Nanocrystals (NCs) discussed in this Review are tiny crystals of metals, semiconductors, and magnetic material consisting of hundreds to a few thousand atoms each. Their size ranges from 2-3 to about 20 nm. What is special about this size regime that placed NCs among the hottest research topics of the last decades? The quantum mechanical coupling * To whom correspondence should be addressed. E-mail: dvtalapin@uchicago.edu. † The University of Chicago. ‡ Argonne National Lab. Chem. Rev. 2010, 110, 389–458 389

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Prospects of Colloidal Nanocrystals for Electronic and Optoelectronic Applications

Electron and ambipolar transport in organic field-effect transistors.

https://chemistry.beloit.edu/classes/nanotech/ZnO/mattoday10_05_40.pdf

ZnO - nanostructures, defects, and devices

Organic semiconducting oligomers for use in thin film transistors.

Light-Emitting Diodes. (Monographs in Electrical and Electronic Engineering.) By A. A. Bergh and P. J. Dean. Pp. viii+591. (Clarendon: Oxford; Oxford University: London, 1976.) £22.

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Light-emitting diodes

Single-crystal gallium oxide (Ga2O3) metal-oxide-semiconductor field-effect transistors were fabricated on a semi-insulating β-Ga2O3 (010) substrate. A Sn-doped n-Ga2O3 channel layer was grown by molecular-beam epitaxy. Si-ion implantation doping was performed to source and drain electrode regions for obtaining low-resistance ohmic contacts. An Al2O3 gate dielectric film formed by atomic layer deposition passivated the device surface and significantly reduced gate leakage. The device with a gate length of 2 μm showed effective gate modulation of the drain current with an extremely low off-state drain leakage of less than a few pA/mm, leading to a high drain current on/off ratio of over ten orders of magnitude. A three-terminal off-state breakdown voltage of 370 V was achieved. Stable transistor operation was sustained at temperatures up to 250 °C.

Depletion-mode Ga2O3 metal-oxide-semiconductor field-effect transistors on β-Ga2O3 (010) substrates and temperature dependence of their device characteristics

Depletion-mode field-plated Ga2O3 metal–oxide–semiconductor field-effect transistors were demonstrated for the first time. Substantial enhancement in breakdown voltage was achieved with a gate-connected field plate. The device channels, formed by selective-area Si ion implantation doping of an undoped Ga2O3 epilayer, were electrically isolated by the highly resistive epilayer without mesa etching. Effective surface passivation and high Ga2O3 material quality contributed to the absence of drain current collapse. The transistors exhibited an off-state breakdown voltage of 755 V, a high drain current on/off ratio of over $10^{9}$ , and stable high temperature operation against 300°C thermal stress.

Field-Plated Ga 2 O 3 MOSFETs With a Breakdown Voltage of Over 750 V

The process of charge injection plays an important role in organic semiconductor devices. We review various experimental techniques that allow injection to be separated from other competing processes, and quantify the injection efficiency of a contact. We discuss the dependence of the injection efficiency on parameters such as the energy barrier at the interface, the carrier mobility of the organic semiconductor, its carrier density (doping level), the presence of mobile ions, and the sample geometry. Based on these findings, we outline guidelines for forming ohmic contacts and present examples of contact engineering in organic semiconductor devices.

How To Make Ohmic Contacts to Organic Semiconductors

We describe the development of N-polar GaN-based high electron mobility transistors grown by N2 plasma-assisted molecular beam epitaxy on C-face SiC substrates. High mobility AlGaN∕GaN modulation-doped two-dimensional electron gas channels were grown, and transistors with excellent dc and small-signal performance were fabricated on these wafers. Large-signal dispersion was observed, and the trap states responsible for this were identified, and layer designs to remove the dispersive effects of these traps were demonstrated. Finally, an AlGaN-cap layer was used to reduce gate leakage in these devices, and a low-dispersion high breakdown voltage device was achieved. This detailed study of dispersion and leakage in N-polar GaN-based transistors establishes a technological base for further development of field effect devices based on N-polar III-nitrides.

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Man Hoi Wong

Papers

Depletion-mode Ga2O3 metal-oxide-semiconductor field-effect transistors on β-Ga2O3 (010) substrates and temperature dependence of their device characteristics

Field-Plated Ga 2 O 3 MOSFETs With a Breakdown Voltage of Over 750 V

Field-Plated Ga 2 O 3 MOSFETs With a Breakdown Voltage of Over 750 V

How To Make Ohmic Contacts to Organic Semiconductors

N-polar GaN∕AlGaN∕GaN high electron mobility transistors