Sylwester Bargiel

TL;DR: In this paper, the authors describe crucial technological aspects of development of an optical, transmissive, vertically-integrated 3D microscanner: chip-level bonding of micro-optical components and wafer-level anodic bonding of deeply structurized substrates.

TL;DR: The impact on imaging quality of mirror suspensions, referred to as spider legs, used to support the reference mirror in a Mirau micro-interferometer that requires the vertical alignment of lens, mirror, and beamsplitter is reported.

TL;DR: In this article, it was shown that well-defined resonant cavity modes can be efficiently excited, even though the phononic cavities are distant by a few lattice spacings and are only weakly coupled through evanescent elastic waves.

TL;DR: In this article, a multi-wafer bonding technology as well as the integration of electrical connection to the zscanner of the micromachined array-type Mirau interferometer is presented.

TL;DR: This paper presents the conception of a new micro-optical component fabricated within the wafer-level approach: a micromachined reflective objective, the so-called micro-Schwarzschild objective, characterized by superior optical performances than widespread microlenses, and describes a fabrication flow chart that could allow production of thousands of such micro- optical devices within a single fabrication run.