With the fast development of the fifth-generation cellular network technology (5G), the future sensors and microelectromechanical systems (MEMS)/nanoelectromechanical systems (NEMS) are presenting a more and more critical role to provide information in our daily life. This review paper introduces the development trends and perspectives of the future sensors and MEMS/NEMS. Starting from the issues of the MEMS fabrication, we introduced typical MEMS sensors for their applications in the Internet of Things (IoTs), such as MEMS physical sensor, MEMS acoustic sensor, and MEMS gas sensor. Toward the trends in intelligence and less power consumption, MEMS components including MEMS/NEMS switch, piezoelectric micromachined ultrasonic transducer (PMUT), and MEMS energy harvesting were investigated to assist the future sensors, such as event-based or almost zero-power. Furthermore, MEMS rigid substrate toward NEMS flexible-based for flexibility and interface was discussed as another important development trend for next-generation wearable or multi-functional sensors. Around the issues about the big data and human-machine realization for human beings’ manipulation, artificial intelligence (AI) and virtual reality (VR) technologies were finally realized using sensor nodes and its wave identification as future trends for various scenarios.

Development Trends and Perspectives of Future Sensors and MEMS/NEMS.

Enhancing the Capacitive Storage Performance of Carbon Fiber Textile by Surface and Structural Modulation for Advanced Flexible Asymmetric Supercapacitors

The emergence of artificial intelligence and the Internet of Things has led to a growing demand for wearable and maintenance-free power sources. The continual push toward lower operating voltages and power consumption in modern integrated circuits has made the development of devices powered by body heat finally feasible. In this context, thermoelectric (TE) materials have emerged as promising candidates for the effective conversion of body heat into electricity to power wearable devices without being limited by environmental conditions. Driven by rapid advances in processing technology and the performance of TE materials over the past two decades, wearable thermoelectric generators (WTEGs) have gradually become more flexible and stretchable so that they can be used on complex and dynamic surfaces. In this review, the functional materials, processing techniques, and strategies for the device design of different types of WTEGs are comprehensively covered. Wearable self-powered systems based on WTEGs are summarized, including multi-function TE modules, hybrid energy harvesting, and all-in-one energy devices. Challenges in organic TE materials, interfacial engineering, and assessments of device performance are discussed, and suggestions for future developments in the area are provided. This review will promote the rapid implementation of wearable TE materials and devices in self-powered electronic systems.

Wearable Thermoelectric Materials and Devices for Self-Powered Electronic Systems.

Development and application of self-healing materials in smart batteries and supercapacitors

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Laser processing of graphene and related materials for energy storage: State of the art and future prospects

Miniature Microelectromechanical Systems (MEMS) pressure sensors possess various merits, such as low power consumption, being lightweight, having a small volume, accurate measurement in a space-limited region, low cost, little influence on the objects being detected. Accurate blood pressure has been frequently required for medical diagnosis. Miniature pressure sensors could directly measure the blood pressure and fluctuation in blood vessels with an inner diameter from 200 to 1000 m. Glaucoma is a group of eye diseases usually resulting from abnormal intraocular pressure. The implantable pressure sensor for real-time inspection would keep the disease from worsening; meanwhile, these small devices could alleviate the discomfort of patients. In addition to medical applications, miniature pressure sensors have also been used in the aerospace, industrial, and consumer electronics fields. To clearly illustrate the "miniature size", this paper focuses on miniature pressure sensors with an overall size of less than 2 mm × 2 mm or a pressure sensitive diaphragm area of less than 1 mm × 1 mm. In this paper, firstly, the working principles of several types of pressure sensors are briefly introduced. Secondly, the miniaturization with the development of the semiconductor processing technology is discussed. Thirdly, the sizes, performances, manufacturing processes, structures, and materials of small pressure sensors used in the different fields are explained in detail, especially in the medical field. Fourthly, problems encountered in the miniaturization of miniature pressure sensors are analyzed and possible solutions proposed. Finally, the probable development directions of miniature pressure sensors in the future are discussed.

https://www.mdpi.com/2072-666X/11/1/56/pdf

Recent Progress of Miniature MEMS Pressure Sensors.

Review of experimental approaches for improving zT of thermoelectric materials

Micro/nano structures have unique optical, electrical, magnetic, and thermal properties. Studies on the preparation of micro/nano structures are of considerable research value and broad development prospects. Several micro/nano structure preparation techniques have already been developed, such as photolithography, electron beam lithography, focused ion beam techniques, nanoimprint techniques. However, the available geometries directly implemented by those means are limited to the 2D mode. Laser machining, a new technology for micro/nano structural preparation, has received great attention in recent years for its wide application to almost all types of materials through a scalable, one-step method, and its unique 3D processing capabilities, high manufacturing resolution and high designability. In addition, micro/nano structures prepared by laser machining have a wide range of applications in photonics, Surface plasma resonance, optoelectronics, biochemical sensing, micro/nanofluidics, photofluidics, biomedical, and associated fields. In this paper, updated achievements of laser-assisted fabrication of micro/nano structures are reviewed and summarized. It focuses on the researchers' findings, and analyzes materials, morphology, possible applications and laser machining of micro/nano structures in detail. Seven kinds of materials are generalized, including metal, organics or polymers, semiconductors, glass, oxides, carbon materials, and piezoelectric materials. In the end, further prospects to the future of laser machining are proposed.

The Fabrication of Micro/Nano Structures by Laser Machining.

A miniature piezoresistive pressure sensor fabricated by temporary bonding technology was reported in this paper. The sensing membrane was formed on the device layer of an SOI (Silicon-On-Insulator) wafer, which was bonded to borosilicate glass (Borofloat 33, BF33) wafer for supporting before releasing with Cu-Cu bonding after boron doping and electrode patterning. The handle layer was bonded to another BF33 wafer after thinning and etching. Finally, the substrate BF33 wafer was thinned by chemical mechanical polishing (CMP) to reduce the total device thickness. The copper temporary bonding layer was removed by acid solution after dicing to release the sensing membrane. The chip area of the fabricated pressure sensor was of 1600 μm × 650 μm × 104 μm, and the size of a sensing membrane was of 100 μm × 100 μm × 2 μm. A higher sensitivity of 36 μV/(V∙kPa) in the range of 0-180 kPa was obtained. By further reducing the width, the fabricated miniature pressure sensor could be easily mounted in a medical catheter for the blood pressure measurement.

A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology.

In this paper, we report a novel aluminum nitride (AlN) resonant micro-electromechanical systems (MEMS) accelerometer. The spring beams are T-shaped with two masses hanged at the end. This accelerometer is sensitive to the $z$ -axis acceleration due to a thin thickness. Different from the working mechanism of the ordinary MEMS resonant accelerometers, masses of this accelerometer are excited to resonate in-plane. In addition the stiffness of spring beams changes significantly when an out plane ( $z$ -axis) inertial force applied on the structure. Therefore, the resonant frequency of the structure will change with the out-plane inertial force. The resonant properties and sensitivities of this AlN accelerometer are simulated by COMSOL Multiphysics. The accelerometer is fabricated and tested. The size of the whole structure is $464\times 650\,\,\mu \text{m}^{2}$ . The resonant frequency is 16.10925 kHz at the static state. The sensing-axis sensitivity of this accelerometer is 1.11 Hz/g (i.e., 68.9 ppm/g) tested from −5g to +5g. The linearity of the accelerometer is 0.9954. The cross-axis sensitivities are 0.053 Hz/g ( $x$ -axis) and 0.048 Hz/g ( $y$ -axis) respectively. The temperature coefficient of frequency (TCF) of this accelerometer is 0.815 Hz/ °C (i.e., 50.6 ppm/°C), tested from 0 °C to 50 °C. [2019-0062]

Xiaodong Wang

Papers

Recent Progress of Miniature MEMS Pressure Sensors.

Review of experimental approaches for improving zT of thermoelectric materials

The Fabrication of Micro/Nano Structures by Laser Machining.

A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology.

A T-Shape Aluminum Nitride Thin-Film Piezoelectric MEMS Resonant Accelerometer