N. Owens

TL;DR: In this article, a specialized drop-weight test was developed and, together with a conventional mechanical tester, the true stress-strain properties of four solder alloys (sn-37Pb, Sn-1.0Ag-0.1Cu, sn-3.5Ag, and Sn- 3.5Cu) were generated for strain rates in the range from 0.005 s−1 to 300 s− 1.

TL;DR: The research studies in the drop-impact reliability of solder joints in the PCB assemblies intended for mobile applications cover stress–strain characterisation of solders, evaluation of test methods at component and board levels, and investigation of the fatigue characteristics of solder Joints.

TL;DR: Wong et al. as discussed by the authors presented the constitutive properties of four solder alloys (sn37Pb, sn1.0Ag0.1, sn3.5Ag, and Sn3.6Cu) in the range of strain rates between 0.005 s−s−1 and 300 s− s−1.

TL;DR: The lack of universal correlations between the two test methods has ruled out the use of BIST for evaluating solder joint materials, but BIST is recommended as a test method for quality assurance in view of the strong correlation between the measured parameters and the failure mode.

TL;DR: In this article, high strain-rate drop impact tests were performed on ball grid array (BGA) packages with solder compositions of (in wt%) Sn-3.8Ag-0.7Cu (SnAgCu) and eutectic Sn-37Pb (SnPb).