Journal ArticleDOI
Thermal Challenges in Next-Generation Electronic Systems
Suresh V. Garimella,Amy S. Fleischer,Jayathi Y. Murthy,A. Keshavarzi,Ravi Prasher,Chandrakant D. Patel,Sushil H. Bhavnani,Rama Venkatasubramanian,Ravindranath V. Mahajan,Yogendra Joshi,Bahgat Sammakia,B.A. Myers,L. Chorosinski,Martine Baelmans,P. Sathyamurthy,Peter E. Raad +15 more
TLDR
The thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this article.Abstract:
Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.read more
Citations
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Journal ArticleDOI
Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
TL;DR: The modeling results suggest that graphene-multilayer graphene nanocomposite used as the thermal interface material outperforms those with carbon nanotubes or metal nanoparticles owing to graphene's aspect ratio and lower Kapitza resistance at the graphene-matrix interface.
Journal ArticleDOI
Thermal properties of graphene and multilayer graphene: Applications in thermal interface materials
TL;DR: In this paper, the use of liquid-phase-exfoliated graphene and multilayer graphene as fillers in the thermal interface materials has been discussed, and it has been demonstrated that the addition of an optimized mixture of graphene and multi-layer graphene to the composites with different matrix materials produces the record-high enhancement of the effective thermal conductivity at the small filler loading fraction (f≤10vol%).
Journal ArticleDOI
Graphene-enhanced hybrid phase change materials for thermal management of Li-ion batteries
TL;DR: In this paper, a combination of the sensible and latent heat storage together with the improved heat conduction outside of the battery pack leads to a significant decrease in the temperature rise inside a typical Li-ion battery pack.
Journal ArticleDOI
Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation.
Ziyin Lin,Yan Liu,Sathyanarayanan Raghavan,Kyoung-Sik Moon,Suresh K. Sitaraman,Ching-Ping Wong +5 more
TL;DR: Finite element analysis reveals promising applications for the magnetically aligned hBN-based composites in modern microelectronic packaging, including significantly reduced coefficient of thermal expansion and enhanced thermal conductivity.
References
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Proceedings ArticleDOI
Comparative Analysis of Different Data Center Airflow Management Configurations
TL;DR: In this paper, a broad numerical study carried out to assess the effectiveness of different data center configurations is performed using a commercial computational fluid dynamics (CFD) code based on finite volume approach.
Proceedings ArticleDOI
The Thermal Design of a Next Generation Data Center: A Conceptual Exposition
TL;DR: In this article, the authors identify the requirements of the future thermal solutions and explore various design specifications of an ideally open thermal solution for a next-generation data center, which is believed to be the most effective and efficient for the next generation data centers.
Data Centers and Energy Use - Let's Look at the Data
William Tschudi,David Coup +1 more
TL;DR: In this article, the authors present a review of the current power consumption of data centers and evaluate how efficiently the Heating, Ventilating and Air Conditioning (HVAC) system operates to maintain satisfactory conditions for computing equipment, and identify gaps where additional research is needed to achieve a new level of improved energy efficiency.