In the past several years, research in each of the wide‐band‐gap semiconductors, SiC, GaN, and ZnSe, has led to major advances which now make them viable for device applications. The merits of each contender for high‐temperature electronics and short‐wavelength optical applications are compared. The outstanding thermal and chemical stability of SiC and GaN should enable them to operate at high temperatures and in hostile environments, and also make them attractive for high‐power operation. The present advanced stage of development of SiC substrates and metal‐oxide‐semiconductor technology makes SiC the leading contender for high‐temperature and high‐power applications if ohmic contacts and interface‐state densities can be further improved. GaN, despite fundamentally superior electronic properties and better ohmic contact resistances, must overcome the lack of an ideal substrate material and a relatively advanced SiC infrastructure in order to compete in electronics applications. Prototype transistors have been fabricated from both SiC and GaN, and the microwave characteristics and high‐temperature performance of SiC transistors have been studied. For optical emitters and detectors, ZnSe, SiC, and GaN all have demonstrated operation in the green, blue, or ultraviolet (UV) spectra. Blue SiC light‐emitting diodes (LEDs) have been on the market for several years, joined recently by UV and blue GaN‐based LEDs. These products should find wide use in full color display and other technologies. Promising prototype UV photodetectors have been fabricated from both SiC and GaN. In laser development, ZnSe leads the way with more sophisticated designs having further improved performance being rapidly demonstrated. If the low damage threshold of ZnSe continues to limit practical laser applications, GaN appears poised to become the semiconductor of choice for short‐wavelength lasers in optical memory and other applications. For further development of these materials to be realized, doping densities (especially p type) and ohmic contact technologies have to be improved. Economies of scale need to be realized through the development of larger SiC substrates. Improved substrate materials, ideally GaN itself, need to be aggressively pursued to further develop the GaN‐based material system and enable the fabrication of lasers. ZnSe material quality is already outstanding and now researchers must focus their attention on addressing the short lifetimes of ZnSe‐based lasers to determine whether the material is sufficiently durable for practical laser applications. The problems related to these three wide‐band‐gap semiconductor systems have moved away from materials science toward the device arena, where their technological development can rapidly be brought to maturity.

Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

In this review article a comprehensive analysis of the developments in ultraviolet (UV) detector technology is described. At the beginning, the classification of UV detectors and general requirements imposed on these detectors are presented. Further considerations are restricted to modern semiconductor UV detectors, so the basic theory of photoconductive and photovoltaic detectors is presented in a uniform way convenient for various detector materials. Next, the current state of the art of different types of semiconductor UV detectors is presented. Hitherto, the semiconductor UV detectors have been mainly fabricated using Si. Industries such as the aerospace, automotive, petroleum, and others have continuously provided the impetus pushing the development of fringe technologies which are tolerant of increasingly high temperatures and hostile environments. As a result, the main efforts are currently directed to a new generation of UV detectors fabricated from wide band‐gap semiconductors the most promising ...

Semiconductor ultraviolet detectors

Silicon carbide (SiC), a material long known with potential for high-temperature, high-power, high-frequency, and radiation hardened applications, has emerged as the most mature of the wide-bandgap (2.0 eV ≲ Eg ≲ 7.0 eV) semiconductors since the release of commercial 6HSiC bulk substrates in 1991 and 4HSiC substrates in 1994. Following a brief introduction to SiC material properties, the status of SiC in terms of bulk crystal growth, unit device fabrication processes, device performance, circuits and sensors is discussed. Emphasis is placed upon demonstrated high-temperature applications, such as power transistors and rectifiers, turbine engine combustion monitoring, temperature sensors, analog and digital circuitry, flame detectors, and accelerometers. While individual device performances have been impressive (e.g. 4HSiC MESFETs with fmax of 42 GHz and over 2.8 W mm−1 power density; 4HSiC static induction transistors with 225 W power output at 600 MHz, 47% power added efficiency (PAE), and 200 V forward blocking voltage), material defects in SiC, in particular micropipe defects, remain the primary impediment to wide-spread application in commercial markets. Micropipe defect densities have been reduced from near the 1000 cm−2 order of magnitude in 1992 to 3.5 cm−2 at the research level in 1995.

Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review

Industries such as the automotive, aerospace or military, as well as environmental and biological research have promoted the development of ultraviolet (UV) photodetectors capable of operating at high temperatures and in hostile environments. UV-enhanced Si photodiodes are hence giving way to a new generation of UV detectors fabricated from wide-bandgap semiconductors, such as SiC, diamond, III-nitrides, ZnS, ZnO, or ZnSe. This paper provides a general review of latest progresses in wide-bandgap semiconductor photodetectors.

https://iopscience.iop.org/article/10.1088/0268-1242/18/4/201/pdf

Wide-bandgap semiconductor ultraviolet photodetectors

We have studied the electrical characteristics and optical properties of GaN/InGaN multiple quantum well (MQW) light-emitting diodes (LEDs) grown by metalorganic chemical vapor deposition. It appears that there is an essential link between material quality and the mechanism of current transport through the wide-bandgap p-n junction. Tunneling behavior dominates throughout all injection regimes in a device with a high density of defects in the space-charge region, which act as deep-level carrier traps. However, in a high-quality LED diode, temperature-dependent diffusion-recombination current has been identified with an ideality factor of 1.6 at moderate biases. Light output has been found to follow a power law, i.e., L /spl prop/ I/sup m/ in both devices. In the high-quality LED, nonradiative recombination centers are saturated at current densities as low as 1.4 /spl times/ 10/sup -2/ A/cm/sup 2/. This low saturation level indicates that the defects in GaN, especially the high density of edge dislocations, are generally optically inactive.

