Showing papers on "Active surface published in 1998"

Infrared video camera system with uncooled focal plane array and radiation shield

Abstract: An infrared video camera system comprises an uncooled infrared sensor mounted and a thermally conductive thin walled radiation shield for shielding radiation from reaching an active surface of the uncooled infrared sensor. A TEC maintains the sensor active surface and the radiation shield at a substantially constant temperature. The uncooled infrared sensor and radiation shield are further housed in a hollow thermally conductive vacuum cover which is vacuum sealed with a base assembly and includes a vacuum sealed infrared transparent window in an aperture at a top end of the vacuum cover for allowing infrared radiation to reach the active surface and for forming a vacuum chamber enclosing the infrared sensor and radiation shield. A relay optical cell mounted to a camera body comprises at least one optical element for relaying an image formed at its entrance onto the active surface. An imaging optical assembly is interchangeably mounted to the relay optical cell and comprises at least one optical element for imaging an infrared scene to be imaged onto the entrance aperture of the relay cell. A plurality of different field of view imaging optical assemblies are interchangeably mounted without substantially changing the field of view of the sensor active surface.

High pressure catalytic processes studied by infrared-visible sum frequency generation

Abstract: The recent development of infrared-visible sum frequency generation (SFG), a surface-specific vibrational spectroscopy, has helped bridge the pressure gap between studies of heterogeneous catalysis under high vacuum and atmospheric pressure. This is achieved by in situ monitoring of surface species at high pressure via their SFG vibrational spectra and correlating the results with the simultaneously measured reaction rate using gas chromatography. Examples of systems studied include olefin hydrogenation and carbon monoxide oxidation over the (111) crystalline face of platinum. In these examples, the studies succeed in revealing the molecular details of the surface reactions. Identification of key intermediates and their concentrations has made it possible for the first time to calculate turn over rates per active surface species rather than just per exposed surface metal atom. In all cases, the key intermediate of the reaction is not detectable on the surface in UHV under similar temperatures.

Flip chip down-bond: method and apparatus

Abstract: A flip-chip semiconductor device comprises a carrier substrate having a conductor pattern on at least one side and at least one semiconductor die with an active surface and an opposed ground surface. A conductive backing plate is conductively bonded to the ground surface. The active surface faces and is electrically connected to the conductor pattern of the carrier substrate. A conductive down-bond connection is provided between the backing plate and a ground connection or reference potential connection. The backing plate is preferably rigid and can be manipulated for indirect alignment of the die or dice carried thereon relative to the substrate.

Method and apparatus for directing solar energy to solar energy collecting cells

Abstract: A photovoltaic array includes a plurality of generally planar cells, arranged in panels, a light collecting body having a solar energy collecting surface adapted to be oriented for receiving solar energy in a nominal direction which defines a nominal light source direction. The panels are spaced apart from each other in a direction perpendicular to the nominal light source direction and each has an active surface oriented on the body at an angle of less than 90° relative to the nominal light source direction. The light collecting body is transmissive for redirecting light received on the light collecting surface onto the active surfaces of the panels.

Massage device having an oscillating active contact surface

Abstract: A versatile and highly effective massage device has an active surface for bringing into contact with tissue to be treated, and means for driving the active surface in an oscillating pivoting movement about an axis. The active surface has, in cross section, different radii perpendicular to the axis in different directions and can be rotated parallel to the axis in order to bring in each case different zones of the active surface into contact with the tissue.

