Wide bandgap semiconductors are extremely attractive for the gamut of power electronics applications from power conditioning to microwave transmitters for communications and radar. Of the various materials and device technologies, the AlGaN/GaN high-electron mobility transistor seems the most promising. This paper attempts to present the status of the technology and the market with a view of highlighting both the progress and the remaining problems.

AlGaN/GaN HEMTs-an overview of device operation and applications

The rapid development of the RF power electronics requires the introduction of wide bandgap material due to its potential in high output power density, high operation voltage and high input impedance GaN-based RF power devices have made substantial progresses in the last decade This paper attempts to review the latest developments of the GaN HEMT technologies, including material growth, processing technologies, device epitaxial structures and MMIC designs, to achieve the state-of-the-art microwave and millimeter-wave performance The reliability and manufacturing challenges are also discussed

GaN-Based RF Power Devices and Amplifiers

Two dimensional electron gases in Al x Ga 12x N/GaN based heterostructures, suitable for high electron mobility transistors, are induced by strong polarization effects. The sheet carrier concentration and the confinement of the two dimensional electron gases located close to the AlGaN/GaN interface are sensitive to a large number of different physical properties such as polarity, alloy composition, strain, thickness, and doping of the AlGaN barrier. We have investigated these physical properties for undoped and silicon doped transistor structures by a combination of high resolution x-ray diffraction, atomic force microscopy, Hall effect, and capacitance‐voltage profiling measurements. The polarization induced sheet charge bound at the AlGaN/GaN interfaces was calculated from different sets of piezoelectric constants available in the literature. The sheet carrier concentration induced by polarization charges was determined

Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures

Gallium-nitride power transistor (GaN HEMT) and integrated circuit technologies have matured dramatically over the last few years, and many hundreds of thousands of devices have been manufactured and fielded in applications ranging from pulsed radars and counter-IED jammers to CATV modules and fourth-generation infrastructure base-stations. GaN HEMT devices, exhibiting high power densities coupled with high breakdown voltages, have opened up the possibilities for highly efficient power amplifiers (PAs) exploiting the principles of waveform engineered designs. This paper summarizes the unique advantages of GaN HEMTs compared to other power transistor technologies, with examples of where such features have been exploited. Since RF power densities of GaN HEMTs are many times higher than other technologies, much attention has also been given to thermal management-examples of both commercial “off-the-shelf” packaging as well as custom heat-sinks are described. The very desirable feature of having accurate large-signal models for both discrete transistors and monolithic microwave integrated circuit foundry are emphasized with a number of circuit design examples. GaN HEMT technology has been a major enabler for both very broadband high-PAs and very high-efficiency designs. This paper describes examples of broadband amplifiers, as well as several of the main areas of high-efficiency amplifier design-notably Class-D, Class-E, Class-F, and Class-J approaches, Doherty PAs, envelope-tracking techniques, and Chireix outphasing.

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A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs

In this review, the structural, mechanical, thermal, and chemical properties of substrates used for gallium nitride (GaN) epitaxy are compiled, and the properties of GaN films deposited on these substrates are reviewed. Among semiconductors, GaN is unique; most of its applications uses thin GaN films deposited on foreign substrates (materials other than GaN); that is, heteroepitaxial thin films. As a consequence of heteroepitaxy, the quality of the GaN films is very dependent on the properties of the substrate—both the inherent properties such as lattice constants and thermal expansion coefficients, and process induced properties such as surface roughness, step height and terrace width, and wetting behavior. The consequences of heteroepitaxy are discussed, including the crystallographic orientation and polarity, surface morphology, and inherent and thermally induced stress in the GaN films. Defects such as threading dislocations, inversion domains, and the unintentional incorporation of impurities into the epitaxial GaN layer resulting from heteroepitaxy are presented along with their effect on device processing and performance. A summary of the structure and lattice constants for many semiconductors, metals, metal nitrides, and oxides used or considered for GaN epitaxy is presented. The properties, synthesis, advantages and disadvantages of the six most commonly employed substrates (sapphire, 6H-SiC, Si, GaAs, LiGaO 2 , and AlN) are presented. Useful substrate properties such as lattice constants, defect densities, elastic moduli, thermal expansion coefficients, thermal conductivities, etching characteristics, and reactivities under deposition conditions are presented. Efforts to reduce the defect densities and to optimize the electrical and optical properties of the GaN epitaxial film by substrate etching, nitridation, and slight misorientation from the (0 0 0 1) crystal plane are reviewed. The requirements, the obstacles, and the results to date to produce zincblende GaN on 3C-SiC/Si(0 0 1) and GaAs are discussed. Tables summarizing measures of the GaN quality such as XRD rocking curve FWHM, photoluminescence peak position and FWHM, and electron mobilities for GaN epitaxial layers produced by MOCVD, MBE, and HVPE for each substrate are given. The initial results using GaN substrates, prepared as bulk crystals and as free-standing epitaxial films, are reviewed. Finally, the promise and the directions of research on new potential substrates, such as compliant and porous substrates are described.

Substrates for gallium nitride epitaxy

Record performance of high-power GaN/Al/sub 0.14/-Ga/sub 0.86/N high-electron mobility transistors (HEMTs) fabricated on semi-insulating (SI) 4H-SiC substrates is reported. Devices of 0.125-0.25 mm gate periphery show high CW power densities between 5.3 and 6.9 W/mm, with a typical power-added efficiency (PAE) of 35.4% and an associated gain of 9.2 dB at 10 GHz. High-electron mobility transistors with 1.5-mm gate widths (12/spl times/125 /spl mu/m), measured on-wafer, exhibit a total output power of 3.9 W CW (2.6 W/mm) at 10 GHz with a PAE of 29% and an associated gain of 10 dB at the -2 dB compression point. A 3-mm HEMT, packaged with a hybrid matching circuit, demonstrated 9.1 W CW at 7.4 GHz with a PAE of 29.6% and a gain of 7.1 dB. These data represent the highest power density, total power, and associated gain demonstrated for a III-nitride HEMT under RF drive.

