Showing papers on "Plating published in 1985"

Thin film magnetic head

Abstract: PURPOSE:To decrease the deterioration in the recording/reproducing characteristic because of polishment finish of a magnetic gap face by providing either a magnetic layer or a wear resistance layer to a recessed part of a tip of a thin film magnetic part of the magnetic gap face. CONSTITUTION:Magnetic substance layers 11, 12 are provided so as to bury the recessed part of the tip of the thin film magnetic layers 3, 8, and a ''Permalloy(R)'' film with excellent performance is formed to the recessed part of the tip of the thin film magnetic layers 3, 4 by using the thin film magnetic layers 3, 8 as active layers. The film thickness of said ''Permalloy(R)'' film is controlled by measuring in advance the plating plate, and the film thickness value required to make the magnetic gap face to a flat face is obtained by measuring the depth of the recessed part of the tip of the thin film layers 3, 8 by means of the light interference method or the stylus contact step difference meter. Thus, the magnetic gap face is formed as a flat face and the thin film magnetic head with the excellent recording/reproducing characteristic is realized.

Process and apparatus for plating onto articles

Abstract: A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well. After the plating process is completed in the bath, the boards are preferably retransferred to generally horizontal orientation and conveyed through appropriate completion steps, such as cleaners, rinsers, anti-tarnish steps, dryer steps and the like, with preferably uniform thin copper coatings thereon, and thereafter the boards are subsequently plated with a thicker copper coating, preferably by means of an electroplating process.

Heat exchanger using a hydrogen occlusion alloy

Abstract: This invention discloses a heat exchanger comprising a compact of hydrogen adsorption alloy formed by a process of coating surfaces of fine particles of hydrogen adsorption alloy composed principally of a metal hydride with a dissimilar metal by plating and either by a process of compression molding of the coated alloy or by a process of filling a heat-conductive porous material with the coated fine particles of hydrogen alloy followed by a process of compression molding thereof. By this arrangement, it becomes possible to improve such disadvantages of conventional heat exchanger using hydrogen adsorption alloy as a decline of heat conductivity caused by micronization of the hydrogen adsorption alloy as a result of repeated uses or a decline of filling rate of the alloy caused by collapse and dispersion of the fine particles of the alloy compact eventually bringing about a decline of the heat exchanging function.

Electrolytic plating apparatus

Abstract: A rotary brush plating apparatus utilizing a porous brush member formed of a hydrophobic material is disclosed. Plating solution is pumped interiorly of rotating, cylindrical brush member and radially outwardly through interconnected pores to its periphery where plating takes place by the passage of parts lengthwise of the brush member in contact with its surface. A continuous circulation of plating solution is provided so that an adequate supply is always provided on the brush surface. Means are provided for recapturing excess solution for return to the reservoir.

Electroless plating process and process for producing multilayer wiring board

Abstract: In a selective electroless plating process suitable for formation and correction of a minute pattern by plating film, irradiation of the surface of a workpiece with a laser beam serves to selectively activate the surface of the workpiece to allow an electroless plating film to deposited on only the activated portions. The portion of the workpiece where plating is effected is irradiated with a radiation energy beam to form a damaged portion, which is contact with a plating bath during and/or after the irradiation to selectively from a plating film on the damaged portion. The portion of a workpiece where a pole as the connector part of a multilayer wiring board is to be formed is irradiated with a laser beam and allowed to have a pole selectively formed only thereon.

Metal cored board and method for manufacturing same

Abstract: It is disclosed that a metal cored board which comprises a base metal core, an easily solderable metal plating layer formed on one surface of the base metal core, an electrically insulating layer formed on the another surface of the base metal core, and an electrically conductive metal layer formed on the electrically insulating layer, a method for manufacturing a metal cored board, which comprises a step to plate both surface of a base metal core with an easily solderable metal, a step to form an electrically insulating layer on one surface of the easily solderable metal plating layer, and a step to form an electrically conductive metal layer on the electrically insulating layer.

Apparatus and method for controlling plating induced stress in electroforming and electroplating processes

Abstract: Internal stress on an object being electroplated is monitored continuously with a gauge. The gauge includes a metal receptor which is employed as a second cathode in the electrodeposition process. A separate plating current is supplied between the anode and second cathode, distinct from the separately controllable current between the anode and object being plates or electroformed. The stress on the second cathode is measured with a strain gauge, and a stress deviation from a desired plating stress is determined. The currents between the anode and first and second cathodes are adjusted in accordance with the measured internal stress on the metal receptor to achieve a desired stress condition. The internal stress is advantageously monitored with a foil resistance strain gauge. The strain gauge is connected to a carrier disposed in parallel with the metal receptor. The carrier is rigidly connected at opposite ends to the metal receptor. A stress transmission link centrally located between ends of the metal receptor and the carrier transmits the force applied by the electroplating material on the receptor to the carrier. The strain gauge provides an indication of the stress which results from the electroplating. The currents between the anode and first and second cathodes may be controlled in accordance with this stress measurement.

