Wide bandgap semiconductors are extremely attractive for the gamut of power electronics applications from power conditioning to microwave transmitters for communications and radar. Of the various materials and device technologies, the AlGaN/GaN high-electron mobility transistor seems the most promising. This paper attempts to present the status of the technology and the market with a view of highlighting both the progress and the remaining problems.

AlGaN/GaN HEMTs-an overview of device operation and applications

The rapid development of the RF power electronics requires the introduction of wide bandgap material due to its potential in high output power density, high operation voltage and high input impedance GaN-based RF power devices have made substantial progresses in the last decade This paper attempts to review the latest developments of the GaN HEMT technologies, including material growth, processing technologies, device epitaxial structures and MMIC designs, to achieve the state-of-the-art microwave and millimeter-wave performance The reliability and manufacturing challenges are also discussed

GaN-Based RF Power Devices and Amplifiers

Two dimensional electron gases in Al x Ga 12x N/GaN based heterostructures, suitable for high electron mobility transistors, are induced by strong polarization effects. The sheet carrier concentration and the confinement of the two dimensional electron gases located close to the AlGaN/GaN interface are sensitive to a large number of different physical properties such as polarity, alloy composition, strain, thickness, and doping of the AlGaN barrier. We have investigated these physical properties for undoped and silicon doped transistor structures by a combination of high resolution x-ray diffraction, atomic force microscopy, Hall effect, and capacitance‐voltage profiling measurements. The polarization induced sheet charge bound at the AlGaN/GaN interfaces was calculated from different sets of piezoelectric constants available in the literature. The sheet carrier concentration induced by polarization charges was determined

Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures

Impurity-based p-type doping in wide-band-gap semiconductors is inefficient at room temperature for applications such as lasers because the positive-charge carriers (holes) have a large thermal activation energy. We demonstrate high-efficiency p-type doping by ionizing acceptor dopants using the built-in electronic polarization in bulk uniaxial semiconductor crystals. Because the mobile hole gases are field-ionized, they are robust to thermal freezeout effects and lead to major improvements in p-type electrical conductivity. The new doping technique results in improved optical emission efficiency in prototype ultraviolet light-emitting-diode structures. Polarization-induced doping provides an attractive solution to both p- and n-type doping problems in wide-band-gap semiconductors and offers an unconventional path for the development of solid-state deep-ultraviolet optoelectronic devices and wide-band-gap bipolar electronic devices of the future.

https://science.sciencemag.org/content/sci/327/5961/60.full.pdf

Polarization-Induced Hole Doping in Wide–Band-Gap Uniaxial Semiconductor Heterostructures

We report a novel approach in fabricating high-performance enhancement mode (E-mode) AlGaN/GaN HEMTs. The fabrication technique is based on fluoride-based plasma treatment of the gate region in AlGaN/GaN HEMTs and post-gate rapid thermal annealing with an annealing temperature lower than 500/spl deg/C. Starting with a conventional depletion-mode HEMT sample, we found that fluoride-based plasma treatment can effectively shift the threshold voltage from -4.0 to 0.9 V. Most importantly, a zero transconductance (g/sub m/) was obtained at V/sub gs/=0 V, demonstrating for the first time true E-mode operation in an AlGaN/GaN HEMT. At V/sub gs/=0 V, the off-state drain leakage current is 28 /spl mu/A/mm at a drain-source bias of 6 V. The fabricated E-mode AlGaN/GaN HEMTs with 1 /spl mu/m-long gate exhibit a maximum drain current density of 310 mA/mm, a peak g/sub m/ of 148 mS/mm, a current gain cutoff frequency f/sub T/ of 10.1 GHz and a maximum oscillation frequency f/sub max/ of 34.3 GHz.

High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment

GaN high-electron-mobility-transistors (HEMTs) on SiC were fabricated with field plates of various dimensions for optimum performance Great enhancement in radio frequency (RF) current-voltage swings was achieved with acceptable compromise in gain, through both reduction in the trapping effect and increase in breakdown voltages When biased at 120 V, a continuous wave output power density of 322 W/mm and power-added efficiency (PAE) of 548% at 4 GHz were obtained using devices with dimensions of 055/spl times/246 /spl mu/m/sup 2/ and a field-plate length of 11 /spl mu/m Devices with a shorter field plate of 09 /spl mu/m also generated 306 W/mm with 496% PAE at 8 GHz Such ultrahigh power densities are a dramatic improvement over the 10-12 W/mm values attained by conventional gate GaN-based HEMTs

30-W/mm GaN HEMTs by field plate optimization

Record performance of high-power GaN/Al/sub 0.14/-Ga/sub 0.86/N high-electron mobility transistors (HEMTs) fabricated on semi-insulating (SI) 4H-SiC substrates is reported. Devices of 0.125-0.25 mm gate periphery show high CW power densities between 5.3 and 6.9 W/mm, with a typical power-added efficiency (PAE) of 35.4% and an associated gain of 9.2 dB at 10 GHz. High-electron mobility transistors with 1.5-mm gate widths (12/spl times/125 /spl mu/m), measured on-wafer, exhibit a total output power of 3.9 W CW (2.6 W/mm) at 10 GHz with a PAE of 29% and an associated gain of 10 dB at the -2 dB compression point. A 3-mm HEMT, packaged with a hybrid matching circuit, demonstrated 9.1 W CW at 7.4 GHz with a PAE of 29.6% and a gain of 7.1 dB. These data represent the highest power density, total power, and associated gain demonstrated for a III-nitride HEMT under RF drive.

High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates

Recently, electric field modification with GaN-based high-electron-mobility-transistors (HEMTs) using field plates (FP) has resulted in dramatically enhanced power performance. Power densities up to 32 W/mm at 4 GHz have been demonstrated with power-added-efficiency (PAE) of 55%. When scaled to a large periphery, a total output power of 149 W was obtained at 2 GHz. Modern communication applications also require high linearity for power devices. Here we present the linearity performance of GaN-channel HEMTs with various FP lengths at biases up to 108V.

Linearity performance of GaN HEMTs with field plates

Improved 10-GHz Operation of GaN/AlGaN HEMTs on Silicon Carbide

SiC MESFET’s have shown an RF power density of 4.6 W/mm at 3.5 GHz and a power added efficiency of 60% with 3 W/mm at 800 MHz, demonstrating that SiC devices are capable of very high power densities and high efficiencies. Single devices with 48 mm of gate periphery were mounted in a hybrid circuit and achieved a maximum RF power of 80 watts CW at 3.1 GHz with 38% PAE.

https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400161846

Scott Sheppard

Papers

30-W/mm GaN HEMTs by field plate optimization

High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates

Linearity performance of GaN HEMTs with field plates

Improved 10-GHz Operation of GaN/AlGaN HEMTs on Silicon Carbide

Recent Progress in SiC Microwave MESFETs