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Jacques C. Rudell

Researcher at University of Washington

Publications -  72
Citations -  2189

Jacques C. Rudell is an academic researcher from University of Washington. The author has contributed to research in topics: CMOS & Amplifier. The author has an hindex of 18, co-authored 69 publications receiving 1974 citations. Previous affiliations of Jacques C. Rudell include University of California, Berkeley & University of California.

Papers
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Journal ArticleDOI

A 1.9-GHz wide-band IF double conversion CMOS receiver for cordless telephone applications

TL;DR: A description is given of a wide-band IF with double conversion architecture which eliminates the need for the discrete-component noise and IF filters in addition to facilitating the eventual integration of the frequency synthesizer blocks with on-chip VCO's.
Journal ArticleDOI

A 1.75 GHz highly-integrated narrow-band CMOS transmitter with harmonic-rejection mixers

TL;DR: In this paper, a highly integrated 175 GHz 035/spl µ/m CMOS transmitter is described, which facilitates integration through the use of a unique mixer, termed a harmonic-rejection mixer, and a wide loop bandwidth phase-locked loop (PLL) for the RF synthesizer.
Proceedings ArticleDOI

A 1.9 GHz wide-band IF double conversion CMOS integrated receiver for cordless telephone applications

TL;DR: In this article, the carrier signal at the LNA input and a 10 b digital baseband waveform were combined with a wideband intermediate frequency double conversion (WBIFDC) architecture to eliminate the need for external narrowband IF filters.
Journal ArticleDOI

A Class-G Switched-Capacitor RF Power Amplifier

TL;DR: A switched-capacitor power amplifier that realizes an envelope elimination and restoration/polar class-G topology is introduced and a novel voltage-tolerant switch enables the use of two power supply voltages which increases efficiency and output power simultaneously.
Proceedings ArticleDOI

Recent developments in high integration multi-standard CMOS transceivers for personal communication systems

TL;DR: Issues associated with the integration of transceiver components on a single silicon substrate are discussed and recently proposed receiver and transmitter architectures for high integration are examined on the promise of providing multistandard capability.