다중혈관 관상동맥 환자에서 y-문합을 이용하여 양쪽 내흉동맥만을 사용한 우회술의 조기 성적

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (e) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified.

A review of Ga2O3 materials, processing, and devices

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Guest Editorial: The dawn of gallium oxide microelectronics

Ultraviolet (UV) radiation has a variety of impacts including the health of humans, the production of crops, and the lifetime of buildings. Based on the photovoltaic effect, self-powered UV photode...

Self-Powered Ultraviolet Photodetector with Superhigh Photoresponsivity (3.05 A/W) Based on the GaN/Sn:Ga2O3 pn Junction.

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics with capabilities beyond existing technologies due to its large bandgap, controllable doping, and the availability of large diameter, relatively inexpensive substrates. These applications include power conditioning systems, including pulsed power for avionics and electric ships, solid-state drivers for heavy electric motors, and advanced power management and control electronics. Wide bandgap (WBG) power devices offer potential savings in both energy and cost. However, converters powered by WBG devices require innovation at all levels, entailing changes to system design, circuit architecture, qualification metrics, and even market models. The performance of high voltage rectifiers and enhancement-mode metal-oxide field effect transistors benefits from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. Reverse breakdown voltages of over 2 kV for β-Ga2O3 have been reported, either with or without edge termination and over 3 kV for a lateral field-plated Ga2O3 Schottky diode on sapphire. The metal-oxide-semiconductor field-effect transistors fabricated on Ga2O3 to date have predominantly been depletion (d-mode) devices, with a few demonstrations of enhancement (e-mode) operation. While these results are promising, what are the limitations of this technology and what needs to occur for it to play a role alongside the more mature SiC and GaN power device technologies? The low thermal conductivity might be mitigated by transferring devices to another substrate or thinning down the substrate and using a heatsink as well as top-side heat extraction. We give a perspective on the materials’ properties and physics of transport, thermal conduction, doping capabilities, and device design that summarizes the current limitations and future areas of development. A key requirement is continued interest from military electronics development agencies. The history of the power electronics device field has shown that new technologies appear roughly every 10-12 years, with a cycle of performance evolution and optimization. The older technologies, however, survive long into the marketplace, for various reasons. Ga2O3 may supplement SiC and GaN, but is not expected to replace them.

/pdf/perspective-ga2o3-for-ultra-high-power-rectifiers-and-xypt4r8hyf.pdf

Perspective: Ga2O3 for ultra-high power rectifiers and MOSFETS

The performance of arrays consisting of 21 β-Ga2O3 field-plated rectifiers fabricated on thick epitaxial layers (n-type carrier concentration ∼1.6 × 1016 cm−3) grown on conducting substrates (carrier concentration 3 × 1019 cm−3) is reported. We show that by interconnecting the output of 21 smaller (0.4 × 0.4 mm2 to 1 × 1 mm2, total area 0.09 cm2) individual rectifiers using e-beam deposited Au, we can achieve a high total forward output current of 33.2 A, at 4.25 V in the single-sweep voltage mode, and a low forward turn-on voltage of 2.9 V (defined at 100 A cm−2) and maintain a reverse breakdown voltage of 240 V (defined at 1 μA cm−2). The current density was 376 A cm−2, and the on-state resistance was 0.012 Ω cm2. The total forward current was 10 A at 1.9 V and 22 A at 3 V. The power figure-of-merit for the array, VB2/RON, was 4.8 MW cm−2, with a reverse recovery time of individual rectifiers of 32 ns. The on/off ratio of the rectifier array was in the range of 105–1010 for +1 V/−1 to −100 V.

Vertical geometry 33.2 A, 4.8 MW cm2 Ga2O3 field-plated Schottky rectifier arrays

AZO interlayers between n-Ga2O3 and Ti/Au metallization significantly enhance Ohmic contact formation after annealing at ≥ 300°C. Without the presence of the AZO, similar anneals produce only rectifying current-voltage characteristics. Transmission Line Measurements of the Au/Ti/AZO/Ga2O3 stacks showed the specific contact resistance and transfer resistance decreased sharply from as-deposited values with annealing. The minimum contact resistance and specific contact resistance of 0.42 Ω-mm and 2.82 × 10-5 Ω-cm2 were achieved after a relatively low temperature 400°C annealing. The conduction band offset between AZO and Ga2O3 is 0.79 eV and provides a favorable pathway for improved electron transport across this interface.

