusually high value, lambda approximately 6600 W/m K, is suggested for an isolated (10,10) nanotube at room temperature, comparable to the thermal conductivity of a hypothetical isolated graphene monolayer or diamond.
Journal ArticleDOI
Extreme oxygen sensitivity of electronic properties of carbon nanotubes
TL;DR: The results, although demonstrating that nanotubes could find use as sensitive chemical gas sensors, likewise indicate that many supposedly intrinsic properties measured on as-prepared nanotube may be severely compromised by extrinsic air exposure effects.