Journal ArticleDOI
Thermal, mechanical, and dielectric properties of aluminium oxide and solid glass microsphere‐reinforced epoxy composite for electronic packaging application
Alok Agrawal,Alok Satapathy +1 more
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This article is published in Polymer Composites.The article was published on 2019-07-01. It has received 25 citations till now. The article focuses on the topics: Glass microsphere & Epoxy.read more
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The effects of the hexagonal boron nitride nanoflake properties on the thermal conductivity of hexagonal boron nitride nanoflake/silicone rubber composites
Bo Zhong,Jiaxin Zou,Lulu An,Chengyu Ji,Xiaoxiao Huang,Wei Liu,Yuanlie Yu,Huatao Wang,Guangwu Wen,Kun Zhao,Xuesong Lin +10 more
TL;DR: In this paper, the effects of the content, geometry, thickness, modification and orientation of hexagonal boron nitride nanoflakes (h-BNNFs) on the thermal conductivity of polymeric composites were systematically investigated.
Journal ArticleDOI
Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites
Alok Agrawal,Saurabh Chandrakar +1 more
Journal ArticleDOI
Thermal conductivity of polyimide/AlN and polyimide/(AlN + BN) composite films prepared by in-situ polymerization
TL;DR: In this paper, a series of polyimide/AlN composite films with different contents were prepared by using polyimides as organic matrix, AlN and BN as inorganic fillers.
Journal ArticleDOI
Space Charge Behavior in Epoxy‐Based Dielectrics: Progress and Perspective
TL;DR: In this paper , the state-of-the-art progress in understanding and regulating the space charge behavior of epoxy-based dielectric materials is reviewed, along with the advancement of nanofiller-doping strategies for improving space charge suppression capabilities.
Journal ArticleDOI
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
William Anderson Lee Sanchez,Jia-Wun Li,Hsien-Tang Chiu,Chi-Chia Cheng,Kuo-Chan Chiou,Tzong-Ming Lee,Chih Wei Chou +6 more
TL;DR: In this paper , the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied.
References
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Journal ArticleDOI
Electrical and thermal conductivity of polymers filled with metal powders
TL;DR: In this article, the electrical and thermal conductivity of systems based on epoxy resin (ER) and polyvinyl chloride (PVC) filled with metal powders have been studied.
Journal ArticleDOI
Dynamic mechanical properties of particulate-filled composites
T. B. Lewis,Lawrence E. Nielsen +1 more
TL;DR: The relative shear modulus of composites containing glass spheres in a rubbery matrix obey the Mooney equation, analogous to the relative viscosity of similar suspensions in Newtonian liquids as discussed by the authors.
Journal ArticleDOI
Glass transition and relaxation behavior of epoxy nanocomposites
TL;DR: In this article, the effect of the filler size, filler loading, and dispersion conditions of the nanofillers on the glass-transition temperature (Tg) have been studied.
Journal ArticleDOI
Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method
TL;DR: In this paper, a thermally conductive m BN/polyimide composite with 30% boron nitride/polyamide acid (bN/PAA) was fabricated via thermal-imidization followed by hot press method.
Journal ArticleDOI
A novel fiber-reinforced polyethylene composite with added silicon nitride particles for enhanced thermal conductivity
TL;DR: In this article, a thermally conductive plastic composite was prepared from a mixture of silicon nitride (Si 3 N 4 ) filler particles and an ultrahigh molecular weight polyethylene-linear low density (PLD) blend.