Showing papers on "Copper plating published in 1983"

Electrochemical treatment of copper for improving its bond strength

Abstract: A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.

Composite copper nickel alloys with improved solderability shelf life

Abstract: A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.

Method of direct bonding copper foils to oxide-ceramic substrates

Abstract: Method for directly bonding copper foils having a copper oxide layer to oxide-ceramic substrates by heating the ceramic substrate covered with the copper foil in an oxygen-containing atmosphere to a temperature above the eutectic temperature of Cu and Cu 2 O, but below the melting temperature of copper in a vacuum furnace at a pressure of not more than 1 mbar while maintaining a furnace atmosphere with a partial oxygen pressure between 0.001 and 0.1 mbar.

Ceramic substrate with metal plate

Abstract: A ceramic substrate with metal plate, wherein a metal plate consisting mainly of copper is bonded to a ceramic substrate through a brazing layer consisting of a mixture of copper oxide and copper.

Cyanide-free copper plating process

Abstract: A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.

Method for determination of concentration of organic additive in plating bath

Abstract: The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.

Soldering composition and method of use

Abstract: A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin, preferably minor amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The composition is particularly useful for joining copper and copper alloys because it will wet and readily flow on the copper or copper alloy surfaces. It can be used with or without a flux. It has reduced dissolving action on the copper and copper alloys due to its reduced reactivity with them. It also has improved conductivity vis-a-vis conventional lead-tin and lead-tin-silver solders.

Accelerating the rate of electroless copper plating

Abstract: A method of depositing electroless copper at fast rates (7 to 23 mum/hr) employs a chemical accelerating agent and pH control. Rate enhancement is correlated with electrochemical polarization, which is used to classify the accelerating compounds. Examples are described herein.

Metal plating on plastics

Abstract: A simple and highly effective process for preparing the surface and plating a plastic or elastomer material is disclosed by the present invention. A uniform, highly adherent metal layer is deposited by the claimed process. The surface of the materials to be plated is prepared by exposure to a gas etch atmosphere and activation of the etched surface by providing a metal colloid thereon. Another aspect relates to the use of a one-step or two-step conditioner treatment in the process for improved results. After the surface preparation and activation, a desired metal coating can be electroless metal plated in a conventional manner.

Electroplating non-metallic surfaces

Abstract: In a method for electroplating non-metallic surfaces on a substrate (e.g., of plating hole walls in metal clad laminates), metallic sites are formed on the surface to be plated and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component (e.g. a dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes the plating to preferentially occur at the sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby an increased rate of plating on the site surfaces is achieved with respect to the plating reaction on a surface consisting of the metal to be plated out. The method allows non-metallic surfaces to be rapidly and uniformly electroplated, without the need to electrolessly plate the surfaces first.

Selective metal plating onto poly(phenylene sulfide) substrates

Abstract: A method for selectively plating metal, such as copper, onto poly(phenylene sulfide) substrates is disclosed. In this method, a crystalline region and an amorphous region are created in a substrate. One method for creating these regions is to selectively crystallize a region in an amorphous poly(phenylene sulfide) substrate by heating it above its glass transition temperature. The surface of the substrate is then activated with an electroless plating catalyst such as palladium metal. After activation, a nitrosyl salt is introduced into the amorphous region of the substrate. The substrate is then immersed in an electroless plating solution containing the metal ions whereby metal selectively plates onto the crystalline region of the substrate.

Manufacture of printed coil

Abstract: PURPOSE:To improve the winding density and the conductor space factor of a printed coil by forming a plated resist of spiral shape on a metal plate, forming a conductor of mushroom type sectional shape on the metal surface, and transferring the conductor on an insulating film. CONSTITUTION:A spiral plated resist 2 is formed on a metal plate 1 by using a photosensitive resin film, and electric copper plating unit 3 is formed to the thickness of the resistor 2. Then, electroless copper plating is executed to eventually form a conductor 3' having a mushroom type sectional shape. Then, the conductor 3' is transferred to an insulating film 5 with adhesive 4, and a coil shape 6 is formeed.

Life extension of catalyst predip baths

Abstract: A method and apparatus for extending the useful life of an acqueous acid chloride solution that serves as a protective bath for an activator dip bath such as used in electroless copper plating. Means are provided for recirculating the acidic chloride solution over metallic tin to precipitate copper ions from the solution. The precipitated copper is filtered from the solution to extend its useful life.

