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A. Ivankovic
Researcher at Katholieke Universiteit Leuven
Publications - 18
Citations - 234
A. Ivankovic is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Finite element method & Stress (mechanics). The author has an hindex of 10, co-authored 18 publications receiving 220 citations.
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Proceedings ArticleDOI
Copper through silicon via induced keep out zone for 10nm node bulk FinFET CMOS technology
W. Guo,Victor Moroz,G. Van der Plas,Munkang Choi,Augusto Redolfi,Louisa Smith,Geert Eneman,S. Van Huylenbroeck,P. D. Su,A. Ivankovic,B. De Wachter,Ingrid Debusschere,K. Croes,I. De Wolf,Abdelkarim Mercha,Gerald Beyer,Bart Swinnen,Eric Beyne +17 more
TL;DR: In this paper, the authors provide the first comprehensive and early guidelines for TSV integration in 10nm node bulk FinFET technology and provide an analytic compact model to derive the first TSV proximity induced keep out zone guidelines for scaled Fin-FET technologies.
Proceedings ArticleDOI
Impact of through silicon via induced mechanical stress on fully depleted Bulk FinFET technology
Wei Guo,G. Van der Plas,A. Ivankovic,Vladimir Cherman,Geert Eneman,B. De Wachter,M. Togo,Augusto Redolfi,Stefan Kubicek,Yann Civale,Thomas Chiarella,Bart Vandevelde,K. Croes,I. De Wolf,Ingrid Debusschere,Abdelkarim Mercha,Aaron Thean,Gerald Beyer,Bart Swinnen,Eric Beyne +19 more
TL;DR: In this paper, the impact of thermo-mechanically induced stresses by copper through-silicon vias, TSVs, on fully depleted Bulk FinFET devices is investigated.
Proceedings ArticleDOI
3D stacking induced mechanical stress effects
Vladimir Cherman,G. Van der Plas,J. De Vos,A. Ivankovic,Melina Lofrano,V. Simons,Mireia Bargallo Gonzalez,Kris Vanstreels,Teng Wang,R. Daily,W. Guo,Gerald Beyer,A. La Manna,I. De Wolf,Eric Beyne +14 more
TL;DR: In this paper, the effects of 3D stacking technology on the performance of devices are systematically studied and a special chip consisting of a number of stress sensors and vertical interconnect loops was designed and manufactured in 65 nm technology.
Proceedings ArticleDOI
Analysis of microbump induced stress effects in 3D stacked IC technologies
A. Ivankovic,G. Van der Plas,Victor Moroz,Munkang Choi,Vladimir Cherman,Abdelkarim Mercha,Pol Marchal,Mireia Bargallo Gonzalez,Geert Eneman,W. Zhang,T. Buisson,Mikael Detalle,A. La Manna,Diederik Verkest,Gerald Beyer,Eric Beyne,Bart Vandevelde,I. De Wolf,Dirk Vandepitte +18 more
TL;DR: This work quantifies the stress and its effects associated with Cu microbumps and their interaction with underfill material in 3D stacks by using a combined experimental and theoretical approach and finds that the FET current shifts reach over 40% due to the impact of stress.
Proceedings ArticleDOI
Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies
Mireia Bargallo Gonzalez,Bart Vandevelde,A. Ivankovic,Vladimir Cherman,B. Debecker,Melina Lofrano,I. De Wolf,Gerald Beyer,Bart Swinnen,Zsolt Tokei,Eric Beyne +10 more
TL;DR: In this article, the residual stresses generated during different processing steps and during thermal cycling of 3D stack packages, mimicking its service life, are quantified by Finite Element Modeling (FEM) together with measurements of dedicated FET arrays used as CPI sensors.