Wide-band-gap GaN and Ga-rich InGaN alloys, with energy gaps covering the blue and near-ultraviolet parts of the electromagnetic spectrum, are one group of the dominant materials for solid state lighting and lasing technologies and consequently, have been studied very well. Much less effort has been devoted to InN and In-rich InGaN alloys. A major breakthrough in 2002, stemming from much improved quality of InN films grown using molecular beam epitaxy, resulted in the bandgap of InN being revised from 1.9 eV to a much narrower value of 0.64 eV. This finding triggered a worldwide research thrust into the area of narrow-band-gap group-III nitrides. The low value of the InN bandgap provides a basis for a consistent description of the electronic structure of InGaN and InAlN alloys with all compositions. It extends the fundamental bandgap of the group III-nitride alloy system over a wider spectral region, ranging from the near infrared at ∼1.9 μm (0.64 eV for InN) to the ultraviolet at ∼0.36 μm (3.4 eV for GaN...

When group-III nitrides go infrared: New properties and perspectives

Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to facilitate economic growth in a semiconductor industry that is silicon-based and currently faced with diminishing returns of performance versus cost of investment. At a material level, its high electric field strength and electron mobility have already shown tremendous potential for high frequency communications and photonic applications. Advances in growth on commercially viable large area substrates are now at the point where power conversion applications of GaN are at the cusp of commercialisation. The future for building on the work described here in ways driven by specific challenges emerging from entirely new markets and applications is very exciting. This collection of GaN technology developments is therefore not itself a road map but a valuable collection of global state-of-the-art GaN research that will inform the next phase of the technology as market driven requirements evolve. First generation production devices are igniting large new markets and applications that can only be achieved using the advantages of higher speed, low specific resistivity and low saturation switching transistors. Major investments are being made by industrial companies in a wide variety of markets exploring the use of the technology in new circuit topologies, packaging solutions and system architectures that are required to achieve and optimise the system advantages offered by GaN transistors. It is this momentum that will drive priorities for the next stages of device research gathered here.

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The 2018 GaN power electronics roadmap

J. Y. Tsao,* S. Chowdhury, M. A. Hollis,* D. Jena, N. M. Johnson, K. A. Jones, R. J. Kaplar,* S. Rajan, C. G. Van de Walle, E. Bellotti, C. L. Chua, R. Collazo, M. E. Coltrin, J. A. Cooper, K. R. Evans, S. Graham, T. A. Grotjohn, E. R. Heller, M. Higashiwaki, M. S. Islam, P. W. Juodawlkis, M. A. Khan, A. D. Koehler, J. H. Leach, U. K. Mishra, R. J. Nemanich, R. C. N. Pilawa-Podgurski, J. B. Shealy, Z. Sitar, M. J. Tadjer, A. F. Witulski, M. Wraback, and J. A. Simmons

/pdf/ultrawide-bandgap-semiconductors-research-opportunities-and-49ev1zu2ym.pdf

Ultrawide-Bandgap Semiconductors: Research Opportunities and Challenges

The quantum-confined Stark effect in single cadmium selenide (CdSe) nanocrystallite quantum dots was studied. The electric field dependence of the single-dot spectrum is characterized by a highly polarizable excited state (∼10 5 cubic angstroms, compared to typical molecular values of order 10 to 100 cubic angstroms), in the presence of randomly oriented local electric fields that change over time. These local fields result in spontaneous spectral diffusion and contribute to ensemble inhomogeneous broadening. Stark shifts of the lowest excited state more than two orders of magnitude larger than the linewidth were observed, suggesting the potential use of these dots in electro-optic modulation devices.

Quantum Confined Stark Effect in Single CdSe Nanocrystallite Quantum Dots

The excitation of surface-phonon-polariton (SPhP) modes in polar dielectric crystals and the associ- ated new developments in the field of SPhPs are reviewed. The emphasis of this work is on providing an understand- ing of the general phenomenon, including the origin of the Reststrahlen band, the role that optical phonons in polar dielectric lattices play in supporting sub-diffrac- tion-limited modes and how the relatively long opti- cal phonon lifetimes can lead to the low optical losses observed within these materials. Based on this overview, the achievements attained to date and the potential tech- nological advantages of these materials are discussed for localized modes in nanostructures, propagating modes on surfaces and in waveguides and novel metamaterial designs, with the goal of realizing low-loss nanophoton- ics and metamaterials in the mid-infrared to terahertz spectral ranges.

Low-loss, infrared and terahertz nanophotonics using surface phonon polaritons

A thermal boundary resistance (TBR) is associated with the presence of an AlN nucleation layer (NL) in AlGaN/GaN high-electron-mobility transistors (HEMTs) grown on SiC substrates, raising device temperature beyond what is expected from the simple thermal conductivities of the main device layers. TBR was found to differ by up to a factor of four between different device suppliers, all using standard metal-organic chemical vapor deposition (MOCVD) growth techniques, related to the detailed NL microstructure. Optimizing the NL crystalline structure in MOCVD could therefore significantly improve heat extraction from AlGaN/GaN HEMTs into the SiC substrate, potentially reducing peak channel temperature rise by up to 40%, significantly benefiting device reliability.