Copper texturing process

Abstract: The invention is a room-temperature dry process for texturing copper on polyester, to improve adhesion of coatings to the copper surface through mechanical as well as chemical bonding. An iodine plasma is produced by backfilling an evacuated chamber with iodine and applying an RF potential. The iodine plasma includes both positive and negative iodine ions. Unprotected surface areas of the copper form a copper iodide; when the copper iodide is removed, the remaining surface is highly textured. The associated polyester is not damaged. The copper iodide is conveniently removed by a 10% hydrochloric acid solution which has no damaging effects on the associated polyester or on the metallic copper, or on associated polyester in a plastic laminated with copper.

Laser induced copper plating

Abstract: Argon laser induced plating of copper spots and lines from copper sulfate solutions on glass and phenolic resin paper has been investigated. The substrates had to be precoated with an evaporated copper film. The highest plating rates have been obtained with a small film thickness of 25 nm. Spots with a thickness up to 30 μm were plated.

Process for bonding, copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy

Abstract: A process for bonding a copper or copper-chromium alloy body and a ceramic body of components of an electrical or electronic device to each other includes a step of directly sandwiching a layer of chromium oxide between the ceramic and copper or copper-chromium bodies, a step of heating a temporary assembly of the ceramic and copper or copper-chromium alloy bodies and the layer of chromium oxide, under an atmosphere which can oxidize chromium without oxidizing copper, at a temperature of at least 900° C. but below the melting point of copper or the alloy, and then a step of slowly cooling the resulting bonded assembly. In particular, in a process for bonding the alloy body to the ceramic body, the chromium oxide sandwiching step is performed concurrently with the temporary assembly heating step. The bonding process can produce a hermetic envelope, particularly a vacuum envelope of a vacuum interrupter. The process for bonding the copper or alloy body to the ceramic body of this invention is more advantageous than bonding processes employing the so-called Telefunken method, in terms of cost and steps.

Process for etching copper

Abstract: Process and structure for etching copper, as in the manufacture of printed circuit boards. The copper is exposed to a gaseous or liquid oxidant in the presence of a catalyst which promotes the reaction of copper with the oxidant. In some embodiments, the catalyst is carried by a medium which also serves as a receiver for oxidized copper species produced by the reaction, and in one preferred embodiment, the medium comprises a laminated structure having a first layer which contains a catalyst and a second layer which receives the oxidized copper species. The etching is substantially anisotropic, which alleviates the problem of undercutting.

Process and structure for etching copper

Abstract: Process and structure for etching copper, as in the manufacture of printed circuit boards. The copper is exposed to a gaseous or liquid oxidant in the presence of a catalyst which promotes the reaction of copper with the oxidant. In some embodiments, the catalyst is carried by a medium which also serves as a receiver for oxidized copper species produced by the reaction, and in one preferred embodiment, the medium comprises a laminated structure having a first layer which contains a catalyst and a second layer which receives the oxidized copper species. The etching is substantially anisotropic, which alleviates the problem of undercutting.

Copper electroplating procedure

Abstract: In traditional copper electroplating processes, soluble copper anodes are used as the source of copper. There are certain potential advantages to using nonconsumable anodes and adding a source of copper such as copper oxide to replenish the electroplating bath. Periodic reverse current plating is used by some manufacturers to obtain smoother deposits without the use of additives. This periodic reversal of current drastically reduces the service life of the nonconsumable anodes because of dissolution of the metal oxide on the insoluble anode. The invention is a copper electroplating process with a dual-element anode assembly. This assembly consists of electrically isolated copper and metal-oxide electrodes. The metal-oxide electrode is active only during the anodic part of the cycle while the copper electrode is active only during the cathodic part of the cycle. Electrical isolation is achieved by the use of diodes or relays.

