K
Kenneth P. Rodbell
Researcher at IBM
Publications - 222
Citations - 5751
Kenneth P. Rodbell is an academic researcher from IBM. The author has contributed to research in topics: Electromigration & Texture (crystalline). The author has an hindex of 35, co-authored 221 publications receiving 5475 citations. Previous affiliations of Kenneth P. Rodbell include Analytical Services & GlobalFoundries.
Papers
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Low-Energy Proton Testing Using Cyclotrons Sources
Patent
Heterogeneous miniaturization platform
Qianwen Chen,Li-Wen Hung,Wanki Kim,John U. Knickerbocker,Kenneth P. Rodbell,Robert L. Wisnieff +5 more
TL;DR: In this article, a method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die, forming memory devices on an memory device die; forming component devices on component die; and forming a plurality of packing devices on packaging die.
Journal ArticleDOI
Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects
D.B. Knorr,Kenneth P. Rodbell +1 more
Patent
Automatic exchange of degraders in accelerated testing of computer chips
Carl E. Bohnenkamp,Ethan H. Cannon,Ethan W. Cascio,Michael S. Gordon,Kenneth P. Rodbell,T. H. Zabel +5 more
TL;DR: In this paper, the safety involved in swapping degraders has been discussed, as well as possible improved energy resolution and beam stability if the accelerator can be left running continuously and in-situ monitoring of beam current, beam position and stability.
Patent
Method for forming copper electric conductor inside electron structure
Panayotis C. Andricacos,Jr Cyril Cabral,Carl Parks Christopher,Kenneth P. Rodbell,En-Ruen Tsuai Roger,クリストファ・カール・パークス,ケネス・パーカー・ロッドベル,シリル・カブラル・ジュニア,パナイオティス・コンスタンチノ・アンドリカコス,ロジャー・エン−ルエン・ツァイ +9 more
TL;DR: In this article, impurities which improve the electromigraion resistance are added to the copper electric conductor after copper composition is deposited on inside a holding place, and a concentration level of the impurities is about 001ppm or about 1,000ppm.