Journal ArticleDOI
Advances in the drop-impact reliability of solder joints for mobile applications
TLDR
The research studies in the drop-impact reliability of solder joints in the PCB assemblies intended for mobile applications cover stress–strain characterisation of solders, evaluation of test methods at component and board levels, and investigation of the fatigue characteristics of solder Joints.About:
This article is published in Microelectronics Reliability.The article was published on 2009-02-01. It has received 63 citations till now. The article focuses on the topics: Test method & Direct shear test.read more
Citations
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Journal ArticleDOI
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications
Dhafer Abdulameer Shnawah,Suhana Mohd Said,Mohd Faizul Mohd Sabri,Irfan Anjum Badruddin,Fa Xing Che +4 more
TL;DR: In this article, the effect of minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact was evaluated.
Journal ArticleDOI
Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications
Dhafer Abdulameer Shnawah,Suhana Mohd Said,Mohd Faizul Mohd Sabri,Irfan Anjum Badruddin,Fa Xing Che +4 more
TL;DR: In this article, the effect of Fe addition on the microstructural, mechanical, and thermal properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy was investigated, and it was observed that the Fe-bearing solders significantly suppress the coarsening of the Ag 3 Sn IMC particles; consequently they exhibit stable mechanical properties.
Journal ArticleDOI
Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn-Ag-Cu solder alloy
Nur Aishah Aminah Mohd Amin,Dhafer Abdulameer Shnawah,Suhana Mohd Said,Mohd Faizul Mohd Sabri,Hamzah Arof +4 more
TL;DR: In this paper, the authors investigated the electrical resistivity of the high-Ag-content Sn-3Ag-05Cu, the low-Ag content Sn-1Ag-5Cu, and the high and low Ag-content Quaternary solder alloys, and found that both the Ag content and the addition of Fe significantly affected the electrical resistance.
Journal ArticleDOI
The influence of solder composition on the impact strength of lead-free solder ball grid array joints
Hideaki Tsukamoto,Tetsuro Nishimura,Shoichi Suenaga,Stuart McDonald,Keith Sweatman,Kazuhiro Nogita +5 more
TL;DR: Cu BGAs exhibit the least resistance in both shear and tensile tests among the four compositions of solders, which may result from the cracks in the IMC layers introduced during the reflow processes.
Journal ArticleDOI
Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing
Dhafer Abdulameer Shnawah,Mohd Faizul Mohd Sabri,Irfan Anjum Badruddin,Suhana Mohd Said,Tadashi Ariga,Fa Xing Che +5 more
TL;DR: In this paper, the effect of Fe on the microstructural stability, mechanical properties, and thermal behavior of low-Ag-content Sn-1Ag-0.5Cu alloy was investigated.
References
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Book ChapterDOI
Cumulative damage in fatigue
TL;DR: The aircraft designer today is faced with the necessity of estimating not only the strength of a structure, but also its life — a task with which he was not confronted before.
Proceedings ArticleDOI
BGA brittle fracture - alternative solder joint integrity test methods
TL;DR: In this article, the authors conducted a study on 27 unique package constructions, evaluated under a wide variety of test conditions, including high speed solder ball shear and pull testing.
Proceedings ArticleDOI
Drop impact test - mechanics & physics of failure
TL;DR: In this article, the physics of failure in board-level drop impact have been investigated and three finite element analyses have been performed to understand the failure in drop impact: (i) velocity impact of a PCB -model as a beam; (ii) velocity impacts of a drop assembly with centrally mounted package and (iii) impacts of solid elements with submodeling.
Journal ArticleDOI
A review of board level solder joints for mobile applications
TL;DR: This review focuses on the drop-impact reliability of lead-free solder joints that interconnect the integrated circuit (IC) component to the printed circuit board (PCB) and tin-rich lead- free solders exhibit significantly higher strain rate sensitivity than eutectic SnPb solder.