Injection molded multi-layer circuit board and method of making same

Abstract: A multi-layer circuit board comprised of two or more circuit board substrates (10, 12) shaped by injection molding with mating interconnecting pins (22) and holes (24) and banded together with an electrically insulated adhesive material (28). Circuit leads (14, 16, 18, 20) are provided on both sides of each substrate recessed into channels (85) formed in the surface of the substrate during the molding process. Electrical interconnection of the layers of circuitry occurs where the conductive materials of the circuit leads (14, 16) passes down through component lead holes (26) axially located in the interconnecting pins (22) and around the exterior of the interconnecting pins where contact is made with the conductive material coating on the interior of the interconnecting holes (24). A method of making the multi-layer board includes injection molding the substrates (10, 12) in a suitable shaped mold (74, 76) plating substantially all of the surface of the substrates with the conductive material (82) masking with a plating resist (84), plating again with conductive material (88), removing the plating resist and flash-etching to remove the conductive material (82) initially plated and masked by the plating resist (84) so as to define the circuit leads (14, 16, 18, 20). The preferred method uses a roller to apply the plating resist to some surfaces of the substrates.

Method for electroplating non-metallic surfaces

Abstract: Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component which causes the plating to preferentially occur at said sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out.

Electrodeposition of submicrometer metallic interconnect for integrated circuits

Abstract: Formation of a metallic interconnect pattern in submicron geometry architectures, without the photoresist being lifted off the substrate and resulting in the deposited metal being electroplated therebeneath, is achieved by a combination of a toughened-skin photoresist and pulsed electroplating. For toughening the skin of the photoresist and thereby enhancing its ability to withstand encroachment of the electrodeposited metal, the photoresist layer is illuminated with ultraviolet radiation. After the UV-irradiated photoresist has been allowed to cool, the resulting structure is placed in an electroplating bath, with appropriate electrodes disposed in the bath and connected to a said layer on the wafer for the deposition of the interconnect metal. The electrode differential is pulsed to provide a low frequency plating current through which the conductor metal is plated onto the seed metal on the wafer, as defined by the pattern of the toughened photoresist. After a prescribed, controlled electrodeposition interval during which the interconnect conductor has been plated to a desired level by the pulsed electroplating current, the wafer is removed from the bath and the photoresist layer is etched off, to leave only the electrodeposited interconnect layer and the underlying base (seed) metal. The exposed base metal is then etched leaving only the desired electrodeposited interconnect pattern.

Manufacture of semiconductor device

Abstract: PURPOSE:To uniformize density of currents flowing in the plated regions and form beam electrodes of almost uniform thickness on the entire part of substrate by connecting the first conductive film patterns which are directly in contact with the power supply for plating with the second conductive film patterns formed like islands in the respective element regions through individual resistance regions. CONSTITUTION:Since the side etching portions Se are formed at the side surfaces of respective openings in case a base electrode contact window 7, an emitter electrode contact window 8, a collector electrode contact window and an opening 30 corresponding to the slit pattern are formed on the SiO2 insulation film 4, a dislocation D is formed on a conductive film consisting of Ti layer 9 and Pt layer 10 at the opening 30 and a slit portion 20 (slit pattern) which separates the island conductive pattern (second pattern) 22 from the pattern (first pattern) 21 which functions as the path of plating current is formed. Moreover, the second pattern 22 is connected to the first pattern 21 through a resistance body region 23 formed by the same conductive film.

Electrolytic bath and methods of use

Abstract: An electrolytic bath, suitable for depositing a metal on or removing a metal from a substrate is provided which comprises an anode and cathode, an acid having a pKa of about 6 or less, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, each of R1 and R2 is selected from hydrogen, NR3 R4 and NR5, at least one of R1 and R2 is other than hydrogen, each of R3 and R4 is hydrogen or a monovalent organic radical, and R5 is a divalent organic radical, in which the molar ratio of the chalcogen compound to the acid is about 1 or more, and the molar ratio of water to the combination of acid and chalcogen compound is about 10 or less The electrolytic bath enables the use of higher concentrations of strong acids than would otherwise be possible, minimize hydrogen and/or oxygen evolution at the electrodes with attendant advantages, and is useful in a variety of methods such as electroplating (including immersion plating), electroforming, electrolytic machining, electropolishing, electrolytic roughening, anodizing and electrowinning

