Showing papers by "Sabina Ronchin published in 2018"

SiCILIA-Silicon Carbide Detectors for Intense Luminosity Investigations and Applications.

Abstract: Silicon carbide (SiC) is a compound semiconductor, which is considered as a possible alternative to silicon for particles and photons detection. Its characteristics make it very promising for the next generation of nuclear and particle physics experiments at high beam luminosity. Silicon Carbide detectors for Intense Luminosity Investigations and Applications (SiCILIA) is a project starting as a collaboration between the Italian National Institute of Nuclear Physics (INFN) and IMM-CNR, aiming at the realization of innovative detection systems based on SiC. In this paper, we discuss the main features of silicon carbide as a material and its potential application in the field of particles and photons detectors, the project structure and the strategies used for the prototype realization, and the first results concerning prototype production and their performance.

Beam test results of thin n-in-p 3d and planar pixel sensors for the high luminosity lhc tracker upgrade at cms

Abstract: This paper describes the development of new 3D and planar silicon pixel sensors designed for the Compact Muon Solenoid (CMS) Phase-2 Upgrade at High Luminosity LHC (HL-LHC). The project is funded by INFN and sensors are produced in collaboration with the FBK foundry. The HL-LHC will operate at an instantaneous luminosity approximately 5 times larger than the original LHC design, significantly increasing the number of concurrent collisions per bunch crossing, the integrated luminosity delivered to the experiments and, as a consequence, the radiation dose that the detectors will have to sustain. In order to cope with these future conditions, upgrades to the detectors are required. This is necessary for the pixel tracker that is the closest to the interaction point and will be replaced. In this paper, the results, from beam tests performed at Fermilab Test Beam Facility, of thin (100 $\mu$m and 130 $\mu$m thick) n-in-p type sensors, assembled into hybrid single chip modules bump bonded to the PSI46dig readout chip, will be presented. A comparison of the performances obtained with planar sensors before and after proton irradiation up to $3\times10^{15}$ n$_{eq}$/$cm^2$ will be also discussed. The paper will also report the results obtained with the first 3D pixel sensors 130 $\mu$m thick with columnar electrodes for different pixel cell prototypes. The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard $100$ $\mu$m $\times$ $150$ $\mu$m, down to $50$ $\mu$m $\times$ $50$ $\mu$m and $25$ $\mu$m $\times$ $100$ $\mu$m, which are the preferred dimensions in the high pile-up environment of the HL-LHC.