Green Bank Telescope active surface system

Abstract: During the design phase of the Green Bank Telescope (GBT), various means of providing an accurate surface on a large aperture paraboloid, were considered. Automated jacks supporting the primary reflector were selected as the appropriate technology since they promised greater performance and potentially lower costs than a homologous or carbon fiber design, and had certain advantages over an active secondary. The design of the active surface has presented many challenges. Since the actuators are mounted on a tipping structure, it was required that they support a significant side-load. Such devices were not readily available commercially so they had to be developed. Additional actuator requirements include low backlash, repeatable positioning, and an operational life of at least 230 years. Similarly, no control system capable of controlling the 2209 actuators was commercially available. Again a prime requirement was reliability. Maintaining was also a very important consideration. The system architecture is tree-like. An active surface 'master-computer' controls interaction with the telescope control system, and controls ancillary equipment such as power supplies and temperature monitors. Two slave computers interface with the master- computer, and each closes approximately 1100 position loops. For simplicity, the servo is an 'on/off' type, yet achieves a positioning resolution of 25 microns. Each slave computer interfaces with 4 VME I/O cards, which in turn communicate with 140 control modules. The control modules read out the positions of the actuators every 0.1 sec and control the actuators' DC motors. Initial control of the active surface will be based on an elevation dependant structural model. Later, the model will be improved by holographic observations.Surface accuracy will be improved further by using laser ranging system which will actively measure the surface figure. Several tests have been conducted to assure that the system will perform as desired when installed on the telescope. These include actuator life tests, motor life test, position transducer accuracy test, as well as positioning accuracy tests.© (1998) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Monolithic surface mount semiconductor device and method for fabricating same

Abstract: A monolithic surface mount semiconductor device includes at least one discrete device formed on an active surface of a semiconductor substrate. An insulative layer is bonded to the active surface of the substrate, preferably by depositing an encapsulant epoxy between the active surface and the insulative layer, the epoxy forming a mechanical bond between the insulative layer and the active surface of the substrate. A plurality of contacts are formed, preferably on a back surface of the substrate, opposite the active surface. The contacts provide electrical connection to the integrated circuit, transistor, and/or diode. The insulative layer, in combination with the discrete device(s), forms a complete surface mount semiconductor device having a package that is monolithically fabricated with the discrete device(s) at the wafer level.

Method and apparatus for cleaning flat workpieces

Abstract: A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. Spinning the wafer urges condensate from the vapor phase to move toward the edge of the wafer as the wafer surfaces are cleaned.

Semiconductor chip package having combined structure of lead-on-chip leads and standard normal leads

Abstract: A semiconductor chip package comprising: a semiconductor chip having an active surface having a long side and a short side, integrated circuit elements being formed on the active surface, the semiconductor chip being installed with a plurality of central electrode pads installed along the long side on the middle region of the active surface, and a plurality of peripheral electrode pads installed on the peripheral region of the active surface along the short side; a lead frame having first inner leads which are directly attached to the active surface and electrically connected to the central electrode pads, second inner leads which are distant from the chip and electrically connected to the peripheral electrode pads, first outer leads coupled to the first inner leads, and second outer leads coupled to the second inner leads; an electric interconnect device for connecting the first inner lead to the central electrode pads and connecting the second inner lead to the peripheral electrode pad; and a protective package for encapsulating the semiconductor chip, first and second inner leads, and the electric interconnect device.

Titanium nitride diffusion barrier for use in non-silicon technologies and method

Abstract: As will be described in more detail hereinafter, there is disclosed herein a titanium nitride diffusion barrier layer and associated method for use in non-silicon semiconductor technologies. In one aspect of the invention, a semiconductor device includes a non-silicon active surface. The improvement comprises an ohmic contact serving to form an external electrical connection to the non-silicon active surface in which the ohmic contact includes at least one layer consisting essentially of titanium nitride. In another aspect of the invention, a semiconductor ridge waveguide laser is disclosed which includes a semiconductor substrate and an active layer disposed on the substrate. A cladding layer is supported partially on the substrate and partially on the active layer. The cladding layer includes a ridge portion disposed in a confronting relationship with the active region. A metallization structure substantially covers the ridge portion and includes at least one layer consisting essentially of titanium nitride.