Sliding surface of composite nickel-plated sliding member

Abstract: A composite nickel plated sliding surface is obtained by the formation of a composite nickel plating film on a sliding surface of an automobile part such as an engine cylinder or piston by electroless nickel plating. The plating film contains at least one member of wear resistant particles having an average particle size of 0.1 to 1.0μ selected from SiC, TiC, WC, BC4, TiN, Al2 O3 or the like, and also at least one member of lubricating particles having an average particle size of 1 to 10μ selected from BN, MoS2, and Teflon. The nickel plating bath is adjusted to have a phosphorus concentration of 0.5 to 12%. When the matrix of the nickel plating film has a phosphorus concentration of 0.5 to 5%, the film hardness is improved.

Permanent magnet having excellent oxidation resistance characteristic

Abstract: PURPOSE:To obtain high residual magnetic flux density, high coersive force and high oxidation resistance characteristic by covering the surface of permanent magnet mainly composed of rare earth materials, boron and iron having the main phase of tetragonal system with the oxidation resistant plating layer. CONSTITUTION:A permanent magnet is obtained by covering with the oxidation resistant plating layer the surface of permanent magnet mainly composed of R (R is at least a kind of rare earth elements including Y) of 8-30atm%, B of 2- 28atm% and Fe of 42-90atm% with the main phase of the tetragonal system. In this composition, if R is under 8 atm%, high magnetic characteristic, particularly high coersive force cannot be obtained, but if it exceeds 30atm%, residual magnetic flux density if lowered. When B is under 2 atm%, high coersive force cannot be obtained but if it exceeds 28atm%, residual magnetic flux density is lowered. Moreover, when Fe is under 42atm%, residual magnetic flux density is lowered but it exceeds 90atm%, high coersive force cannot be obtained. It is inevitable for manufacturing baked magnet having excellent magnetic characteristic that the crystal phase has the main phase of tetragonal system.

Nickel Plating on Porous Silicon

Abstract: Depot electrolytique de nickel, a partir d'un electrolyte de composition: NiSO 4 0,2 M, 6H 2 O, perchlorate de tetraethylammonium 0,1 M; le solvant est un melange 85% d'ethyleneglycol et 15% d'eau desionisee

Bath and process for plating lead and lead/tin alloys

Abstract: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Auto-selective metal deposition on dielectric surfaces

Abstract: A method of plating a pattern of metal (e.g. copper or nickel) on a dielectric surface, i.e. surface of a dielectric material such as a synthetic resin or ceramic. The method comprises the preliminary step of masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at those areas. The treated dielectric surface is contacted with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at those catalized areas, thereby forming the pattern of metal desired on the dielectric surface.

Bath and process for plating tin, lead and tin-lead alloys

Abstract: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Cyclic Pulse Voltammetric Stripping Analysis of Acid Copper Plating Baths

Abstract: A pulse voltammetric stripping method is described for determining the absolute concentration of proprietary additive in acid copper baths containing contaminants derived from circuit board plating. Results are presented for both freshly prepared and production baths, and a comparison is made between the pulse and linear sweep voltammetric stripping analysis techniques.

Commercial nickel phosphorus electroplating

Abstract: A plating bath for nickel and/or cobalt phosphorus amorphous alloy coating can last almost indefinitely. The anode current density of the bath is controlled so as to maintain the amount of phosphoric acid in the bath constant, and less than a level (e.g. around 0.5 molar) at which it has significant deleterious effects on the bath, i.e. maintaining the free acid concentration in the bath in an acid titer range of about 9-14. The anode current density is maintained at about 200 amperes per square foot or greater, and preferably about 500 amperes per square foot or greater, by employing an anode construction that comprises a plurality of widely spaced strips (e.g. wires) of platinum or rhodium; e.g. platinum wires each having a diameter of about 0.010 inches and, for example, a length of about 3.2 inches, and disposed vertically and generally parallel to, but spaced from, a face of a cathode-workpiece that is to be plated with nickel phosphorus, cobalt phosphorus, or nickel/cobalt phosphorus. The anode alternatively may comprise a wire extending in zig-zag fashion between a pair of spaced bus bars. The methods according to the invention are particularly useful for plating fluid jet orifice plates, electrical contacts, carbon steel or stainless steel cutlery, aluminum articles, cookware substrates (such as aluminum, stainless steel, copper, iron, or cast iron substrates), magnetic or magnetizable material such as computer memory storage discs, and wear surfaces such as thrust bearings, shafts for high speed machinery, or the like.

