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Journal ArticleDOI

A T-Shape Aluminum Nitride Thin-Film Piezoelectric MEMS Resonant Accelerometer

TLDR
In this article, a novel aluminum nitride (AlN) resonant micro-electromechanical systems (MEMS) accelerometer is reported, where the spring beams are T-shaped with two masses hanged at the end.
Abstract
In this paper, we report a novel aluminum nitride (AlN) resonant micro-electromechanical systems (MEMS) accelerometer. The spring beams are T-shaped with two masses hanged at the end. This accelerometer is sensitive to the $z$ -axis acceleration due to a thin thickness. Different from the working mechanism of the ordinary MEMS resonant accelerometers, masses of this accelerometer are excited to resonate in-plane. In addition the stiffness of spring beams changes significantly when an out plane ( $z$ -axis) inertial force applied on the structure. Therefore, the resonant frequency of the structure will change with the out-plane inertial force. The resonant properties and sensitivities of this AlN accelerometer are simulated by COMSOL Multiphysics. The accelerometer is fabricated and tested. The size of the whole structure is $464\times 650\,\,\mu \text{m}^{2}$ . The resonant frequency is 16.10925 kHz at the static state. The sensing-axis sensitivity of this accelerometer is 1.11 Hz/g (i.e., 68.9 ppm/g) tested from −5g to +5g. The linearity of the accelerometer is 0.9954. The cross-axis sensitivities are 0.053 Hz/g ( $x$ -axis) and 0.048 Hz/g ( $y$ -axis) respectively. The temperature coefficient of frequency (TCF) of this accelerometer is 0.815 Hz/ °C (i.e., 50.6 ppm/°C), tested from 0 °C to 50 °C. [2019-0062]

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Citations
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Journal ArticleDOI

Development Trends and Perspectives of Future Sensors and MEMS/NEMS.

TL;DR: The issues about the big data and human-machine realization for human beings’ manipulation, artificial intelligence (AI) and virtual reality (VR) technologies were finally realized using sensor nodes and its wave identification as future trends for various scenarios.

Post-CMOS Compatible Aluminum Nitride Resonant MEMS Accelerometers.

TL;DR: In this article, a double-ended tuning-fork (DETF) accelerometer is used to measure the acceleration of a single-axis accelerometer with a measured sensitivity of 3.4 Hz/G and resolution of 0.9 mG/radicHz.
Journal ArticleDOI

Acceleration Sensors: Sensing Mechanisms, Emerging Fabrication Strategies, Materials, and Applications

TL;DR: In this article, the most mature sensor technologies with a broad range of applications in multiple fields and industries are discussed, including accelerometers, accelerometers are among the most widely used microelectromechanical system.
Journal ArticleDOI

CMOS-Integrated Aluminum Nitride MEMS: A Review

TL;DR: Aluminum nitride (AlN) has gained wide interest owing to its high values of elastic modulus, band gap, dielectric strength, resistivity, thermal conductivity and acoustic velocities as discussed by the authors .
Journal ArticleDOI

A Resonant Z-Axis Aluminum Nitride Thin-Film Piezoelectric MEMS Accelerometer.

TL;DR: A novel aluminum nitride (AlN) thin-film piezoelectric resonant accelerometer, whose entire structure, including the mass and the springs, is excited to resonate in-plane, and the resonance frequency is sensitive to the out-plane acceleration.
References
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Journal ArticleDOI

Thickness dependence of the properties of highly c-axis textured AlN thin films

TL;DR: In this paper, the influence of film thickness on the material properties of aluminum nitride (AlN) thin films deposited on Pt(111) electrodes has been investigated experimentally by means of x-ray diffraction, dielectric response, atomic force microscopy, interferometry measurement of effective d33, and residual stress measurement.
Journal ArticleDOI

A monolithic three-axis micro-g micromachined silicon capacitive accelerometer

TL;DR: In this paper, a monolithic three-axis micro-g resolution silicon capacitive accelerometer system utilizing a combined surface and bulk micromachining technology is demonstrated, which consists of three individual single-axis accelerometers fabricated in a single substrate using a common fabrication process.
Journal ArticleDOI

A single-crystal silicon symmetrical and decoupled MEMS gyroscope on an insulating substrate

TL;DR: In this paper, a symmetric and decoupled (SYMDEC) gyroscope is implemented using the dissolved wafer microelectromechanical systems (MEMS) process on an insulating substrate.
Journal ArticleDOI

Design, fabrication, and measurement of high-sensitivity piezoelectric microelectromechanical systems accelerometers

TL;DR: In this paper, a microelectromechanical system (MEMS) accelerometer based on piezoelectric lead zirconate titanate (PZT) films with trampoline or annular diaphragm structures was designed, fabricated by bulk micromachining, and tested.
Journal ArticleDOI

Post-CMOS-Compatible Aluminum Nitride Resonant MEMS Accelerometers

TL;DR: In this paper, a double-ended tuning-fork (DETF) accelerometer is used to measure the acceleration of a single-axis accelerometer with a measured sensitivity of 3.4 Hz/G and resolution of 0.9 mG/radicHz.
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