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Claudia Wiemer

Researcher at Olivetti

Publications -  143
Citations -  3034

Claudia Wiemer is an academic researcher from Olivetti. The author has contributed to research in topics: Thin film & Atomic layer deposition. The author has an hindex of 31, co-authored 136 publications receiving 2722 citations. Previous affiliations of Claudia Wiemer include École Polytechnique Fédérale de Lausanne & Vilnius University.

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Proceedings ArticleDOI

Conductive-filament switching analysis and self-accelerated thermal dissolution model for reset in NiO-based RRAM

TL;DR: In this article, a detailed characterization and modeling of reset operation in resistive-switching memories based on metal oxides is presented, and the scaling of programming current is investigated by means of reduction of conductive filament cross-section.
Journal ArticleDOI

Amorphization dynamics of Ge2Sb2Te5 films upon nano-and femtosecond laser pulse irradiation

TL;DR: In this article, the role of the pulse duration and laser fluence on the dynamics of the phase change and the degree of amorphization was discussed, and several advantageous features of femtosecond compared to nanosecond laser-induced amorphisation were identified.
Journal ArticleDOI

Atomic-layer deposition of Lu2O3

TL;DR: In this article, the growth by atomic-layer deposition of lutetium oxide films using the dimeric {[C5H4(SiMe3)]2LuCl}2 complex, which has been synthesized for this purpose, and H2O was reported.
Journal ArticleDOI

Electronic states and mechanical properties in transition metal nitrides

TL;DR: In this article, a summary of recent relevant results on the structural, mechanical, electronic and optical properties of fcc TiN, VN, CrN, NbN, W2N, and some ternary nitrides in the form of sputtered thin films is presented.
Journal ArticleDOI

Combining grazing incidence X-ray diffraction and X-ray reflectivity for the evaluation of the structural evolution of HfO2 thin films with annealing

TL;DR: In this paper, X-ray reflectivity (XRR) data were fitted in order to evaluate the thickness, the surface roughness and the interface stability upon thermal processing between 300 and 1050 8C.