High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates

A high electron mobility transistor (HEMT) is disclosed that includes a semi-insulating silicon carbide substrate, an aluminum nitride buffer layer on the substrate, an insulating gallium nitride layer on the buffer layer, an active structure of aluminum gallium nitride on the gallium nitride layer, a passivation layer on the aluminum gallium nitride active structure, and respective source, drain and gate contacts to the aluminum gallium nitride active structure.

Nitride based transistors on semi-insulating silicon carbide substrates

Due to wider band gap of silicon carbide (SiC) compared to silicon (Si), MOSFET made in SiC has considerably lower drift region resistance, which is a significant resistive component in high-voltage power devices. With low on-state resistance and its inherently low switching loss, SiC MOSFETs can offer much improved efficiency and compact size for the converter compared to those using Si devices. In this paper, we report switching performance of a new 1700-V, 50-A SiC MOSFET designed and developed by Cree, Inc. Hard-switching losses of the SiC MOSFETs with different circuit parameters and operating conditions are measured and compared with the 1700-V Si BiMOSFET and 1700-V Si IGBT, using same test set-up. Based on switching and conduction losses, the operating boundary of output power and switching frequency of these devices are found out in a dc–dc boost converter and compared. The switching $dv/dts$ and $di/dts$ of SiC MOSFET are captured and discussed in the perspective of converter design. To validate the continuous operation, three dc–dc boost converters using these devices, are designed and tested at 10 kW of power with 1 kV of output voltage and 10 kHz of switching frequency. 1700-V SiC Schottky diode is used as the blocking diode in each case. Corresponding converter efficiencies are evaluated and the junction temperature of each device is estimated. To demonstrate high switching frequency operation, the SiC MOSFET is switched upto 150 kHz within permissible junction temperature rise. A switch combination of the 1700-V SiC MOSFET and 1700-V SiC Schottky diode connected in series is also evaluated for zero voltage switching turn-ON behavior and compared with those of bipolar Si devices. Results show substantial power loss saving with the use of SiC MOSFET.

High Switching Performance of 1700-V, 50-A SiC Power MOSFET Over Si IGBT/BiMOSFET for Advanced Power Conversion Applications

Since Cree, Inc.'s 2
 nd
 generation 4H-SiC MOSFETs were commercially released with a specific on-resistance (R
 ON, SP
) of 5 mΩ·cm
 2
 for a 1200 V-rating in early 2013, we have further optimized the device design and fabrication processes as well as greatly expanded the voltage ratings from 900 V up to 15 kV for a much wider range of high-power, high-frequency, and high-voltage energy-conversion and transmission applications. Using these next-generation SiC MOSFETs, we have now achieved new breakthrough performance for voltage ratings from 900 V up to 15 kV with a R
 ON, SP
 as low as 2.3 mΩ·cm
 2
 for a breakdown voltage (BV) of 1230 V and 900 V-rating, 2.7 mΩ·cm
 2
 for a BV of 1620 V and 1200 V-rating, 3.38 mΩ·cm
 2
 for a BV of 1830 V and 1700 V-rating, 10.6 mΩ·cm
 2
 for a BV of 4160 V and 3300 V-rating, 123 mΩ·cm
 2
 for a BV of 12 kV and 10 kV-rating, and 208 mΩ·cm
 2
 for a BV of 15.5 kV and 15 kV-rating. In addition, due to the lack of current tailing during the bipolar device switching turn-off, the SiC MOSFETs reported in this work exhibit incredibly high frequency switching performance over their silicon counter parts.

Silicon carbide power MOSFETs: Breakthrough performance from 900 V up to 15 kV

Advanced high-voltage (10 kV-15 kV) silicon carbide (SiC) power MOSFETs described in this paper have the potential to significantly impact the system performance, size, weight, high-temperature reliability, and cost of next-generation energy conversion and transmission systems. In this paper, we report our recently developed 10 kV/20 A SiC MOSFETs with a chip size of 8.1 × 8.1 mm2 and a specific on-resistance (RON, SP) of 100 MΩ-cm2 at 25 °C. We also developed 15 kV/10 A SiC power MOSFETs with a chip size of 8 × 8 mm2 and a RON, SP of 204 mQ cm2 at 25 °C. To our knowledge, this 15 kV SiC MOSFET is the highest voltage rated unipolar power switch. Compared to the commercial 6.5 kV Silicon (Si) IGBTs, these 10 kV and 15 kV SiC MOSFETs exhibit extremely low switching losses even when they are switched at 2-3× higher voltage. The benefits of using these 10 kV and 15 kV SiC MOSFETs include simplifying from multilevel to two-level topology and removing the need for time-interleaving by improving the switching frequency from a few hundred Hz for Si based systems to ≥ 10 kHz for hard-switched SiC based systems.

Scott Allen

Papers

High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates

Nitride based transistors on semi-insulating silicon carbide substrates

High Switching Performance of 1700-V, 50-A SiC Power MOSFET Over Si IGBT/BiMOSFET for Advanced Power Conversion Applications

Silicon carbide power MOSFETs: Breakthrough performance from 900 V up to 15 kV

10 kV and 15 kV silicon carbide power MOSFETs for next-generation energy conversion and transmission systems