Ohmic contacts on n-type β-Ga2O3 using AZO/Ti/Au

Large area (up to 0.2 cm2) Ga2O3 rectifiers without edge termination were fabricated on a Si-doped n-Ga2O3 drift layer grown by halide vapor phase epitaxy on a Sn-doped n+Ga2O3 (001) substrate. A forward current of 2.2 A was achieved in single-sweep voltage mode, a record for Ga2O3 rectifiers. The on-state resistance was $0.26~\Omega ~ \cdot$ cm2 for these largest diodes, decreasing to $5.9\times 10^{-4} \Omega \,\, \cdot$ cm2 for $40\times 40\,\,\mu \text{m}^{2}$ devices. The temperature dependence (25 °C–125 °C) of forward current density was used to extract the barrier height of 1.08 eV for Ni and a Richardson’s constant of 48 A $\cdot$ cm−2 $\cdot \,\,\text{K}^{-2}$ . Ideality factors were in the range 1.01–1.05, with the barrier height decreasing with temperature. The reverse breakdown was a strong function of diode area, decreasing from 466 V ( $1.6\times 10^{-5}$ cm2 to 15 V for 0.2 cm2. This led to power figure-of-merits ( ${V}_{B}^{2}/\text{R}_{\mathrm{ON}})$ in the range $3.68\times 10^{8}$ –865 W $\cdot$ cm−2 over this area range. The reverse breakdown voltage scaled approximately as the contact perimeter, indicating it was dominated by the surface and decreased with temperature with a negative temperature coefficient of 0.45 V $\cdot \,\,\text{K}^{-1}$ . The reverse recovery time when switching from +1 V to reverse bias was 34 ns.

Vertical Geometry, 2-A Forward Current Ga 2 O 3 Schottky Rectifiers on Bulk Ga 2 O 3 Substrates

The use of ITO interlayers between Ga2O3 and Ti/Au metallization is shown to produce Ohmic contacts after annealing in the range of 500–600 °C. Without the ITO, similar anneals do not lead to linear current–voltage characteristics. Transmission line measurements were used to extract the specific contact resistance of the Au/Ti/ITO/Ga2O3 stacks as a function of annealing temperature. Sheet, specific contact, and transfer resistances all decreased sharply from as-deposited values with annealing. The minimum transfer resistance and specific contact resistance of 0.60 Ω mm and 6.3 × 10−5 Ω cm2 were achieved after 600 °C annealing, respectively. The conduction band offset between ITO and Ga2O3 is 0.32 eV and is consistent with the improved electron transport across the heterointerface.

Improvement of Ohmic contacts on Ga2O3 through use of ITO-interlayers

High ion density dry etching of bulk single-crystal β-Ga2O3 was carried out as a function of source power (100–800 W), chuck power (15–400 W), and frequency (13.56 or 40 MHz) in inductively coupled plasma (ICP) systems using Cl2/Ar or BCl3/Ar discharges. The highest etch rate achieved was ∼1300 A min−1 using 800 W ICP source power and 200 W chuck power (13.56 MHz) with either Cl2/Ar or BCl3/Ar. This is still a comfortably practical set of conditions, where resist reticulation does not occur because of the effective He backside cooling of the sample in the tool and the avoidance of overly high powers in systems capable of 2000 W of source power. The etching is ion-assisted and produces anisotropic pattern transfer. The etched surface may become oxygen-deficient under strong ion-bombardment conditions. Schottky diodes fabricated on these surfaces show increased ideality factors (increasing from 1.00 to 1.29 for high power conditions) and reduced barrier heights (1.1 on reference diodes to 0.86 eV for etched...

Jiancheng Yang

Papers

Vertical geometry 33.2 A, 4.8 MW cm2 Ga2O3 field-plated Schottky rectifier arrays

Ohmic contacts on n-type β-Ga2O3 using AZO/Ti/Au

Vertical Geometry, 2-A Forward Current Ga 2 O 3 Schottky Rectifiers on Bulk Ga 2 O 3 Substrates

Improvement of Ohmic contacts on Ga2O3 through use of ITO-interlayers

Inductively coupled plasma etching of bulk, single-crystal Ga2O3