Loc-type semiconductor chip package and manufacture thereof

Abstract: PROBLEM TO BE SOLVED: To reduce the manufacturing cost by spreading in a wafer state a bonding agent, for bonding lead frame leads and semiconductor chips, over a lead bonding region on the semiconductor chip active surface without using a polyimide adhesive tape SOLUTION: In a bonding agent-applying process according to a dispensing method, firstly a wafer 120 is mounted on a x-y table 170 movable in the x and y axial directions The x-y table 170 is moved to align a dispensing head 150 with the upper side of the wafer When accurate alignment has been achieved, the dispensing head 150 is moved down to apply the bonding agent on a lead bonding region on the active chip surface with a needle 152 On the other hand, if the bonding agent is applied after a groove-shaped lead-bonding region is formed in the active chip surface onto which the bonding agent is to be dispensed, the overflow of the bonding agent can be prevented

Active segmented primary reflector and pointing accuracy of the Large Millimeter Telescope (LMT)

Abstract: The LMT is a 50-meter-diameter fully-steerable radio telescope to be used for astronomy at millimeter wave lengths. Thespecifications call for a surface accuracy of 70 jtm RMS and a pointing accuracy of 0.7 arc sec RMS. This paper addressestwo critical issues of the design development. To achieve the required accuracy it was proposed that the primary reflectorof the LMT utilize an actively controlled segmented surface with a real time closed loop control system. In the approachdeveloped for the preliminary design systematic deformations of the segments result in the magnification and propagationof surface errors; this problem is examined and possible solutions presented. Limits on the applicability of homology to thedesign of millimeter wave radio telescopes are discussed in the context of the need for an active surface. A proposedapproach for computing in real time the pointing errors due to thermal deformations is evaluated. The results show the limitsof applicability of this approach.Key Words: LMT,. active surface, homology, thermal deformations, pointing accuracy

High-performance heat sink for flip-chip package

Abstract: PROBLEM TO BE SOLVED: To provide a high-performance heat sink, whose heat radiation characteristic in a flip-chip semiconductor packaging is improved SOLUTION: A heat sink 200 which is useful in a semiconductor package has a protruding part 201 which is in thermal contact with the non-active surface of a semiconductor die 211 included in the package The semiconductor package has a base material 206 having the upper surface and the lower surface An electric contact point 207 provided at the lower surface of the base material is connected to the corresponding electric contact point of a printed circuit board The active surface of the semiconductor die is electrically connected to the upper surface of a package substrate with a plurality of solder bumps 208 The protruding part to the thermal diffusion part has the size same as the outermost dimension of the semiconductor die COPYRIGHT: (C)1999,JPO

JCMT active surface control system: implementation

Abstract: The James Clerk Maxwell Telescope on the summit of Mauna Kea in Hawaii is a 15 meter sub-millimeter telescope which operates in the 350 microns to 2 millimeter region. The primary antenna surface consists of 276 panels, each of which is positioned by 3 stepper motors. In order to achieve the highest possible surface accuracy we are embarking upon a project to actively control the position of the panels adjuster system is based on a 6809 micro connected to the control computer by a GPIB interface. This system is slow and inflexible and it would prove difficult to build an active surface control system with it. Part of the upgrade project is to replace the existing micro with a 68060 VME micro. The poster paper will describe how the temperature of the antenna is monitored with the new system, how a Finite Element Analyses package transforms temperature changes into a series of panel adjuster moves, and how these moves are then applied to the surface. The FEA package will run on a high end Sun workstation. A series of DRAMA tasks distributed between the workstation and the Baja 68060 VxWorks Active Surface Control System micro will control the temperature monitoring, FEA and panel adjustment activities. Users can interact with the system via a Tcl/TK based GUI.

Method and electrochemical transducer for measuring gas concentration

Abstract: FIELD: gas concentration measurement technology. SUBSTANCE: transducer has case, metering electrode containing catalytically active material capable of converting gas analyzed, counter-electrode containing carbon material with electrochemical active surface compounds capable of oxidizing or reducing, and electrolyte contacting metering electrode and counter-electrode; carbon material in counter-electrode has specific surface area of at least 40 sq.m/g. Method using this transducer is given in description of invention. EFFECT: improved reliability of metering results. 22 cl, 2 dwgr

A device for forming ceramic products such as tiles and the like, by powder pressing

