Philippe M. Vereecken

TL;DR: This work follows in real time the evolution of individual clusters, and compares their development with simulations incorporating the basic physics of electrodeposition during the early stages of growth, to analyse dynamic observations—recorded in situ using a novel transmission electron microscopy technique—of the nucleation and growth of nanoscale copper clusters during electro Deposition.

TL;DR: MOF-CVD is the first vapour-phase deposition method for any type of microporous crystalline network solid and marks a milestone in processing such materials.

TL;DR: It is shown that cuprous intermediates near the copper surface affect the overpotential and the kinetics of plating, and the additives regulate the presence of cuprous species on the surface; levelers and suppressors inhibit Cu+ formation, whereas accelerating additives enhance Cu- formation.

TL;DR: This work probes electrochemical nucleation and growth of individual nanoclusters in real time by combining current-time measurements with simultaneous video imaging and describes a significant revision to conventional models that can explain the results.

TL;DR: In this article, the authors identified a family of materials which can be directly electroplated with Cu in acidic plating baths commonly found in the microelectronics industry and demonstrated the direct plating of Cu across an 8 in. wafer without the use of a Cu seed layer.