Method of plating plastics

Abstract: A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with the substrate for the passage of electrical current therebetween; electrolessly depositing a thin layer of metal selected from the group consisting of copper, nickel, cobalt and mixtures thereof on a surface of the plastic substrate; positioning the supported substrate in an electroplating bath including from about 10.0 to about 45.0 g/l of copper ions, at least one acid selected from the group consisting of sulfuric acid, fluoroboric acid and sulfamic acid, with the acid being present in an amount sufficient to cause the electroplating bath to have a conductivity ranging from about 0.40 to about 0.60 mhos and from about 30 to about 150 mg/l of chloride ions; and passing electrical current through the bath so as to cause a layer of copper to be electrolytically deposited over the layer of electrolessly deposited metal.

Deposition of patterns using laser ablation

Abstract: 57 An improved technique is described for the formation of conducting patterns on substrates. This technique has particular utility in the provision of "seeding" layers which are often used as catalysis for electroless deposition of an overlying metal layer. The seed layer is provided by casting a polymer containing a seed constituent onto a substrate, after which the polymer is ablatively photodecomposed by far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to create ablative photodecomposition. This exposes the seed constituent in the polymer in the irradiated areas. Electroless plating of a metal can then occur, the plating being limited to only those areas which have been selectively exposed by the laser irradiation. Thus, a seed layer is prepared by dry processing, in ( contrast with previous techniques using plating solutions to provide the seed layer.

Monolithic capacitor edge termination

Abstract: Edge termination of monolithic capacitors having thin electrode layers bonded in dielectric resin is accomplished by ashing away some resin to expose electrode edge surfaces, plating the edge surfaces by vapor deposition, and depositing a conductive layer on the coating by electroless plating, schooping or applying conductive epoxy.

Method for selectively plating plastics

Abstract: A method for plating first selected surfaces of a platable plastic substrate without plating second selected surfaces is disclosed. The method comprises first electrolessly plating the substrate to provide an electroless metal layer over all of the first selected surfaces and at least a portion of the second selected surfaces. The substrate is then mounted on an electroplating rack so that the current density at the second selected surfaces is lower during electroplating than at the first selected surfaces. The substrate is then electroplated to provide one or more intermediate metal layers which extends over at least all of the first selected surfaces and then electroplated with a final metal different from the metals of the electroless and intermediate layers at a voltage whereby the final metal deposits over the first selected surfaces but not over the second selected surfaces. The electroplated substrate is then immersed in a stripping solution which dissolves the electroless and intermediate metals but not the final metal for a time sufficient to dissolve the electroless and intermediate metals covering the second selected surfaces.

Bath and process for electroplating tin, lead and tin/alloys

Abstract: The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.

Summary Abstract: Properties of ion plated oxide films

Abstract: Films of sio, AlzOJ, z-o, rs,o; and Ti02 on unheated glass and steel substrates were prepared by reactive ion plating starting from molten metals. Coating was performed in a modified Balzers BAK 760 box coater. For evaporation, an electron beam evaporator with a positive crucible functioning as the anode for a low voltage ion souree was used.1•2 In this way during evaporation an appreciable amount of coating material ions 1Vereformed. The substrates were mounted at an electrically insulated holder. Immersed into the plasma, they received a negative self-biasing potential of a few tens of volts which was sufficient for plating. J Electron diffraction experiments on deposits made in this deviee showed that with the exception of'the glassy SiOz films all other films had an extremely fine grained and highly disordered polycrystalline structure. Transmission electron microscopy (TEM) and secondary emission microseopy (SEM) investigations of the film surface and cross section as well as sorption experiments with water vapor showed a smooth film surface and a very compact and dense film microstructure. In this respect ion plated films appeared to be similar to plasma sputtered films, whereas reactively evaporated films were found to be less dense and had a coarser morphology. This can be seen in Figs. land 2. Ion plated oxide films were fully oxidized and showed in their high transmittance range no absorption detectable with intensity measurement methods. A remarkable property was their refractive index. As a consequence of the dense microstructure, the Indices ofthe films were very near to that ofthe corresponding bulk materials as can be seen in Table 1. Plasma diode sputtered films showed similar results." High rate planar magnetron sputtered films, however, may show lower refractive index values! due to the lower discharge voltage and lower partiele energy in this deposition process. Low particle energy is also responsible for the low index values found with evaporated films. Substrates are

Nickel plating of refractory metals

Abstract: An improved method of depositing nickel on a clean refractory metal surface to form a multilayer article is disclosed, wherein the full thickness of nickel can be plated prior to the intermetallic bonding of the metals The metal surface is cleaned and etched prior to the application of a first layer of nickel on the surface by electroplating means After the article is rinsed, a second layer of nickel is applied to the first layer of nickel by electroplating means The article is then heated in the absence of air to cause intermetallic bonding between nickel and the refractory metal substrate