We describe a distributed position-based network protocol optimized for minimum energy consumption in mobile wireless networks that support peer-to-peer communications. Given any number of randomly deployed nodes over an area, we illustrate that a simple local optimization scheme executed at each node guarantees strong connectivity of the entire network and attains the global minimum energy solution for stationary networks. Due to its localized nature, this protocol proves to be self-reconfiguring and stays close to the minimum energy solution when applied to mobile networks. Simulation results are used to verify the performance of the protocol.

Minimum energy mobile wireless networks

We describe a distributed position-based network protocol optimized for minimum energy consumption in mobile wireless networks that support peer-to-peer communications. Given any number of randomly deployed nodes over an area, we show that a simple local optimization scheme executed at each node guarantees strong connectivity of the entire network and attains the global minimum energy solution for the stationary case. Due to its localized nature, this protocol proves to be self-reconfiguring and stays close to the minimum energy solution when applied to the case of mobile nodes. Our simulations verify its performance.

The concept of concurrent multiband low-noise-amplifiers (LNAs) is introduced. A systematic way to design concurrent multiband integrated LNAs in general is developed. Applications of concurrent multiband LNAs in concurrent multiband receivers together with receiver architecture are discussed. Experimental results of a dual-band LNA implemented in a 0.35-/spl mu/m CMOS technology as a demonstration of the concept and theory is presented.

/pdf/concurrent-multiband-low-noise-amplifiers-theory-design-and-1iy48rdapl.pdf

Concurrent multiband low-noise amplifiers-theory, design, and applications

A highly integrated 175-GHz 035-/spl mu/m CMOS transmitter is described The I/Q modulator-based transmitter facilitates integration through the use of a unique mixer, termed a harmonic-rejection mixer, and a wide loop bandwidth phase-locked loop (PLL) for the RF synthesizer The harmonic-rejection mixers are used to eliminate the need for a discrete IF filter and the use of a wide loop bandwidth PLL allowed for the complete integration of the synthesizers using low-Q components while achieving low phase noise The entire transmit signal path from the digital-to-analog converters to the power amplifier, including two fully integrated frequency synthesizers, is integrated into a single-chip solution The transmitter was tested with a testing buffer before the power amplifier (PA) and achieved less than 13/spl deg/ rms phase error when modulating a DCS-1800 GMSK signal The prototype consumed 151 mA from a 3-V supply A class-C PA, capable of driving 25 dBm off-chip, was included and the output was compared to the testing buffer with little change in the transmitter performance

A 1.75 GHz highly-integrated narrow-band CMOS transmitter with harmonic-rejection mixers

A truly modular and power-scalable architecture for low-power programmable frequency dividers is presented. The architecture was used in the realization of a family of low-power fully programmable divider circuits, which consists of a 17-bit UHF divider, an 18-bit L-band divider, and a 12-bit reference divider. Key circuits of the architecture are 2/3 divider cells, which share the same logic and the same circuit implementation. The current consumption of each cell can be determined with a simple power optimization procedure. The implementation of the 2/3 divider cells is presented, the power optimization procedure is described, and the input amplifiers are briefly discussed. The circuits were processed in a standard 0.35 /spl mu/m bulk CMOS technology, and work with a nominal supply voltage of 2.2 V. The power efficiency of the UHF divider is 0.77 GHz/mW, and of the L-band divider, 0.57 GHz/mW. The measured input sensitivity is >10 mV rms for the UHF divider, and >20 mV rms for the L-band divider.

A family of low-power truly modular programmable dividers in standard 0.35-/spl mu/m CMOS technology

This paper describes a CMOS low-noise amplifier (LNA) and mixer intended for use in the front-end of a global positioning system (GPS) receiver. The circuits were implemented in a standard 0.35-/spl mu/m (drawn) CMOS process, with one poly and two metal layers. The LNA has a forward gain (S21) of 17 dB and a noise figure of 3.8 dB. The mixer has a voltage conversion gain of -3.6 dB and a third-order intermodulation intercept point (IP3) of 10 dBm, input referred. The combination draws 12 mW from a 1.5-V supply.