Abstract: The device for forming ceramic products, such as tiles and the like, by pressing of powders or other materials having prevalently plastic characteristics, comprises: a lower body (2) bearing a support surface (20); an upper body (3) provided with at least one active surface (30) arranged facing the support surface (20); at least one shaping frame (4) predisposed in such a way as to perimetrally delimit the at least one active surface (30) and to be mobile with respect to the upper body (3) so as to be able to project inferiorly from the at least one active surface (30); means for depositing a powder layer (5) between the lower body (2) and the upper body (3); the lower body (2) and the upper body (3) being reciprocally mobile in a perpendicular direction to the support surface (20) and the at least one active surface (30) so as to be able to exert on command a pressing force on at least a part of the layer of powders (5) to give the part a permanent shape.

Micro-electronic module for miniature microphone, pressure and acceleration sensor

Abstract: The micro-electronic module (10) has a substrate (12) on which a micro-device (14) is located. On its external face (44) the substrate has an opening and at least one electrical conductor. The micro-device has one active surface (18) projecting outwards and a component (40) extending partly into the opening. The conductor is in contact with a connector (24,26) located on the active surface of the micro-device. The opening can pass right through the substrate or it can have a base set back from the external face by a specific distance.

Improvements in or relating to electrodes

Abstract: An electrode (1) having an active surface for contacting an electrolyte The electrode (1) comprises first and second metallic materials (2, 3) arranged to provide a number of first metallic material to second metallic material interfaces at the active surface The invention also relates to a method of making such an electrode (1) and to an electrolysis cell provided with such an electrode (1)

Method and device for electro-erosive dressing of a grinding wheel

Abstract: An active surface (28) of a grinding wheel (26) which has electrically non-conductive abrasive grains imbedded in an electrically conductive bonding agent is arranged at a given distance (a) to an electrode (40), which is jumpered by a liquid dielectric. An effective voltage is applied between the grinding wheel (26) and the electrode (40), and the grinding wheel (26) is rotated. The active surface (28) is mechanically scanned and a measured value representing the state of wear of the grinding wheel (26) is obtained. The distance (a) between the active surface (28) and the electrode (40) is adjusted according to the measuring value.

Thermal resistant perforated shadow mask for colour flat screen CRT

Abstract: An inactive secondary surface (101) forms an extension of the active surface (100) at the centre of the mask in which openings (101') are formed. In the secondary surface, interconnection strips (a), which correspond to the distance between the openings, form a gradation in size outwards that is radial and rounded at the corners. An inactive primary surface (102) is formed outside the fixing (105) to the frame in all directions except at the corners of the mask. Regions to the exterior of the inactive primary surface make graded interconnection strips outwards from the centre of the primary surface and are radial at the corners.

Dielectric separation semiconductor substrate and its manufacture

Abstract: PROBLEM TO BE SOLVED: To reduce the cost of a dielectric separation semiconductor substrate by reducing the peripheral section of the substrate on which no rotating element can be arranged, and to improve the degree of integration of rotating elements on the substrate and, at the same time, to make the substrate usable at a middle of withstand voltage by vertically digging separating grooves which separate semiconductor crystals from each other by dry etching, etc., regardless of the faces of the crystals. SOLUTION: A single-crystal Si wafer 10 carrying an N buried layer 11 on its surface is separated into many single-crystal Si chips 18, by closely adhering a masking material 14 for trench having separating groove forming windows 12 to the upper surface of the wafer 10, and digging separating grooves 16 into the wafer 10 by dry etching. After an oxide film 20 is formed on the internal surfaces of the grooves 16 and surfaces of the chips 18, the grooves 16 are filled up by depositing Si 22 by the low-pressure CVD method. Then, the surface of the poly-Si 22 is polished to a flat surface, and the wafer 10 is stuck to a supporting substrate 26 composed of a single-crystal Si wafer carrying an oxide film 20 on the surface with the polished surface on the downside by turning over the wafer 10. Therefore, each single-crystal semiconductor chip 18 has a bottom face composed of the defective surface resulting from the formation of the separating grooves and top face composed of an active surface on the opposite side of the defective surface.

