F
Francis Calmon
Researcher at Institut des Nanotechnologies de Lyon
Publications - 85
Citations - 420
Francis Calmon is an academic researcher from Institut des Nanotechnologies de Lyon. The author has contributed to research in topics: CMOS & Substrate coupling. The author has an hindex of 9, co-authored 80 publications receiving 365 citations. Previous affiliations of Francis Calmon include Institut national des sciences Appliquées de Lyon & University of Lyon.
Papers
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Journal ArticleDOI
Miniaturized tunable terahertz antenna based on graphene
TL;DR: In this article, a tunable terahertz nanoantenna based on graphene is presented, which has a characteristic of dynamic fre- quency reconfiguration, high miniaturization, easy integration, low reflection coefficient, and good omnidirectional radiation pattern.
Journal ArticleDOI
Time-Dependent Many-Particle Simulation for Resonant Tunneling Diodes: Interpretation of an Analytical Small-Signal Equivalent Circuit
Fabio L. Traversa,E. Buccafurri,A. Alarcon,Guillermo Albareda,Raphael Clerc,Francis Calmon,A. Poncet,Xavier Oriols +7 more
TL;DR: In this article, a full many-particle (beyond the mean-field approximation) electron quantum-transport simulator is used to analyze the transient current response of resonant tunneling diodes (RTDs).
Journal ArticleDOI
A Simple Way for Substrate Noise Modeling in Mixed-Signal ICs
Olivier Valorge,C. Andrei,Francis Calmon,Jacques Verdier,Christian Gontrand,Pierre Dautriche +5 more
TL;DR: The aim of this study is to predict the perturbations induced by digital commutations flowing through the substrate to reach sensitive analog blocks to lead to the conception of an optimized version of the same circuit that induces less parasitic substrate voltages.
Proceedings ArticleDOI
3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies
P. Coudrain,D. Henry,A. Berthelot,Jean Charbonnier,Sophie Verrun,R. Franiatte,N. Bouzaida,G. Cibrario,Francis Calmon,Ian O'Connor,Thierry Lacrevaz,L. Fourneaud,Bernard Flechet,N. Chevrier,Alexis Farcy,O. Le-Briz +15 more
TL;DR: In this paper, the prototype of a 3D circuit in which a Wafer Level Packaged CMOS image sensor is vertically assembled with an image signal processor in a face-to-back integration scheme is presented.
Proceedings ArticleDOI
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking
E. Eid,Thierry Lacrevaz,S. de Rivaz,Cedric Bermond,Bernard Flechet,Francis Calmon,Christian Gontrand,Alexis Farcy,L. Cadix,Pascal Ancey +9 more
TL;DR: Predictive HF electrical simulations are achieved by full wave analysis in order to make obvious the coupling effect due to TSVs presence.