E
En-Tang Kang
Researcher at National University of Singapore
Publications - 776
Citations - 41433
En-Tang Kang is an academic researcher from National University of Singapore. The author has contributed to research in topics: Polymerization & Surface modification. The author has an hindex of 97, co-authored 763 publications receiving 38498 citations. Previous affiliations of En-Tang Kang include University at Buffalo & Beijing University of Chemical Technology.
Papers
More filters
Journal ArticleDOI
High-Density Three-Dimensional Network of Covalently Linked Nitric Oxide Donors to Achieve Antibacterial and Antibiofilm Surfaces.
TL;DR: In this article, a 3D network of covalently linked S-nitrosothiol (RSNO) is used to produce a high-density polyurethane (PU) surface.
Journal ArticleDOI
Electrical and thermal stability of chemically synthesized conductive polypyrrole-halogen complexes
TL;DR: In this paper, the thermal and electrical properties of polypyrrole (PPY)-halogen complexes were studied by thermogravimetry while the electrical stability was characterized by electrical conductivity measurements at various temperatures and current loadings, as well as cyclic voltammetry.
Journal ArticleDOI
Thermal imidization of poly(amic acid) on Si(100) surface modified by plasma polymerization of glycidyl methacrylate
TL;DR: In this article, the epoxide functional groups of the plasma-polymerized GMA (pp-GMA) could be preserved, to a large extent, through the control of the glow discharge parameters, such as the radiofrequency (RF) power, carrier gas flow rate, system pressure, and monomer temperature.
Journal ArticleDOI
Thermal imidization of poly(amic acid) precursors on glycidyl methacrylate (GMA) graft-polymerized aluminium and copper surfaces
TL;DR: In this article, a novel method was developed to achieve good adhesion of polyimides (PI, Kapton HN ® ) and fluorinated polyimide (FPI) on aluminium and copper surfaces via thermal imidization of the respective poly(amic acid) (PAA) and FPI precursors onto the glycidyl methacrylate (GMA) graft-polymerized aluminum and copper substrates.
Journal ArticleDOI
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper
TL;DR: In this article, the structure and chemical composition of the graft copolymerized surfaces and interfaces of the glass fiber-reinforced and epoxy-based FR-4 substrates were studied by X-ray photoelectron spectroscopy (XPS).