T
Thomas R. Miller
Researcher at IBM
Publications - 34
Citations - 663
Thomas R. Miller is an academic researcher from IBM. The author has contributed to research in topics: Printed circuit board & Layer (electronics). The author has an hindex of 15, co-authored 34 publications receiving 661 citations. Previous affiliations of Thomas R. Miller include GlobalFoundries.
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Patent
Circuitized substrate and method of making same
TL;DR: In this article, a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like.
Patent
Method for making a printed wiring board
Anilkumar C. Bhatt,Ashwinkumar C. Bhatt,Subahu D. Desai,John M. Lauffer,Voya R. Markovich,Thomas R. Miller +5 more
TL;DR: In this article, photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes, and a developer is used to remove any uncured PID material.
Patent
Manufacturing computer systems with fine line circuitized substrates
Anilkumar C. Bhatt,Roy H. Magnuson,Thomas R. Miller,Voya R. Markovich,Carlos J. Sambucetti,Stephen L. Tisdale +5 more
TL;DR: In this paper, the process includes seeding the surface, coating the surface with a first solution containing surfactant and electroplating in a second solution in which the level of surfactants is regulated by determining the surface tension and meta-surfactant addition to the second solution depending on the determination of surface tension.
Patent
Fine pitch circuitization with filled plated through holes
Kenneth John Lubert,Curtis L. Miller,Thomas R. Miller,Robert David Sebesta,James Warren Wilson,Michael Wozniak +5 more
TL;DR: In this article, a high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants.
Patent
Composite laminate circuit structure and methods of interconnecting the same
John M. Lauffer,Voya R. Markovich,Thomas R. Miller,Konstantinos I. Papathomas,William E. Wilson +4 more
TL;DR: In this article, a laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the sub-assemblies and wherein the subassembly and joining layer are bonded together with a cured dielectric from a bondable, curable dielectrics.