An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Wearable electronics is expected to be one of the most active research areas in the next decade; therefore, nanomaterials possessing high carrier mobility, optical transparency, mechanical robustness and flexibility, lightweight, and environmental stability will be in immense demand. Graphene is one of the nanomaterials that fulfill all these requirements, along with other inherently unique properties and convenience to fabricate into different morphological nanostructures, from atomically thin single layers to nanoribbons. Graphene-based materials have also been investigated in sensor technologies, from chemical sensing to detection of cancer biomarkers. The progress of graphene-based flexible gas and chemical sensors in terms of material preparation, sensor fabrication, and their performance are reviewed here. The article provides a brief introduction to graphene-based materials and their potential applications in flexible and stretchable wearable electronic devices. The role of graphene in fabricating ...

Flexible Graphene-Based Wearable Gas and Chemical Sensors

Efficiency is crucial for organic light emitting diodes (OLEDs) to be energy-saving and to have a long lifetime for display and solid state lighting applications. Numerous approaches have been proposed to attain high efficiency OLEDs through the synthesis of novel organic materials, the design of light extraction structures and the design of efficiency-effective device architectures. In this report, we first summarise the efficiency records of OLED devices using fluorescent, phosphorescent, and thermally activated delay fluorescent materials. Importantly, we review all the available efficiency-effective device architectural approaches, which include using thin layer structures, low carrier injection barriers, high carrier mobility, balanced carrier injection, effective carrier confinement, effective host-to-guest energy transfer, effective recombination zone, effective exciton generation on the host, effective exciton confinement, p–i–n structures, and tandem structures. It is hoped that better device structures can therefore be devised upon suitable device engineering to achieve higher efficiency for OLED devices.

Approaches for fabricating high efficiency organic light emitting diodes

Functionalization of carbon nanomaterials for advanced polymer nanocomposites: A comparison study between CNT and graphene

An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film

Method for Manufacturing Semiconductor Device

Indium tin oxide, the predominant material used as transparent electrodes in organic LEDs, is expensive and brittle. Ning Li and colleagues form transparent electrodes using single-layer graphene to construct organic LEDs with unprecedented performance that are suitable for both displays and lighting.

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Efficient and bright organic light-emitting diodes on single-layer graphene electrodes

A silicon on insulator (SOI) dynamic random access memory (DRAM) cell and array and method of manufacture. The memory cell includes a trench storage capacitor connected by a self aligned buried strap to a vertical access transistor. A buried oxide layer isolates an SOI layer from a silicon substrate. The trench capacitor is formed in the substrate and the access transistor is formed on a sidewall of the SOI layer. A polysilicon strap connected to the polysilicon plate of the storage capacitor provides a self-aligned contact to the source of the access transistor. Initially, the buried oxide layer is formed in the wafer. Deep trenches are etched, initially just through the SOI layer and the BOX layer. Protective sidewalls are formed in the trenches. Then, the deep trenches are etched into the substrate. The volume in the substrate is expanded to form a bottle shaped trench. A polysilicon capacitor plate is formed in the deep trenches and conductive polysilicon straps are formed in the trenches between the capacitor plates and the SOI sidewalls. Device regions are defined in the wafer and a sidewall gate is formed in the deep trenches. Shallow trenches isolation (STI) is used to isolate and define cells. Bitlines and wordlines are formed on the wafer.

Silicon-on-insulator vertical array device trench capacitor DRAM

A shallow trench isolation structure for a semiconductor device and the method for manufacturing the shallow trench isolation device within a semiconductor substrate. The shallow trench isolation structure is divot-free and includes un-annealed dielectric material as the trench fill material. The intersection of the structure and the semiconductor surface in which it is formed, is free of silicon nitride, but the isolation structure may include a silicon nitride liner which is within the trench and recessed below the semiconductor surface.

Structure and method for producing low leakage isolation devices

The present invention provides various methods for forming a ground-plane SOI device which comprises at least a field effect transistor formed on a top Si-containing surface of a silicon-on-insulator (SOI) wafer; and an oxide region present beneath the field effect transistor, located in an area between source and drain regions which are formed in said SOI wafer, said oxide region is butted against shallow extensions formed in said SOI wafer, and is laterally adjacent to said source and drain regions.

Double SOI device with recess etch and epitaxy

A method for fabricating germanium-on-insulator (GOI) substrate materials, the GOI substrate materials produced by the method and various structures that can include at least the GOI substrate materials of the present invention are provided. The GOI substrate material include at least a substrate, a buried insulator layer located atop the substrate, and a Ge-containing layer, preferably pure Ge, located atop the buried insulator layer. In the GOI substrate materials of the present invention, the Ge-containing layer may also be referred to as the GOI film. The GOI film is the layer of the inventive substrate material in which devices can be formed.

Tze-Chiang Chen

Papers

Efficient and bright organic light-emitting diodes on single-layer graphene electrodes

Silicon-on-insulator vertical array device trench capacitor DRAM

Structure and method for producing low leakage isolation devices

Double SOI device with recess etch and epitaxy

Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates