What is the nowel and efficient way to cool down high heat flux chips?
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A novel and efficient way to cool down high heat flux chips is through the use of self-adaptive cooling techniques. These techniques involve the integration of microfluidic units with thermal-sensitive hydrogel valves, which can adapt to the changing thermal environment and effectively dissipate nonuniform heat load distributions . Another approach is the use of micro-channel heat sinks with gradually-higher fins split-flow microstructures (GFSMs MCHS), which can significantly reduce the thermal resistance and mean absolute temperature difference (MATD) of regular micro-channel heat sinks . Additionally, thermal ground planes (TGPs) have shown promise in cooling high heat flux miniaturized power electronic devices. TGPs with internally grooved structures, hybrid wicks, electro hydro dynamic effects, micro pillars, and metal foams embedded have been investigated to enhance heat transfer performance and operating range . These innovative cooling solutions provide effective and intelligent thermal management for high heat flux chips.
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| Papers (5) | Insight |
|---|---|
| The paper discusses various patented technologies for cooling high heat flux power semiconductor devices, including single-phase jet impingement cooling, microchannel cooling, phase change cooling, and direct chip cooling. It does not specifically mention a novel and efficient way to cool down high heat flux chips. | |
2 Citations | The novel and efficient way to cool down high heat flux chips is by using a micro-channel heat sink (MCHS) with gradually-higher fins split-flow microstructures (GFSMs) and a three-dimensional heat dissipation structure (3D-HDS). This is discussed in the provided paper. |
6 Citations | The paper proposes a self-adaptive cooling method for high heat flux chips, which effectively removes unevenly distributed high heat fluxes and adapts to local heat fluxes for efficient cooling. |
| The novel and efficient way to cool down high heat flux chips is through embedded cooling with a self-adaptive microchannel/pin-fin hybrid heat sink, as proposed in the paper. | |
3 Citations | The paper discusses the use of thermal ground planes (TGPs) as an efficient method for cooling high heat flux miniaturized electronic devices. |
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