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Journal ArticleDOI

Ultralow-profile micromachined power inductors with highly laminated Ni/Fe cores: application to low-megahertz DC-DC converters

Jin-Woo Park, +1 more
- 23 Sep 2003 - 
- Vol. 39, Iss: 5, pp 3184-3186
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TLDR
In this paper, the magnetic core of the fabricated inductor has 72 laminations of 1-/spl mu/m-thick Ni/Fe films and the inductor dimension is 11.7 mm, and the dc resistance is 150 m/spl Omega/
Abstract
Micromachined inductors with submillimeter profiles and comparable electrical performance to thicker, commercially-available surface-mount devices, have been fabricated and characterized for low-megahertz dc-dc converters. The fabrication approach involves micron-scale lamination of Ni/Fe cores, combined with three-dimensional micromachined copper windings. The magnetic core of the fabricated inductor has 72 laminations of 1-/spl mu/m-thick Ni/Fe films. The inductor dimension is 11.5 /spl times/ 5.7 /spl times/ 0.7 mm, and the dc resistance is 150 m/spl Omega/. A maximum Q of 9.2 at 3 MHz with an inductance value of 2.3 /spl mu/H and a dc saturation current (I80) of 0.2 A were obtained. Use of this inductor in a regulated dc-dc boost converter circuit (7-12 V) operating at 2.2 MHz yielded 1.9-W power output at 71% efficiency.

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Citations
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Review of Microscale Magnetic Power Generation

TL;DR: The history, current state of the art, and ongoing challenges for compact (less than a few cubic centimeters) magnetic power generation systems in the microwatts to tens of watts power range are discussed.
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Review of Integrated Magnetics for Power Supply on Chip (PwrSoC)

TL;DR: In this article, the authors present a detailed review of integrated magnetics technologies, primarily microinductors, a key component in realizing a monolithic power converter, and propose the use of two performance metrics or figures of merit in order to compare the dc and ac performance of individual microinductor structures.
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Integrating Magnetics for On-Chip Power: A Perspective

TL;DR: In this article, the potential for integration of efficient power converters requires technology for efficient, high-power on-chip inductors and transformers, and the authors examined the technologies, geometries, and scaling of air-core and magnetic-core transformers.
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Micro-inductors integrated on silicon for power supply on chip

TL;DR: In this paper, the authors discuss the technologies required to produce magnetics on silicon for power supply on chip (PSon-chip) and discuss the electrical performance of micro-inductors in a buck converter.
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Thin-Film-Integrated Power Inductor on Si and Its Performance in an 8-MHz Buck Converter

TL;DR: In this paper, a microinductor fabricated on silicon using electrochemical techniques has been used in a low power dc-dc converter with a self resonant frequency of 130 MHz.
References
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Journal ArticleDOI

Micromachined planar inductors on silicon wafers for MEMS applications

TL;DR: The micromachined on-chip inductors can be applied for magnetic microelectromechanical systems devices, such as micromotors, microactuators, microsensors, and integrated power converters, which envisages new micropower magnetics on a chip with integrated circuits.
Journal ArticleDOI

A microfabricated transformer for high-frequency power and signal conversion

TL;DR: In this article, a 1:1 transformer for high frequency power or signal conversion has been designed, fabricated and characterized in an innovative laterally laminated core structure by using new micromachining techniques.
Journal ArticleDOI

Batch-fabricated microinductors with electroplated magnetically anisotropic and laminated alloy cores

TL;DR: In this paper, three different geometries of inductors, each possessing two different core materials [permalloy (NiFe) and supermalloy(NiFeMo)] are presented.
Proceedings ArticleDOI

Microfabrication process for high-frequency power-conversion transformers

TL;DR: In this paper, a process for microfabrication of transformers for high-frequency power conversion applications is described, which uses multilayer films of NiFe/SiO/sub 2/ magnetic material and copper coils deposited on a silicon substrate.
Journal ArticleDOI

Fabrication of high current and low profile micromachined inductor with laminated Ni/Fe core

TL;DR: In this paper, a new process for the fabrication of high current and very low profile micromachined inductors has been developed, which involves the combination of mechanical lamination and electrodeposition of copper windings by means of LIGA-like lithography through thick epoxy photoresists.
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