Benchmarking of Thermal Boundary Resistance in AlGaN/GaN HEMTs on SiC Substrates: Implications of the Nucleation Layer Microstructure

In order to achieve ultra-high radio frequency output power densities in GaN-based transistors new thermal management solutions must be developed for efficient heat extraction, including the use of high thermal conductivity substrates. Integration of GaN devices with the highest thermal conductivity material available, diamond, instead of the standard GaN-on-SiC, can lead to a substantial reduction in device thermal resistance. Current GaN-on-diamond transistors are shown to result in a 40% reduction in peak channel temperature when benchmarked against equivalent GaN-on-SiC transistors, with the potential for even further reductions through optimization. In order to understand the contribution of substrate and GaN/substrate interface to the device thermal resistance, a 3D Raman thermography mapping and modelling approach has been developed. The GaN/diamond interface thermal resistance is found to have the largest contribution to the thermal resistance of current GaN-on-diamond devices.

/pdf/low-thermal-resistance-gan-on-diamond-transistors-4fcr05xlx9.pdf

Low thermal resistance GaN-on-diamond transistors characterized by three-dimensional Raman thermography mapping

Integration of chemical vapor deposited polycrystalline diamond offers promising thermal performance for GaN-based high power radio frequency amplifiers. One limiting factor is the thermal barrier at the GaN to diamond interface, often referred to as the effective thermal boundary resistance (TBReff). Using a combination of transient thermoreflectance measurement, finite element modeling and microstructural analysis, the TBReff of GaN-on-diamond wafers is shown to be dominated by the SiNx interlayer for diamond growth seeding, with additional impacts from the diamond nucleation surface. By decreasing the SiNx layer thickness and minimizing the diamond nucleation region, TBReff can be significantly reduced, and a TBReff as low as 12 m2K/GW is demonstrated. This enables a major improvement in GaN-on-diamond transistor thermal resistance with respect to GaN-on-SiC wafers. A further reduction in TBReff towards the diffuse mismatch limit is also predicted, demonstrating the full potential of using diamond as the heat spreading substrate.

https://research-information.bris.ac.uk/ws/files/34955798/HS_Laser_TBR_APL_revision.pdf

Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications

We report on the development of time-resolved Raman thermography to measure transient temperatures in semiconductor devices with submicrometer spatial resolution. This new technique is illustrated for AlGaN/GaN HFETs and ungated devices grown on SiC and sapphire substrates. A temporal resolution of 200 ns is demonstrated. Temperature changes rapidly within sub-200 ns after switching the devices on or off, followed by a slower change in device temperature with a time constant of ~10 and ~140 mus for AlGaN/GaN devices grown on SiC and sapphire substrates, respectively. Heat diffusion into the device substrate is also demonstrated

Time-Resolved Temperature Measurement of AlGaN/GaN Electronic Devices Using Micro-Raman Spectroscopy

Hexagonal boron nitride (h-BN) has been predicted to exhibit an in-plane thermal conductivity as high as ~ 550 W m−1 K−1 at room temperature, making it a promising thermal management material. However, current experimental results (220–420 W m−1 K−1) have been well below the prediction. Here, we report on the modulation of h-BN thermal conductivity by controlling the B isotope concentration. For monoisotopic 10B h-BN, an in-plane thermal conductivity as high as 585 W m−1 K−1 is measured at room temperature, ~ 80% higher than that of h-BN with a disordered isotope concentration (52%:48% mixture of 10B and 11B). The temperature-dependent thermal conductivities of monoisotopic h-BN agree well with first principles calculations including only intrinsic phonon-phonon scattering. Our results illustrate the potential to achieve high thermal conductivity in h-BN and control its thermal conductivity, opening avenues for the wide application of h-BN as a next-generation thin-film material for thermal management, metamaterials and metadevices. Hexagonal boron nitride has been theoretically predicted to have high values for its thermal conductivity which would make it useful for thermal management of devices but these values have not been experimentally achieved. The authors manipulate the isotope concentration of B to increase the thermal conductivity and reach these predicted values.

/pdf/modulating-the-thermal-conductivity-in-hexagonal-boron-1srz0jvgfl.pdf

James W Pomeroy

Papers

Benchmarking of Thermal Boundary Resistance in AlGaN/GaN HEMTs on SiC Substrates: Implications of the Nucleation Layer Microstructure

Low thermal resistance GaN-on-diamond transistors characterized by three-dimensional Raman thermography mapping

Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications

Time-Resolved Temperature Measurement of AlGaN/GaN Electronic Devices Using Micro-Raman Spectroscopy

Modulating the thermal conductivity in hexagonal boron nitride via controlled boron isotope concentration