Q
Qiao Chen
Researcher at Georgia Institute of Technology
Publications - 25
Citations - 764
Qiao Chen is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Wafer-level packaging. The author has an hindex of 14, co-authored 20 publications receiving 739 citations. Previous affiliations of Qiao Chen include Georgia Tech Research Institute & Tsinghua University.
Papers
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Proceedings ArticleDOI
Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)
TL;DR: In this article, two-dimensional thermo-mechanical Finite-element models have been built to analyze the stress/strain distribution in the TSV structures, and the models show that large stress gradients and plastic deformation exist near the corner of electroplated Cu pads.
Proceedings ArticleDOI
Through-package-via formation and metallization of glass interposers
Vijay Sukumaran,Qiao Chen,Fuhan Liu,Nitesh Kumbhat,Tapobrata Bandyopadhyay,Hunter Chan,Sung-Hwan Min,Christian Nopper,Venky Sundaram,Rao Tummala +9 more
TL;DR: In this article, a glass interposer was proposed as a superior alternative interposers technology to address the limitations of both silicon and organic interposition technology, where the inherent electrical properties of glass, together with large area panel size availability, make it superior compared to organic and silicon-based interposERS.
Journal ArticleDOI
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test
TL;DR: Fracture analysis results match the experimental observations, and provide insight on the reason behind different failure mechanisms, and agree well for elastic–plastic analysis.
Proceedings ArticleDOI
Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias
Vijay Sukumaran,Tapobrata Bandyopadhyay,Qiao Chen,Nitesh Kumbhat,Fuhan Liu,R.V. Pucha,Yoichiro Sato,Mitsuru Watanabe,Kenji Kitaoka,Motoshi Ono,Yuya Suzuki,Choukri Karoui,Christian Nopper,Madhavan Swaminathan,Venky Sundaram,Rao Tummala +15 more
TL;DR: In this paper, the authors demonstrate thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration.
Proceedings ArticleDOI
Trend from ICs to 3D ICs to 3D systems
Rao Tummala,Venky Sundaram,Ritwik Chatterjee,P. Markondeya Raj,Nitesh Kumbhat,Vijay Sukumaran,Vivek Sridharan,Abhishek Choudury,Qiao Chen,Tapobrata Bandyopadhyay +9 more
TL;DR: The 3D miniaturization technologies briefly described in this paper include Si or wafer level interposers with Through-Package-Vias (TPV), nano-scale passives, thermal materials and interfaces and fine pitch system interconnections.