F
Fuhan Liu
Researcher at Georgia Institute of Technology
Publications - 136
Citations - 1772
Fuhan Liu is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Microvia & Interposer. The author has an hindex of 22, co-authored 130 publications receiving 1582 citations. Previous affiliations of Fuhan Liu include Georgia Tech Research Institute.
Papers
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Journal ArticleDOI
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
Rao Tummala,Madhavan Swaminathan,Manos M. Tentzeris,J. Laskar,Gee-Kung Chang,Suresh K. Sitaraman,David Keezer,Daniel Guidotti,Zhaoran Huang,Kyutae Lim,Lixi Wan,Swapan K. Bhattacharya,Venky Sundaram,Fuhan Liu,Pulugurtha Markondeya Raj +14 more
TL;DR: A number of SOP technologies which have been developed and integrated into SOP test bed are reviewed, which include convergent SOP-based INC system design and architecture, digital SOP and its fabrication for signal and power integrity, and demonstration of Sop by INC prototype system.
Proceedings ArticleDOI
Through-package-via formation and metallization of glass interposers
Vijay Sukumaran,Qiao Chen,Fuhan Liu,Nitesh Kumbhat,Tapobrata Bandyopadhyay,Hunter Chan,Sung-Hwan Min,Christian Nopper,Venky Sundaram,Rao Tummala +9 more
TL;DR: In this article, a glass interposer was proposed as a superior alternative interposers technology to address the limitations of both silicon and organic interposition technology, where the inherent electrical properties of glass, together with large area panel size availability, make it superior compared to organic and silicon-based interposERS.
Proceedings ArticleDOI
Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias
Vijay Sukumaran,Tapobrata Bandyopadhyay,Qiao Chen,Nitesh Kumbhat,Fuhan Liu,R.V. Pucha,Yoichiro Sato,Mitsuru Watanabe,Kenji Kitaoka,Motoshi Ono,Yuya Suzuki,Choukri Karoui,Christian Nopper,Madhavan Swaminathan,Venky Sundaram,Rao Tummala +15 more
TL;DR: In this paper, the authors demonstrate thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration.
Patent
Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same
TL;DR: In this paper, the use of glass as the interposer material with the surface of interposers and/or the walls of through vias in being coated by a stress relief barrier that provides thermal expansion and contraction stress relief and better metallization capabilities.
Proceedings ArticleDOI
Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)
Vivek Sridharan,Sung-Hwan Min,Venky Sundaram,Vijay Sukumaran,Seunghyun Hwang,Hunter Chan,Fuhan Liu,Christian Nopper,Rao Tummala +8 more
TL;DR: In this paper, the integration of WLAN (2.4 and 5GHz) bandpass filters in glass interposer using through-package vias is presented, which includes novel embedded passive components such as stitched capacitors with reduced shunt parasitics and via-based inductors that provide area reduction.