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A 12 mW wide dynamic range CMOS front end for a portable GPS receiver

This paper presents a 115-mW Global Positioning System radio receiver that is implemented in a 0.5-/spl mu/m CMOS technology. The receiver includes the complete analog signal path, comprising a low-noise amplifier, I-Q mixers, on-chip active filters, and 1-bit analog-digital converters. In addition, it includes a low-power phase-locked loop that synthesizes the first local oscillator. The receiver achieves a 2.8-dB noise figure (prelimiter), a 56-dB spurious-free dynamic range, and a 17-dB signal-to-noise ratio for a noncoherent digital back-end implementation when detecting a signal power of -130 dBm at the radio-frequency input.

/pdf/a-115-mw-0-5-spl-mu-m-cmos-gps-receiver-with-wide-dynamic-4tf2xfe1u1.pdf

A 115-mW, 0.5-/spl mu/m CMOS GPS receiver with wide dynamic-range active filters

A fully integrated OC-768 clock and data recovery IC with SFI-5 1:16 demultiplexer is designed in a 120-GHz/100-GHz (f/sub T//f/sub MAX/) SiGe technology. The 16 2.5-Gb/s outputs and additional deskew channel are compliant with the Serdes Framer Implementation Agreement Level 5 specification. The measured bit-error rate is <10/sup -15/. The measured jitter tolerance exceeds the mask specified in G.8251. The IC operates with 1.8-V and -5.2-V supplies and dissipates 7.5 W.

A 40-43-Gb/s clock and data recovery IC with integrated SFI-5 1:16 demultiplexer in SiGe technology

Linear integrated circuit capacitors having greater capacitance per unit area by using lateral flux. One embodiment comprises a two metal layer capacitor wherein each metal layer is comprised of two capacitor conductive components. The capacitor conductive components are cross-coupled so that the total capacitance is the sum of the vertical flux between the metal layers, and the lateral flux along the edges between the two capacitor conductive components in each of the metal layers. The lateral flux between the capacitor conductive components in a single metal layer increases the capacitance per unit area and decreases the bottom-plate parasitic capacitance. Increasing the length of the common edge formed by capacitor conductive components in a metal layer increases the capacitance per unit area. In one lateral flux capacitor, each metal layer is comprised of a plurality of rows, alternate rows are coupled together such that lateral flux is generated between each of the rows. The rows are also cross-coupled with rows in adjacent metal layers to provide vertical flux. Fractal shapes can be used to maximize the length of the perimeter of adjacent capacitor conductive components in a single metal layer. The Koch Islands and Minkowski Sausage families of fractals are particularly well suited for generating capacitor conductive component perimeter shapes. These fractals are generated by selecting an initiator shape and repeatedly applying a generator. The fractal shapes are generated by a computer program based upon user input parameters.

Method and apparatus for a lateral flux capacitor

In this paper, we present two copackaged ICs that provide complete OC-768 16:1 multiplexer (MUX) and clock multiplying unit (CMU) functionality. The 17-input 2.5-2.68-Gb/s parallel interface is Serdes Framer Interface Level 5 (SFI-5) compliant while the 40-43-Gb/s output satisfies OC-768 jitter generation specifications with 7 dB of margin. The system architecture and two-chip partitioning are discussed, followed by descriptions of the design challenges including SFI-5 compliance, 40-Gb/s MUX timing, and 20-GHz clock generation. A novel technique for stabilizing timing margins in the final high-speed multiplexer stage using in-phase and quadrature clocks is also presented. This chipset accommodates 11 bits of static skew and 21 bits of dynamic wander at the SFI-5 interface, while generating 125 fs rms of random jitter and 3.1 ps peak-to-peak of deterministic jitter at its 40-43-Gb/s outputs. The measured bit-error ratio is less than 10/sup -15/ for 2/sup 31/-1 PRBS data and is measurement time limited. The two chips occupy 15.6 mm/sup 2/ and 8.25 mm/sup 2/ of die area. Both are implemented in a 120-GHz f/sub T/ SiGe BiCMOS process.

A. Shahani

Papers

A 12 mW wide dynamic range CMOS front end for a portable GPS receiver

A 115-mW, 0.5-/spl mu/m CMOS GPS receiver with wide dynamic-range active filters

A 40-43-Gb/s clock and data recovery IC with integrated SFI-5 1:16 demultiplexer in SiGe technology

Method and apparatus for a lateral flux capacitor

40-43-Gb/s OC-768 16:1 MUX/CMU chipset with SFI-5 compliance