Plate catalyst for removing nitrogen oxide(s) from exhaust gas

Abstract: Plate catalyst (1) comprises a number of stacked plates (3,4) having a catalytically active surface and arranged in the main flow direction (8) of an exhaust gas. The plates (3, 4) each have a corrugated structure (5) running along a modulation direction (9) with a wavelength (20) and amplitude (22). The ratio of wavelength (20) to amplitude (22) is 2.5-6. The plates are stacked in such a way that the modulation directions cut each neighbouring plates and the angle (10) between the main flow direction (8) and each modulation direction (9) is 10-40 deg .

Determining various parameters e.g. weight, height or posture of seated person for designing vehicle airbag systems - includes subdividing surface of seat into two or more sections and determining position of active weight barycentre in each section so that this information can be programmed in a microprocessor

Abstract: The procedure consists of subdividing the surface of the seat (4) into at least two sections and determining the position of the active weight barycentre in each section, deducing the parameters of the seated person from the data obtained. The apparatus used for the procedure consists of a detector (2) of the forces applied to the surface of the seat, made up of a series of active surfaces in the form of strips (81, 82, 83) situated on either side of and parallel to a central dividing line. The active surfaces are fed with an electrical voltage in a potential gradient through a series of resistances branched in series so that the assembly of the active surfaces represents a linear potential. Each active surface incorporates a number of sensors with an electrical resistance which varies as a function of the force applied to them.

Non destructive testing electromagnetic field control device for creating electromagnetic fields and directing Foucalt currents.

Abstract: The device is designed to apply an electromagnetic field to a target. The device has a core (1), two groups of excitation windings (2,3) and measuring windings or magnetic field sensors (4). The excitation windings of one of the two groups are superposed on those of the other group so their axes are orthogonal and their coils cross each other in an orthogonal fashion on at least a non-negligible common surface which forms an active surface used for fault detection. The excitation windings and the smallest segment of the smallest active surface is less than or equal to 0.1. The cores (1) is rectangular shaped for plane targets and is a tube for tubular targets. The core has a shape which similar to the target surface to be controlled. The core is made from a magnetic material of magnetic permeability relative greater than 1 and of low electrical conductivity.

Surface reconstruction from tomography data

Abstract: We propose a method to reconstruct the surface of a three-dimensional (3D) object from its volume. We use an active surface model which is a 3D generalization of the basic two-dimensional (2D) model. The model is an elastic surface that is deformed under the action of internal and external forces. The internal forces model the smoothness constraints while the external forces model the image constraints. In our case, the image constraints are 3D detected edges obtained using the Zucker and Hummel (1981) operator. The finite difference method is used to solve the energy-minimization problem for a surface. The proposed method is used for the segmentation of the patient body from the tomography reconstruction in nuclear medicine. The body surface in nuclear medicine is very important in order to model the attenuation of the photons.

Electric coagulation printing method and apparatus

Abstract: An electric coagulation printing method comprising the step (a) of forming a plurality of dots of colored coagulation ink, which represent a desired image, on an active surface of an anode by electric coagulation of the electric coagulation printing ink, and the step (b) of bringing a substrate into contact with the dots of colored coagulation ink so as to transfer the same ink from the active surface of the anode to the substrate, whereby the image is printed on the substrate, characterized in that the step (a) is carried out while the active surface of the anode and ink is maintained at a temperature of about 35 DEG - 60 DEG C. An apparatus for implementing this method is also disclosed.

Method for fabricating a compression layer on the dead frame to reduce stress defects

Abstract: An LOC die assembly includes a die dielectrically adhered to the underside of a lead frame. The active surface of the die underlying the attached lead frame is coated with a polymeric material such as polyimide. The underside of the lead frame overlying the die is coated with a layer of soft material, such as silver, which has a lower hardness than the coating on the active surface for absorbing point stresses. Penetration of stacked filler particles into the soft material reduces point stresses on the active die surface and disadhesion stresses on the lead frame components.