Diffusion and tunneling currents in GaN/InGaN multiple quantum well light-emitting diodes

SiC photodiodes were fabricated using 6 H single-crystal wafers. These devices have excellent UV responsivity characteristics and very low dark current even at elevated temperatures. The reproducibility is excellent and the characteristics agree with theoretical calculations for different device designs. The advantages of these diodes are that they will operate at high temperatures and are responsive between 200 and 400 nm and not responsive to longer wavelengths because of the wide 3-eV bandgap. The responsivity at 270 nm is between 70% and 85%. Dark-current levels have been measured as a function of temperature that are orders of magnitude below those previously reported. Thus, these diodes can be expected to have excellent performance characteristics for detection of low light level UV even at elevated temperatures. >

Silicon carbide UV photodiodes

Recent progress in silicon carbide (SiC) material has made it feasible to build power devices of reasonable current density This paper presents recent results including a comparison with state-of-the-art silicon diodes Switching losses for two silicon diodes (a fast diode, 600 V, 50 A, 60 ns Trr), an ultra-fast silicon diode (600 V, 50 A, 23 ns Trr) and a 4H-SiC diode (600 V, 50 A) are compared The effect of diode reverse recovery on the turn-on losses of a fast WARP/sup TM/ IGBT are studied both at room temperature and at 150/spl deg/C At room temperature, SiC diodes allow a reduction of IGBT turn-on losses by 25% compared to ultra-fast silicon diodes and by 70% compared to fast silicon diodes At 150/spl deg/C junction temperature, SiC diodes allow a turn-on loss reduction of 35% and 85% compared to ultra-fast and fast silicon diodes respectively The silicon and SiC diodes are used in a boost power converter with the WARP/sup TM/ IGBT to assess the overall effect of SiC diodes on the power converter characteristics Efficiency measurements at light load (100 W) and full load (500 W) are reported Although SiC diodes exhibit very low switching losses, their high conduction losses due to the high forward drop dominate the overall losses, hence reducing the overall efficiency Since this is an ongoing development, it is expected that future prototypes will have improved forward characteristics

A Comparative Evaluation of New Silicon Carbide Diodes and State-of-the-Art Silicon Diodes for Power Electronic Applications

Recent progress in silicon carbide (SiC) material has made it feasible to build power devices of reasonable current density. This paper presents recent results including a comparison with state-of-the-art silicon diodes. Switching losses for two silicon diodes (a fast diode, 600 V, 50 A, 60 ns Trr), an ultra-fast silicon diode (600 V, 50 A, 23 ns Trr) and a 4H-SiC diode (600 V, 50 A) are compared. The effect of diode reverse recovery on the turn-on losses of a fast WARP/sup TM/ IGBT are studied both at room temperature and at 150/spl deg/C. At room temperature, SiC diodes allow a reduction of IGBT turn-on losses by 25% compared to ultra-fast silicon diodes and by 70% compared to fast silicon diodes. At 150/spl deg/C junction temperature, SiC diodes allow a turn-on loss reduction of 35% and 85% compared to ultra-fast and fast silicon diodes respectively. The silicon and SiC diodes are used in a boost power converter with the WARP/sup TM/ IGBT to assess the overall effect of SiC diodes on the power converter characteristics. Efficiency measurements at light load (100 W) and full load (500 W) are reported. Although SiC diodes exhibit very low switching losses, their high conduction losses due to the high forward drop dominate the overall losses, hence reducing the overall efficiency. Since this is an ongoing development, it is expected that future prototypes will have improved forward characteristics.

A comparative evaluation of new silicon carbide diodes and state-of-the-art silicon diodes for power electronic applications

Blue and near-ultraviolet (UV) InGaN/GaN multiple-quantum-well light-emitting diodes (LEDs) with peak emission at 465 nm and 405 nm, respectively, were grown on GaN and sapphire substrates. The densities of surface and bulk defects in the homoepitaxially grown LEDs were substantially reduced, leading to a decrease in reverse currents by more than six orders of magnitude. At a typical operating current of 20 mA, the internal quantum efficiency of the UV LED on GaN was twice as high compared to the UV LED on sapphire, whereas the performance of the blue LEDs was found to be comparable. This suggests that the high-density dislocations are of greater influence on the light emission of the UV LEDs due to less In-related localization effects. At high injection currents, both the blue and UV LEDs on GaN exhibited much higher output power than the LEDs on sapphire as a result of improved heat dissipation and current spreading.

James W. Kretchmer

Papers

Diffusion and tunneling currents in GaN/InGaN multiple quantum well light-emitting diodes

Silicon carbide UV photodiodes

A Comparative Evaluation of New Silicon Carbide Diodes and State-of-the-Art Silicon Diodes for Power Electronic Applications

A comparative evaluation of new silicon carbide diodes and state-of-the-art silicon diodes for power electronic applications

Blue and near-ultraviolet light-emitting diodes on free-standing GaN substrates