K
Kenneth P. Rodbell
Researcher at IBM
Publications - 222
Citations - 5751
Kenneth P. Rodbell is an academic researcher from IBM. The author has contributed to research in topics: Electromigration & Texture (crystalline). The author has an hindex of 35, co-authored 221 publications receiving 5475 citations. Previous affiliations of Kenneth P. Rodbell include Analytical Services & GlobalFoundries.
Papers
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Journal ArticleDOI
Texture in multilayer metallization structures
TL;DR: In this article, the effects of thin Ti, TiN, or Ti/TiN underlayers on the development of the crystallographic texture and the grain structure are explored.
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On the use of alloying elements for Cu interconnect applications
TL;DR: In this paper, a set of 24 potential alloying elements for interconnect applications in integrated circuits is presented, including Pd, Au, Al, Ag, Nb, Cr, B, Ti, In, and Mn.
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Porosity in plasma enhanced chemical vapor deposited SiCOH dielectrics: A comparative study
Alfred Grill,Vishnubhai Vitthalbhai Patel,Kenneth P. Rodbell,E. Huang,Mikhail R. Baklanov,Konstantin P. Mogilnikov,Michael F. Toney,Hyungjun Kim +7 more
TL;DR: In this paper, the porosity of SiCOH films with k values from 2.8 to 2.05 has been investigated using positron annihilation spectroscopy, positron lifetime spectrograph, specular x-ray reflectivity, and ellipsometric porosimetry.
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The role of texture in the electromigration behavior of pure aluminum lines
D. B. Knorr,Kenneth P. Rodbell +1 more
TL;DR: In this paper, the effects of microstructure on electromigration behavior were evaluated in three nominally 1 μm thick pure aluminum films, which were tested at temperatures from 423 to 523 K. The three Al films had essentially the same grain structure but different variants of an 〈111〉 texture.
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Detection of current‐induced vacancies in thin aluminum–copper lines using positrons
TL;DR: In situ depth-resolved positron annihilation spectroscopy (PAS) is used to show dynamic formation of vacancies in 1 μm×1 μm Al−0.5 wt% Cu lines under current flow as discussed by the authors.