Manufacture of one-side copper plated stainless steel sheet

Abstract: PURPOSE: To obtain easily a one-side copper plated steel sheet of high quality by removing nickel and copper electrodeposited by throwing on one side of a steel sheet not to be plated by mechanical polishing and stripping, respectively when the other side of the steel sheet is striked with nickel and plated with copper in order. CONSTITUTION: A stainless steel sheet is degreased and pickled. One side of the steel sheet to be plated is striked with nickel, and nickel electrodeposited by throwing on the other side not to be plated is removed by mechanical polishing. A nickel layer formed by the striking is very thin, and nickel electrodeposited on the side not to be plated is less than nickel electrodeposited on the side to be plated, so said removal by polishing is easily carried out. The adhesion of copper electrodeposited by throwing in the next copper plating stage is made very low by removing nickel, and the copper is easy to strip, so it can be efficiently stripped with a brush roll or the like. COPYRIGHT: (C)1984,JPO&Japio

Catalyst for electroless copper plating

Abstract: PURPOSE:To improve the characteristics of the resulting electroless copper plating by adding a complex compound which is prepd. by reacting a bivalent palladium compound or a uni- or bivalent copper compound with aminosaccharide and produces metallic Pd of Cu by heating. CONSTITUTION:To a catalyst for electroless copper plating is added a complex compound which is prepd. by reacting a bivalent palladium compound or a uni- or bivalent copper compound with aminosaccharide and produces metallic Pd or Cu by heating. The amount of the complex compound added is <=1wt% when the compound is expressed in terms of Pd or Cu. Palladium (II) chloride, palladium (II) fluoride, palladium (II) bromide, palladium (II) iodide or the like is used as the bivalent palladium compound. Copper ( I ) chloride, copper (II) chloride, copper (II) sulfate or a mixture thereof is used as the uni- or bivalent copper compound.

Method of depositing a metal from an electroless plating solution

Abstract: A metal is deposited onto a substrate from an electroless plating solution by providing a first body which comprises the substrate in a plating solution, providing a second body in the plating solution wherein the second body includes a metal which has an electrolytic potential in the plating solution which is different from that of the metal to be plated, and electrically connecting the first body with the second body with an electrically conductive circuit.

Method of directly bonding copper parts to oxide-ceramic substrates

Abstract: The invention relates to a method of directly bonding copper parts to oxide-ceramic substrates in accordance with the Main Application P 3036128.5, and to a semiconductor component fabricated by said method and comprising an oxide-ceramic substrate (1) as base plate, on which contact pins (2) having thickened base section (3) and/or attachment bows (8) for making contact to the semiconductor components (6) and/or circular blanks (5) for soldering on the semiconductor components (6) are mounted. The parts to be mounted are composed of copper or are copper-plated and have a superficial copper oxide layer. The direct bonding of the ceramic substrate (1) to the copper parts (2, 85) mounted on it is carried out by heating in a vacuum oven above the eutectic temperature of copper and copper oxide but below the melting point of copper, in accordance with the Main Application P 3036128.5. The ceramic substrate (1) may be clad with copper foils (4) which serve as conductor tracks.

Laminated contact point

Abstract: A laminated contact point intended for brazing to contact carriers made of copper or copper alloys and particularly suitable for producing low-duty contacts is composed of a facing made of a silver/palladium alloy, a backing made of copper or a copper alloy and a solder layer made of a silver/copper/gallium alloy optionally containing tin or indium.

Manufacture of composite wire

Abstract: PURPOSE:To prevent a decrease of a copper ratio in case of drawing a wire and a disconnection, and to obtain a copper covered wire of a high copper ratio by raising an adhesive strength of a copper or copper alloy layer for covering a core wire of steel or a nickel alloy CONSTITUTION:A copper plating layer of 1-30W% is provided on a core material 1 of steel or a nickel alloy, and also a covering layer 2 of copper or a copper alloy is provided on said layer Subsequently, wire drawing is executed to >=30% reduction by a die of a low angle of 2-5 deg half angle, annealing is executed for 30min or more at 600-900 degC in a reducing atmosphere containing hydrogen, and a copper covered composite wire of 80-90% total copper weight ratio is obtained In this case, the reason why the reduction is limited is because an adhesive degree of the covered copper 2 and the core material 1 becomes worse in case of <=30% Also, the reason why the reducing atmosphere containing hydrogen is used for annealing is because a reduction of an oxide for lowering the adhesive degree of copper and the core material and an invasion of oxygen are prevented, and also a washing degree of the surface of the composite wire is raised Moreover, the reason why the annealing time is limited is because the adhesive degree drops in case of <=30min Also, the reason why a low angle die is used is because the copper ratio is decreased and a disconnection is caused Furthermore, the reason why the upper limit of the annealing temperature is set to 900 degC is because embrittlement of the surface copper layer is generated when exceeding 900 degC